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In situ real-time ellipsometry (irtE) with a very high time resolution of 24 ms was applied to monitor the inductively coupled plasma enhanced atomic layer deposition (ALD) process of Al₂O₃ thin films to precisely resolve each step of the ALD process and its complete cycle. The influence of plasma power, plasma pulse duration, and deposition temperature on the film growth characteristics was investigated. Ex situ ellipsometry [UV-VIS-NIR-SE (ultraviolet-visible-nearinfrared-spectroscopic ellipsometry) and IR-SE (infrared spectroscopic ellipsometry)] and x-ray photoelectron spectroscopy revealed the bulk properties (thickness, refractive index, chemical composition, and carbon incorporation) of the films, which together with the in situ results are compared to those of the films prepared by thermal ALD (T-ALD). The ICPEALD (inductively coupled plasma enhanced ALD) films were deposited at substrate temperatures between 80 and 250 °C and the role of plasma power (50–300 W) and its pulse duration (1–20 s) was investigated at 250 °C. The reference T-ALD layers were prepared at 200 °C. The ICPEALD process of Al₂O₃ shows an increased growth rate, and the produced films exhibit higher carbon contaminations than the T-ALD Al₂O₃ films. Plasma pulse times of up to 15 s further increase the content of carbon and CH species; at the same time, the refractive index decreases. The optical properties of ICPEALD deposited Al₂O₃ films are comparable with those of the T-ALD films for low plasma power and short plasma pulse durations. For the ICPEALD films, UV absorption is found and it is dependent on the deposition parameters. irtE resolves process effects that correlate with the bulk properties of Al₂O₃, such as impurities and oxygen deficiencies.
The band alignment of two large band gap oxides was studied by a combination of XPS and UPS using consecutive sputter steps to unravel the electronic structure and elemental composition of each layer and the interface region. An Al2O3/ZnO heterointerface (10 nm Al2O3 on 59 nm ZnO) was grown on top of a Si single crystal substrate by consecutive thermal and plasma-assisted atomic layer deposition (ALD) respectively. The valence band maximum of Al2O3 was found to be 1.1 eV below that of ZnO, the conduction band minimum 2.3 eV above, resulting in a type-I staggered heterojunction. A reduction of ZnO to elemental Zn in the interface region was detected by the apparent shoulder of the Zn 2p and 2s core levels and by the Zn LMM Auger. This suggests an ALD interface formation mechanism different from previous models identified for other heterointerfaces.
Indium oxide thin films were deposited on Si (100) by plasma-enhanced atomic layer deposition (PEALD) using trimethylindium (TMIn) and oxygen plasma (O2) in a low-temperature range of 80 to 200 °C. The In2O3 layers were characterized by in-situ spectroscopic ellipsometry (SE), ex-situ X-ray photoelectron spectroscopy (XPS) and electrical measurements. The SE data show a growth rate of 0.56 Å/cycle within the ALD window (100 to 150 °C) with a thickness inhomogeneity of ≤1.2%. In addition, the highest refractive index is 2.07 (at 632.8 nm) for the layer grown at 150 °C, and the films exhibit indirect and direct band gaps of 2.8±0.1 eV and 3.3±0.2 eV, respectively. XPS characterization indicates no carbon incorporation and a temperature-dependent off-stoichiometry of the layers. The chemical analysis of the In 3d and O 1s core levels confirms the formation of In-O bonds and suggests the additional presence of hydroxyl groups and defects. With increasing temperature, the contribution of OH groups and defects decreases whereas that of In-O bonds increases. Notably, higher growth temperatures result in an indium rich phase within the layers.
Functional ultra-thin oxide films deposited by atomic layer deposition on structured substrates
(2021)
In the last decades, atomic layer deposition (ALD) has gained prominence in the materials and surface science communities owing to its high potential for integration as a scalable process in microelectronics. ALD's largest strengths are its well-controlled layer-by-layer deposition and growth conformity on 3D structures. Yet, the ALD technique is also well known to lead to amorphous and defective, non-stoichiometric thin films, resulting in modified materials properties that may even preferentially be used in certain applications. To study these issues, we have developed an in-situ ALD reactor attached to an X-ray photoelectron spectroscopy (XPS) system, capable of switching between both pump and flow-type operation. This novel tool allows to cover the entire range of compounds and recipes used in ALD, thus clarifying the role of such defects at different deposition stages, growth conditions and film/substrate interfaces. To exemplify these sorts of studies, we show the deposition of Al2O3 5-10 nm films on nanostructured Si, and their use as substrates for functional CeOx ALD deposits.
