TY - JOUR A1 - Weinzierl, D. T1 - Investigation of Resonance Frequencies in a Crawford Cell Y1 - 2002 ER - TY - JOUR A1 - Geromiller, Hans-Peter A1 - Kost, A. T1 - Numerical calculation of non-TEM-wave field patterns in Crawford-cells JF - The european physical journal Y1 - 2001 SN - 1286-0042 VL - 14 IS - 3 SP - 193 EP - 197 ER - TY - CHAP A1 - Hahn, A. A1 - Kost, A. A1 - Jänicke, Lutz A1 - Miethner, K. T1 - Fields and shielding by eddy currents in perforated boxes T2 - Proceedings, ISTET'01, XI. International Symposium on Theoretical Electrical Engineering, August 19 - 22, 2001, Linz, Austria, Vol. 1 Y1 - 2001 SN - 3-9501491-1-2 SP - 55 EP - 60 CY - Linz ER - TY - CHAP A1 - Igarashi, H. A1 - Watanabe, Noboru A1 - Kost, A. A1 - Honma, T. T1 - Reconstruction of Planar Magnetic Charge Distribution T2 - Proceedings of the Tenth International Symposium on Applied Electromagnetics and Mechanics ISEM - Tokyo, from May 13th through 16th in 2001 Y1 - 2001 SN - 4-931455-08-5 PB - IOS Press CY - Amsterdam [u.a.] ER - TY - CHAP A1 - Jänicke, Lutz A1 - Kost, A. T1 - Efficiency Investigations on Adaptive Mesh Generation Y1 - 2001 ER - TY - THES A1 - Geromiller, Hans-Peter T1 - Entwicklung und Konstruktion einer TEM-Zelle mit gekrümmter Berandung auf der Grundlage von Untersuchungen bestehender TEM-Zellenkonzepte Y1 - 2000 ER - TY - CHAP A1 - Kupnik, Mario A1 - Ho, Min-Chieh A1 - Vaithilingam, Srikant A1 - Khuri-Yakub, Butrus T. T1 - CMUTs for air coupled ultrasound with improved bandwidth T2 - IEEE International Ultrasonics Symposium 2011, Orlando, Florida, USA, October 18-21, 2011 Y1 - 2011 SN - 978-1-4577-1252-4 SN - 978-1-4577-1253-1 SP - 592 EP - 595 PB - IEEE CY - Piscataway, NJ ER - TY - CHAP A1 - Apte, Nikhil A1 - Vaithilingam, Srikant A1 - Sarioglu, Ali Fatih A1 - Kupnik, Mario A1 - Khuri-Yakub, Butrus T. T1 - Large area 1D CMUT phased arrays for multi-modality ultrasound imaging T2 - IEEE International Ultrasonics Symposium 2011, Orlando, Florida, USA, October 18-21, 2011 Y1 - 2011 SN - 978-1-4577-1252-4 SN - 978-1-4577-1253-1 SP - 612 EP - 615 PB - IEEE CY - Piscataway, NJ ER - TY - CHAP A1 - Konetzke, Eric A1 - Rutsch, Matthias A1 - Hoffmann, Maik A1 - Unger, Alexander A1 - Golinske, René A1 - Killat, Dirk A1 - Ramadas, Sivaram Nishal A1 - Dixon, Steve A1 - Kupnik, Mario T1 - Phased array transducer for emitting 40-kHz air-coupled ultrasound without grating lobes T2 - Proceedings, IEEE International Ultrasonics Symposium (IUS), 21 Oct - 24 Oct 2015 Y1 - 2015 U6 - https://doi.org/10.1109/ULTSYM.2015.0019 PB - IEEE ER - TY - CHAP A1 - Unger, Alexander A1 - Hoffmann, Maik A1 - Ho, Min-Chieh A1 - Park, Kwan Kyu A1 - Khuri-Yakub, Butrus T. A1 - Kupnik, Mario T1 - Finite element analysis of mechanically amplified CMUTs T2 - Proceedings, 2013 IEEE International Ultrasonics Symposium N2 - We introduce the possibility of improving a single-cell capacitive micromachined ultrasonic transducer (CMUT) for air-coupled ultrasound by simply adding a hollow conical-shaped structure (horn) on top of the CMUT plate. The main objective is to improve both transmit and receive sensitivity by lowering the center-to-average displacement ratio, which for bending plate operated devices inherently is limited. In addition, for receive mode the force generated from the impinging sound pressure wave is concentrated to the center of the plate, resulting in larger signals and, in contrast to piston-shaped plates, the horn has the advantage of only moderately increasing the modal mass of the structure. By using finite element analysis and first sound pressure measurements of our modified CMUT, we demonstrate that this idea is feasible and promising for air-coupled CMUTs