W-band flip-chip VCO in thin-film environment
- A flip-chip packaging approach for W-band GaAs chips is presented using thin-film structures on silicon as carrier substrate. Reliability investigations indicate that, depending on bump size, the CTE mismatch is not critical and an underfiller does not provide distinctive benefits. A 77 GHz VCO GaAs-HBT MMIC is flip-chip-mounted to demonstrate validity of the packaging scheme.
Author: | Franz-Josef Schmückle, Friedrich LenkGND, M. Hutter, M. Klein, H. Oppermann, G. Engelmann, M. Topper, K. Riepe, Wolfgang Heinrich |
---|---|
DOI: | https://doi.org/10.1109/MWSYM.2005.1516837 |
ISBN: | 0-7803-8845-3 |
Title of the source (English): | 2005 IEEE MTT-S International Microwave Symposium, June 12 - 17, 2005, Long Beach, CA |
Publisher: | IEEE Operations Center |
Place of publication: | Piscataway, NJ |
Document Type: | Conference Proceeding |
Language: | English |
Year of publication: | 2005 |
Faculty/Chair: | Fakultät 3 Maschinenbau, Elektro- und Energiesysteme / FG Nachrichtentechnik |
Institution name at the time of publication: | Fakultät für Ingenieurwissenschaften und Informatik (eHL) / Prof. Nachrichtentechnik |