A super-cycle approach to atomic layer deposition of indium-gallium-zinc oxide at low temperature
(2023)
The continuing development of multifunctional devices needs novel multicomponent oxide layers, demanding a high control of both composition and thickness during their preparation. To this end, single metal oxides exhibiting high structural quality and conformity have successfully been grown by atomic layer deposition (ALD). However, the deposition of more complex compounds with specific optical and electrical properties is still challenging. In this work, we follow a bottom-up approach to design an ALD super-cycle to grow mixed indium-gallium-zinc oxide (IGZO) films with a controllable composition. For the formation of the individual indium, gallium, and zinc oxides, we found the use of plasma-enhanced ALD (PEALD) at 150 °C to be favorable when using the organometallic precursors trimethylindium, trimethylgallium, and diethylzinc together with oxygen plasma. The PEALD approach of IGZO films can particularly overcome a nucleation delay within the ZnO sub-cycle known from thermal ALD, achieving a higher growth per cycle and improving the quality and composition homogeneity of the films as shown by in-situ spectroscopic ellipsometry and ex-situ X-ray photoelectron spectroscopy.
This work presents a new ultra-high vacuum cluster tool to perform systematic studies of the early growth stages of atomic layer deposited (ALD) ultrathin films following a surface science approach. By combining operando (spectroscopic ellipsometry and quadrupole mass spectrometry) and in situ (X-ray photoelectron spectroscopy) characterization techniques, the cluster allows us to follow the evolution of substrate, film, and reaction intermediates as a function of the total number of ALD cycles, as well as perform a constant diagnosis and evaluation of the ALD process, detecting possible malfunctions that could affect the growth, reproducibility, and conclusions derived from data analysis. The homemade ALD reactor allows the use of multiple precursors and oxidants and its operation under pump and flow-type modes. To illustrate our experimental approach, we revisit the well-known thermal ALD growth of Al2O3 using trimethylaluminum and water. We deeply discuss the role of the metallic Ti thin film substrate at room temperature and 200 °C, highlighting the differences between the heterodeposition (<10 cycles) and the homodeposition (>10 cycles) growth regimes at both conditions. This surface science approach will benefit our understanding of the ALD process, paving the way toward more efficient and controllable manufacturing processes.
This thesis describes low temperature growth of wide band gap metal oxide thin films deposited by thermal (T-) and plasma-enhanced (PE-) atomic layer deposition (ALD) techniques in which high quality materials are grown with atomic level precision.
Metal oxides are extensively investigated due to their exceptional physical and chemical properties, including relatively wide band gap, high dielectric constant and high thermal stability. This variety of properties results in a wide range of different applications. Thin films of indium oxide (InOx), gallium oxide (GaOx), zinc oxide (ZnOx), and quaternary InOx/GaOx/ZnOx (IGZO), in addition to the well-known aluminum oxide (AlOx), and the catalyst cerium oxide (CeOx), have proven to be superior candidates for many applications; from microelectronics and optoelectronics to gas sensor devices. The demanding requirements of low-temperature deposition processes for thermal sensitive substrates, which include high layer homogeneity and conformality over large areas, makes ALD a pioneer deposition technique. Although many oxides have been grown by TALD and PEALD, the deposition of wide band gap oxides at low temperatures are rarely reported and/or being investigated.
In this work, the deposition method of the individual binary oxide films and combining the respective binary processes into the developed super-cycle growth of quaternary compound have been investigated at relatively low-temperatures by TALD and PEALD. Besides, the growth characteristics and chemical properties of the deposited films were evaluated by in-situ and ex-situ characterization techniques such as spectroscopic ellipsometry (SE) and X-ray photoelectron spectroscopy (XPS), where the influence of ALD process parameters on the growth mechanism and films composition are discussed in detail for any potential applications.