operating at frequencies below 150kHz, as it has been been proven to be successful for commercially available piezoelectric - driven bending plate devices as well. Y1 - 2013 U6 - https://doi.org/10.1109/ULTSYM.2013.0074 SP - 287 EP - 290 PB - IEEE ER - TY - CHAP A1 - Hoffmann, Maik A1 - Unger, Alexander A1 - Ho, Min-Chieh A1 - Park, Kwan Kyu A1 - Khuri-Yakub, Butrus T. A1 - Kupnik, Mario T1 - Volumetric characterization of ultrasonic transducers for gas flow metering T2 - Proceedings, 2013 IEEE International Ultrasonics Symposium N2 - The design of ultrasonic gas flowmeters requires a thorough three dimensional characterization of the acoustic sound field. For large pipe flowmeters, such as used for flare gas metering, the transducers are operated at frequencies ranging from 20 kHz up to 150 kHz. Thus, in this work we use a commercially available calibrated 1/8-inch microphone, mounted on a 3D positioning system for performing volumetric measurements in a volume of up to 1x1x1 m. By using proper corrections in terms of angular and free-field response of the microphone, the measurement system is efficient and delivers around 30000 measurements in about only eight hours. The data then is visualized in form of 3D figures or various slices to extract all relevant information. The system has been used to identify non-uniform velocity profiles in capacitive micromachined ultrasonic transducers (CMUTs), operating in permanent contact mode. Further, the system can be used to investigate the effect of various acoustic boundary conditions the transducers are facing when mounted inside transducer port cavities and it can be used for general model validation purpose. Y1 - 2013 U6 - https://doi.org/10.1109/ULTSYM.2013.0336 SP - 1315 EP - 1318 PB - IEEE ER - TY - CHAP A1 - Ho, Min-Chieh A1 - Park, Kwan Kyu A1 - Eckhoff, Kristian A1 - Kupnik, Mario A1 - Khuri-Yakub, Butrus T. T1 - Air-coupled CMUTs operating at ambient pressures ranging from 1 to 20 atm T2 - Proceedings, 2013 IEEE International Ultrasonics Symposium N2 - We present impedance and pitch-catch measurements of capacitive micromachined ultrasonic transducers (CMUTs) in permanent contact mode with improved mechanical strength that demonstrate functionality up to 20 atm ambient pressure. Changes in device design and fabrication are made to improve the mechanical strength of the CMUT plates, including using smaller deflection to thickness ratio (9 – 33%), choosing better quality SOI wafers (bowing < 20 μm), and designing a much larger bonding area (300 – 700 μm overlap in radial direction) for each cell. As a result, all designs with 2000 μm radius, 65-μm-thick plates, 7.74 μm gap heights and with 300, 500, and 700 μm wide bonding area overlap for the plate, performed from 1 – 20 atm without a single failure. Despite larger bonding area, pitch-catch measurements with these CMUTs (700 μm bonding width biased at 250 Vdc still give received signal with good SNR even at 20 atm. Our results support that such CMUTs are reliable and efficient over a wide pressure range. Y1 - 2013 U6 - https://doi.org/10.1109/ULTSYM.2013.0358 SP - 1412 EP - 1415 PB - IEEE ER - TY - CHAP A1 - Golinske, René A1 - Hoffmann, Maik A1 - Gupta, Abhinav A1 - Kupnik, Mario T1 - Calculation of diffraction loss between non-co-axial ultrasonic transducer configurations T2 - Proceedings, 2013 IEEE International Ultrasonics Symposium N2 - We derive and validate a quadruple integral expression for calculating the diffraction loss in an isotropic propagation medium between circular ultrasonic transducers with time-harmonic radiation. The distinctive feature is the generic non-coaxial configuration with arbitrary transducer size and