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- Pr2O3 (3)
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Carbide was grown on Si (001) - substrates with supply of C2H2. Investigation of the interface Si/SiC (buffer layer) is essential for optimized preparation conditions, leading to a high quality of the growing SiC crystal. In addition to the lattice mismatch of 20 per cent between Si and SiC, which causes defects like dislocations or stacking faults, the chemical homogeneity of this layer is important. XPS was used to characterize the first state of SiC crystal growth on the Si substrate. Carbonizing with C2H2 leads to surface reactions which build up the buffer layer. By using electron spectroscopy, it was possible to characterize the SiC/Si (001) buffer layer, depending on the following reaction parameters: Tsubstrate , PC2H2 , PH2 , the ratio of pressures and the reaction time. The measurements were performed in terms of the content of carbide, oxide and roughness/etching-efficiency (Profilometer) for the reaction parameters above. We found, that the most critical parameter is the temperature of the substrate (Tsubstrate).
We study the chemical stability and electrical properties of Pr-oxides-SiC MIS stacks. In MISFET devices for high power applications the electric field scaling at the interface between semiconductor and insulator is determined by the ratio of their permittivity values. A high-k material can be used to optimize the performance of such devices. In previous studies we had to understand that the chemical reactivity of the PrOx/SiC interface causes a destructive interaction yielding silicate and graphite formation as well as poor electrical performance after direct deposition of PrOx onto SiC. Therefore we introduced an additional chemically inert layer and in this contribution we focus on PrOx/AlON as a suitable insulator stack. In our spectroscopic investigations we recognized a stable AlON/3C-SiC interface even for annealing steps up to 900∘C. First electrical characterizations are performed on Si substrates and we find a strong improvement in the leakage current by several orders of magnitude down to values of 10−7 A/cm2 at an EOT of 4nm and interface state densities of mean values of 5*1011/eVcm2. We also report on our ongoing electrical characterization of such stacks on SiC substrates. This work is supported by Deutsche Forschungsgemeinschaft within priority program 1157 (DSCH 745/9-2).
Pr2O3 is one of the promising high-k oxides desirable to replace SiO2 for the sub-100nm field-effect transistors (FETs) and dynamic random access memory (DRAM) capacitors. Here we focus on the metallic contacts used for the MOS and MIM based structures. With the thickness of Pr2O3 being around 3nm the metal interaction is crucial to avoid a reduction of the dielectric properties by metal percolation, crack filling or diffusion processes. We use XPS and SRPS to study the initial interaction as well as the thermal stability of metals (Al, Ag, Au, and Ti) on Pr2O3 films. We show that Al, Ag, Au form initial metallic layer which react already at temperatures around 300∘C. In contrast, Ti is found to be more stable than the other metals. We determine the formation of Ti-oxides at the Ti / Pr2O3 interface and its thermal stability. Ti is found to build a good diffusion barrier between the oxide and the metal.