Numerical Study with Experimental Validation of Thermal Coupling Phenomena with Flip-Chip Assembled Test Dies on PCB
- Numerical Study with Experimental Validation of Thermal Coupling Phenomena with Flip-Chip Assembled Test Dies on PCB.
Author: | Torsten Nowak, Sebastian MerboldORCiD, Christoph EgbersORCiDGND, Ralph SchachtGND |
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DOI: | https://doi.org/10.1109/THERMINIC.2018.8593313 |
ISBN: | 978-1-5386-6759-0 |
ISBN: | 978-1-5386-6760-6 |
ISSN: | 2474-1523 |
ISSN: | 2474-1515 |
Title of the source (English): | 24th INTERNATIONAL WORKSHOP on Thermal Investigations of ICs and Systems, 2018 |
Publisher: | IEEE |
Document Type: | Conference publication peer-reviewed |
Language: | English |
Year of publication: | 2018 |
Tag: | Thermal Coupling, Flip Chip |
Number of pages: | 5 |
Faculty/Chair: | Fakultät 3 Maschinenbau, Elektro- und Energiesysteme / FG Elektronische Schaltungstechnik |