orientation. By performing several measurements, we validate the integral expression and we demonstrate that nowadays it is feasible to perform the required numerical integration to obtain the diffraction loss over an entire volumetric sound pressure field on a state-of-the-art personal computer with reasonable computation time on the order of a few minutes only. Excellent agreement between calculated results and experiments prove the approach and the generic nature of our expression ensures its wide and simple applicability for efficient diffraction loss calculations. Y1 - 2013 U6 - https://doi.org/10.1109/ULTSYM.2013.0555 SP - 2171 EP - 2174 ER - TY - GEN A1 - Sarioglu, Ali Fatih A1 - Kupnik, Mario A1 - Vaithilingam, Srikant A1 - Khuri-Yakub, Butrus T. T1 - Nanoscale topography of thermally-grown oxide films at right-angled convex corners of silicon T2 - Journal of The Electrochemical Society Y1 - 2012 U6 - https://doi.org/10.1149/2.005202jes SN - 0013-4651 VL - 159 IS - 2 SP - 79 EP - 84 ER - TY - PAT A1 - Kupnik, Mario A1 - Khuri-Yakub, Butrus T. T1 - Monolithic integrated CMUTs fabricated by low temperature wafer bonding N2 - Low temperature wafer bonding (temperature of 450°C. or less) is employed to fabricate CMUTs on a wafer that already includes active electrical devices. The resulting structures are CMUT arrays integrated with active electronics by a low-temperature wafer bonding process.The use of a low-temperature process preserves the electronics during CMUT fabrication. With this approach, it is not necessary to make compromises in the CMUT or electronics designs, as is typical of the sacrificial release, such as low process control, poor design flexibility, low reproducibility, and reduced performance are avoided with the present approach. With this approach, a CMUT array can be provided with per-cell electrodes connected to the substrate integrated circuitry. This enables complete flexibility in electronically assigning the CMUT cells to CMUT array elements. Y1 - 2013 ER - TY - GEN A1 - Lee, Hyunjoo J. A1 - Park, Kwan Kyu A1 - Kupnik, Mario A1 - Khuri-Yakub, Butrus T. T1 - Functionalization layers for CO2 sensing using capacitive micromachined ultrasonic transducers T2 - Sensors and Actuators B: Chemical N2 - Sensing of carbon dioxide(CO2)using inexpensive, miniaturized,and highly sensitive sensors is of great interest for environmental and consumer applications. In this paper, we present four functionalization layers that are suitable for resonant sensors based on mass-loading for CO2 detection. We compare the volume sensitivities of these layers to CO2 and relative humidity (RH) by using a highly sensitive 50-MHz capacitive micromachined ultrasonic transducer (CMUT) as a resonant sensor. Among the four function-alization layers, the layer based on a guanidine polymer exhibits the highest volume sensitivity to CO2 of 1.0 ppm/Hz in N2 and 3.8 ppm/Hz in air (∼45%RH). Furthermore, we report on other important characteristics of the guanidine polymer for sensing applications, including polymer saturation, regeneration, and repeatability. Y1 - 2012 SN - 0925-4005 IS - 174 SP - 87 EP - 93 ER - TY - GEN A1 - Lee, Hyunjoo J. A1 - Park, Kwan Kyu A1 - Kupnik, Mario A1 - Melosh, Nicholas A. A1 - Khuri-Yakub, Butrus T. T1 - Mesoporous thin-film on highly sensitive resonant chemical sensors for relative humidity and CO2 detection T2 - Analytical Chemistry N2 - Distributed sensing of gas-phase chemicals is a promising application for mesoporous materials when combined with highly sensitive miniaturized gas sensors. We present a direct application of a mesoporous silica thin film on a highly sensitive miniaturized resonant chemical sensor