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Numerical Simulation of Optical Through-Silicon Waveguide for 3D Photonic Interconnections

  • Optical interconnections are a promising step for-ward to overcome the intrinsic limitations of electrical inter-connections in integrated circuits. In this work, we present a finite element method (FEM) simulation study of a dielectric waveguide etched through the full thickness of a silicon substrate. In particular, it is investigated the effect of the bridge-to-core size ratio on the first two supported modes. Then, the influence of the waveguide sidewalls tapering angle on the three-dimensional beam propagation is studied. Such optical through-silicon waveguide (OTSW), if nonadiabatically tapered can provide effective mode size conversion and favour the coupling of external light sources to photonic integrated circuits.

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Author: Harald SchenkORCiD, Francesco Villasmunta, Patrick Steglich, Sigurd Schrader, Andreas Mai
URL:https://ieeexplore.ieee.org/document/9541464
DOI:https://doi.org/10.1109/NUSOD52207.2021.9541464
ISBN:978-1-6654-1276-6
ISBN:978-1-6654-4836-9
ISSN:2158-3242
ISSN:2158-3234
Title of the source (English):2021 International Conference on Numerical Simulation of Optoelectronic Devices (NUSOD)
Publisher:IEEE
Document Type:Conference publication not peer-reviewed
Language:English
Year of publication:2021
Number of pages:2
Faculty/Chair:Fakultät 1 MINT - Mathematik, Informatik, Physik, Elektro- und Informationstechnik / FG Mikro- und Nanosysteme
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