MetadatenAuthor: | Patrick Hoffmann, Dieter SchmeißerORCiD, Hans-Jürgen Engelmann, Ehrenfried ZschechORCiD, Heiko Stegmann, Franz J. Himpsel, Jonathan D. Denlinger |
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ISBN: | 978-1-55899-870-5 |
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Title of the source (English): | Materials, technology and reliability of low-k dielectrics and copper interconnects, symposium held April 18 - 21, 2006, San Francisco, California |
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Publisher: | Materials Research Society |
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Place of publication: | Warrendale, Pa. |
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Editor: | Ting Y. Tsui |
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Document Type: | Conference Proceeding |
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Language: | English |
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Year of publication: | 2006 |
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First Page: | 55 |
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Last Page: | 62 |
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Series ; volume number: | Materials Research Society symposium proceedings ; 914 |
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Faculty/Chair: | Fakultät 1 MINT - Mathematik, Informatik, Physik, Elektro- und Informationstechnik / FG Angewandte Physik und Halbleiterspektroskopie |
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Institution name at the time of publication: | Fakultät für Mathematik, Naturwissenschaften und Informatik (eBTU) / LS Angewandte Physik / Sensorik |
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