Numerical Simulation of Optical Through-Silicon Waveguide for 3D Photonic Interconnections
- Optical interconnections are a promising step for-ward to overcome the intrinsic limitations of electrical inter-connections in integrated circuits. In this work, we present a finite element method (FEM) simulation study of a dielectric waveguide etched through the full thickness of a silicon substrate. In particular, it is investigated the effect of the bridge-to-core size ratio on the first two supported modes. Then, the influence of the waveguide sidewalls tapering angle on the three-dimensional beam propagation is studied. Such optical through-silicon waveguide (OTSW), if nonadiabatically tapered can provide effective mode size conversion and favour the coupling of external light sources to photonic integrated circuits.
Author: | Harald SchenkORCiD, Francesco Villasmunta, Patrick Steglich, Sigurd Schrader, Andreas Mai |
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URL: | https://ieeexplore.ieee.org/document/9541464 |
DOI: | https://doi.org/10.1109/NUSOD52207.2021.9541464 |
ISBN: | 978-1-6654-1276-6 |
ISBN: | 978-1-6654-4836-9 |
ISSN: | 2158-3242 |
ISSN: | 2158-3234 |
Title of the source (English): | 2021 International Conference on Numerical Simulation of Optoelectronic Devices (NUSOD) |
Publisher: | IEEE |
Document Type: | Conference publication not peer-reviewed |
Language: | English |
Year of publication: | 2021 |
Number of pages: | 2 |
Faculty/Chair: | Fakultät 1 MINT - Mathematik, Informatik, Physik, Elektro- und Informationstechnik / FG Mikro- und Nanosysteme |