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Optical Through-Silicon Waveguides for 3D-Chip-Interconnections

  • Integrated optical interconnections in silicon chips have the potential to replace electrical interconnects between integrated circuits thanks to their high bandwidth and low energy communication promises. A silicon dielectric waveguide can be etched through the full thickness of a silicon substrate providing a monolithically integrated solution for 2.5D and 3D photonic architectures. The optical through-silicon waveguide design presented here is based on Finite Difference Time Domain simulations, while the fabrication takes advantage of the innovative plasma cryo-etching process that provides smooth sidewalls and tapering angle tunability. Such structures can provide effective mode size conversion, therefore favoring the coupling of external light sources to photonic integrated circuits and the stacking of multiple optically interconnected dies.

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Metadaten
Author: Francesco Villasmunta, Patrick Steglich, Friedhelm Heinrich, Claus Villringer, Andreas Mai, Sigurd Schrader, Harald SchenkORCiD
URL:https://www.dgao-proceedings.de/abstract/abstract_only.php?id=2920
Document Type:Image (poster)
Language:English
Year of publication:2023
Tag:Integrated Optics; Micro Optics; Optical Information Transmission
Faculty/Chair:Fakultät 1 MINT - Mathematik, Informatik, Physik, Elektro- und Informationstechnik / FG Mikro- und Nanosysteme
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