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Resistive Random Access Memory (RRAM) technology holds promises to improve the Field Programmable Gate Array (FPGA) performance, reduce the area footprint, and dramatically lower run-time energy requirements compared to the state-of-the-art CMOS-based products. However, the integration of RRAM in FPGAs is hindered by the high programming power consumption and by non-ideal behaviors of the device due to its stochastic nature that may overshadow the benefits in normal operation mode. To cope with these challenges, optimized programming strategies have to be investigated. In this work, we explore the impact that different procedures to set the device have on the run-time performance. Process, voltage, and temperature (PVT) variations as well as time-dependent drift effect of the RRAM device are considered in the assessment of 4T1R MUX designs characteristics. The comparison with tradition CMOS implementations reveals how the choice of the target resistive state and the programming algorithm are key design aspects to reduce the run-time delay and energy metrics, while at the same time improving the robustness against the different sources of variations.
Resistive random access memory (RRAM)-based hardware accelerators are playing an important role in the implementation of in-memory computing (IMC) systems for artificial intelligence applications. The latter heavily rely on vector-matrix multiplication (VMM) operations that can be efficiently boosted by RRAM devices. However, the stochastic nature of the RRAM technology is still challenging real hardware implementations. To study the accuracy degradation of consecutive VMM operations, in this work we programed two RRAM subarrays composed of 8x8 one-transistor-one-resistor (1T1R) cells following two different distributions of conductive levels. We analyze their robustness against 1000 identical consecutive VMM operations and monitor the inherent devices’ nonidealities along the test. We finally quantize the accuracy loss of the operations in the digital domain and consider the trade-offs between linearly distributing the resistive states of the RRAM cells and their robustness against nonidealities for future implementation of IMC hardware systems.
This work presents a quasi-static electrical characterization of 1-transistor-1-resistor memristive structures designed following hardness-by-design techniques integrated in the CMOS fabrication process to assure multi-level capabilities in harsh radiation environments. Modulating the gate voltage of the enclosed layout transistor connected in series with the memristive device, it was possible to achieve excellent switching capabilities from a single high resistance state to a total of eight different low resistance states (more than 3 bits). Thus, the fabricated devices are suitable for their integration in larger in-memory computing systems and in multi-level memory applications.
Index Terms—radiation-hard, hardness-by-design, memristive
devices, Enclosed Layout Transistor, in-memory computing
Mitigating the Effects of RRAM Process Variation on the Accuracy of Artifical Neural Networks
(2022)
Weight storage is a key challenge in the efficient implementation of artificial neural networks. Novel memory technologies such as RRAM are able to greatly improve density and introduce non-volatility and multibit capabilities to this component of ANN accelerators. The usage of RRAM in this domain comes with downsides, mainly caused by cycle-to-cycle and device-to-device variability leading to erroneous readouts, greatly affecting digital systems. ANNs have the ability to compensate for this by their inherent redundancy and usually exhibit a gradual deterioration in the accuracy of the task at hand. This means, that slight error rates can be acceptable for weight storage in an ANN accelerator. In this work we link device-to-device variability to the accuracy of an ANN for such an accelerator. From this study, we can estimate how strongly a certain net is affected by a certain device parameter variability. This methodology is then used to present three mitigation strategies and to evaluate how they affect the reaction of the network to variability: a) Dropout Layers b) Fault-Aware Training c) Redundancy. These mitigations are then evaluated by their ability to improve accuracy and to lower hardware overhead by providing data for a real-word example. We improved this network’s resilience in such a way that it could tolerate double the variation in one of the device parameters (standard deviation of the oxide thickness can be 0.4 nm instead of 0.2 nm while maintaining sufficient accuracy.)
In-memory computing with resistive-switching random access memory (RRAM) crossbar arrays has the potential to overcome the major bottlenecks faced by digital hardware for data-heavy workloads such as deep learning. However, RRAM devices are subject to several non-idealities that result in significant inference accuracy drops compared with software baseline accuracy. A critical one is related to the drift of the conductance states appearing immediately at the end of program and verify algorithms that are mandatory for accurate
multi-level conductance operation. The support of drift models
in state-of-the-art simulation tools of memristive computationin-memory is currently only in the early stage, since they
overlook key device- and array-level parameters affecting drift
resilience such as the programming algorithm of RRAM cells,
the choice of target conductance states and the weight-toconductance mapping scheme. The goal of this paper is to fully expose these parameters to RRAM crossbar designers as a multi-dimensional optimization space of drift resilience. For this purpose, a simulation framework is developed, which comes with the suitable abstractions to propagate the effects of those RRAM crossbar configuration parameters to their ultimate implications over inference performance stability.