with a mass sensitivity at the zeptogram scale for relative humidity and CO2 detection. Using mesoporous silica thin-film, we report one of the lowest volume resolutions and a sensitive detection of 5.1 × 10–4% RH/Hz to water vapor in N2, which is 70 times higher than a device with a nontemplated silica layer. In addition, a mesoporous thin-film that is functionalized with an amino-group is directly applied on the resonant sensor, which exhibits a volume sensitivity of 1.6 × 10–4%/Hz and a volume resolution of 1.82 × 10–4% to CO2 in N2. Y1 - 2012 U6 - https://doi.org/10.1021/ac300225c SN - 1520-6882 VL - 84 IS - 7 SP - 3063 EP - 3066 ER - TY - PAT A1 - Kupnik, Mario A1 - Khuri-Yakub, Butrus T. T1 - Sensor for measuring properties of liquids and gases N2 - The present invention provides a device that measures at least one property of the liquid or gas, where the invention is a CMUT sensor that includes a substrate, a first layer disposed on the substrate, where the first layer includes a cavity, and a compound plate, where the compound plated includes a bottom plate, an intermediate plate and a top plate. According to the invention, the intermediate plate has at least one sample inlet, a sample cavity and at least one sample outlet, where the bottom plate is disposed on the first layer, and the cavity in the first layer is sealed by the compound plate. The cavity in the first layer can be a vacuum or contain a gas. The CMUT sensor can be disposed in an array of two or more sensors and connected electrically in parallel. Y1 - 2012 ER - TY - CHAP A1 - Ho, Min-Chieh A1 - Kupnik, Mario A1 - Park, Kwan Kyu A1 - Eckhoff, Kristian A1 - Khuri-Yakub, Butrus T. T1 - Wide pressure range operation of air-coupled CMUTs T2 - IEEE International Ultrasonics Symposium, Dresden, Germany, 7 - 10 October 2012 N2 - We present measurement results of capacitive micromachined ultrasonic transducers (CMUTs)in permanent contact mode over a wide pressure range(1 – 8 atm). The CMUT plates are in contact with the bottom of the cavities due to atmospheric pressure, even without any dc bias voltage. The electrical input impedance at various dc bias voltages are measured at elevated pressure to characterize individual devices. The open and short circuit resonant frequencies are extracted from the impedance data, and the acoustic performance of pairs of devices is evaluated by performing pitch-catch measurements. A frequency matching method is proposed and used to determine the optimal dc bias voltages for the transmitting and receiving CMUTs individually. Our electrical impedance results show good agreement with the finite element model results (modal and harmonic analysis performed with ANSYS) over the entire pressure range. Moreover, the pitch-catch measurement results validate the proposed frequency matching method for an optimal biasing scheme, and a received signal with good signal-to-noise ratio of 45 dB was observed at a pressure of 7 atm. In conclusion, the behavior of CMUTs in permanent contact mode can be predicted well with our FEA, and they are indeed a promising solution in providing ultrasonic transducers that can operate over a wide pressure range. Y1 - 2012 SN - 978-1-4673-4561-3 U6 - https://doi.org/10.1109/ULTSYM.2012.0023 SP - 93 EP - 96 PB - IEEE CY - Piscataway, NJ ER - TY - CHAP A1 - Ho, Min-Chieh A1 - Kupnik, Mario A1 - Park, Kwan Kyu A1 - Khuri-Yakub, Butrus T. T1 - Long-term measurement results of pre-charged CMUTs with zero external bias operation T2 - IEEE International Ultrasonics Symposium, Dresden, Germany, 7 - 10 October 2012 N2 - We present long-term measurement results (<1.5 years) of CMUTs, which have been pre-charged for zero external bias