Low-temperature growth of gallium oxide thin films by plasma-enhanced atomic layer deposition
(2020)
Gallium oxide (Ga2O3) thin films were deposited by plasma-enhanced atomic layer deposition (PEALD) applying a capacitively coupled plasma source where trimethylgallium (TMGa) as the gallium precursor and oxygen (O2) plasma were used in a substrate temperature (Ts)in the range of 80–200 °C. TMGa exhibits high vapor pressure and therefore facilitates deposition at lower substrate temperatures. The Ga2O3 films were characterized by spectroscopic ellipsometry (SE), x-ray photoelectron spectroscopy (XPS), and capacitance-voltage (C-V) measurements. The SE data show linear thickness evolution with a growth rate of ∼0.66 Å per cycle and inhomogeneity of ≤2% for all samples. The refractive index of the Ga2O3 thin films is 1.86 ± 0.01 (at 632.8 nm) and independent of temperature, whereas the bandgap slightly decreases from 4.68 eV at Ts of 80 °C to 4.57 eV at 200 °C. XPS analysis revealed ideal stoichiometric gallium to oxygen ratios of 2:3 for the Ga2O3 layers with the lowest carbon contribution of ∼10% for the sample prepared at 150 °C. The permittivity of the layers is 9.7 ± 0.2 (at 10 kHz). In addition, fixed and mobile oxide charge densities of 2–4E12 and 1–2E12 cm−2, respectively, were observed in the C-V characteristics. Moreover, the Ga2O3 films show breakdown fields in the range of 2.2–2.7 MV/cm. Excellent optical and electrical material properties are maintained even at low substrate temperatures as low as 80 °C. Hence, the TMGa/O2 PEALD process is suitable for electronic and optoelectronic applications where low-temperature growth is required.
AlN has remarkable properties (wide band gap, low electrical and thermal conductivity, high dielectric constant, piezoelectricity) and is attractive for (opto)electronic and sensor applications. However, high oxygen content within nitride films is always a critical issue due to the thermodynamically favorable oxidation against nitridation resulting in deteriorated materials properties. In order to clarify whether the oxidation is a surface-limited or a bulk process elemental depth profiling is essential. In this work XPS in combination with Ar+ sputtering is applied to carry out depth profiling of AlN films prepared by plasma-enhanced atomic layer deposition using different parameters (plasma source, power and pulse duration). Particularly, the Al2p core levels are analyzed where the signals are decomposed into four components, representing weaker contributions of pure AlN and aluminum oxide phases as well as stronger signals of mixed oxygen-rich and nitrogen-rich phases. After sputtering (providing access to the deeper part of the film) the pure AlN phase content increases while the pure aluminum oxide content stays relatively constant. These issues are discussed with regard to the preparation parameters employed and accompanying XRD and electrical measurements.
Indium oxide (InxOy) thin films were deposited by plasma-enhanced atomic layer deposition (PEALD) using trimethylindium and oxygen plasma in a low-temperature range of 80–200 °C. The optical properties, chemical composition, crystallographic structure, and electrical characteristics of these layers were investigated by spectroscopic ellipsometry (SE), x-ray photoelectron spectroscopy (XPS), x-ray diffraction (XRD), as well as current-voltage and capacitance-voltage measurements. The SE results yielded a nearly constant growth rate of 0.56 Å per cycle and a thickness inhomogeneity of ≤1.2% across 4-in. substrates in the temperature range of 100–150 °C. The refractive index (at 632.8 nm) was found to be 2.07 for the films deposited at 150 °C. The PEALD-InxOy layers exhibit a direct (3.3 ± 0.2 eV) and an indirect (2.8 ± 0.1 eV) bandgap with an uptrend for both with increasing substrate temperature. Based on XPS characterization, all InxOy samples are free of carbon impurities and show a temperature-dependent off-stoichiometry indicating oxygen vacancies. XRD diffraction patterns demonstrate an onset of crystallization at 150 °C. Consistent with the optical, XPS, and XRD data, the films deposited at ≥150 °C possess higher electrical conductivity. Our findings prove that a low-temperature PEALD process of InxOy is feasible and promising for a high-quality thin-film deposition without chemical impurities on thermally fragile substrates.