operation. The fabrication is based on a direct wafer bonding process with a thick-buried-oxide-layer, which allows the realization of only partially connected, donut-shaped bottom electrodes. The only partially connected bottom electrode has a central portion that is completely encapsulated by 3-μm-thick thermally-grown silicon dioxide, and, thus, electrically floating. The devices are pre-charged by applying a dc voltage higher than the pull-in voltage, which injects charges into the electrically floating portion and creates a sufficiently strong intrinsic electric field in the gap. Measurements of resonant frequency at various bias voltages show that the charges have completely remained in the floating portion for the last 19 months. We prove the zero-external-bias operations with the pre-charged CMUTs by measuring the electrical input impedance, the ac signal displacement, and pitch-catch measurements under zero external dc bias voltage. Our results show that pre-charging CMUTs is feasible, and that the devices are capable of long-term, zero external bias voltage operation. Y1 - 2012 SN - 978-1-4673-4561-3 U6 - https://doi.org/10.1109/ULTSYM.2012.0022 SP - 89 EP - 92 PB - IEEE CY - Piscataway, NJ ER - TY - GEN A1 - Park, Kwan Kyu A1 - Lee, Hyunjoo J. A1 - Kupnik, Mario A1 - Oralkan, Ömer A1 - Ramseyer, Jean-Pierre A1 - Lang, Hans Peter A1 - Hegner, Martin A1 - Gerber, Christoph A1 - Khuri-Yakub, Butrus T. T1 - Capacitive micromachined ultrasonic transducer (CMUT) as a chemical sensor for DMMP detection T2 - Sensors and Actuators B: Chemical Y1 - 2011 U6 - https://doi.org/10.1016/j.snb.2011.09.036 SN - 0925-4005 VL - 160 IS - 1 SP - 1120 EP - 1127 ER - TY - CHAP A1 - Kupnik, Mario A1 - Cunningham, Shawn J. T1 - Chapter wafer bonding in MEMS materials and process handbook N2 - Wafer bonding is an integral part of the fabrication of MEMS, optoelectronics, and heterogeneous wafer stacks, including silicon-on-insulator. Wafer bonding can be divided into two technological groups: direct bonding and intermediate layer bonding. Direct bonding relies on the cohesive bond that is formed when the surfaces of two wafers are brought together under specific temperature and pressure conditions. Direct bonding relies on critical parameters such as surface energy, surface roughness, and surface morphology. Intermediate layer bonding relies on the cohesive bond that is formed when the surfaces of two wafers are mated with an intermediate layer. The intermediate layer can be an adhesive, polymer, solder, glass frit, or metal. Surface roughness and topography are less critical for bonding with an intermediate layer. Wafer bonding has found application in MEMS to fabricate MEMS devices, to encapsulate the MEMS device in an hermetic environment, and to transfer bond a complete MEMS device to a wafer with integrated circuits. Wafer bonding has found its earliest applications for pressure sensors and accelerometers, but the applications remain boundless. KW - wafer bonding KW - microfabrication Y1 - 2011 UR - http://www.springerlink.com/content/pukq62673543q611/ ER - TY - GEN A1 - Park, Kwan Kyu A1 - Lee, Hyunjoo J. A1 - Kupnik, Mario A1 - Khuri-Yakub, Butrus T. T1 - Fabrication of capacitive micromachined ultrasonic transducers via local oxidation and direct wafer bonding T2 - Journal of Microelectromechanical Systems Y1 - 2011 U6 - https://doi.org/10.1109/JMEMS.2010.2093567 SN - 1941-0158 VL - 20 IS - 1 SP - 95 EP - 103 ER - TY - GEN A1 - Lee, Hyunjoo J. A1 - Park, Kwan Kyu A1 - Kupnik, Mario A1 - Oralkan, Ömer A1 - Khuri-Yakub, Butrus T. T1 - Chemical vapor detection using a capacitive micromachined ultrasonic transducer T2 - Analytical chemistry Y1 - 2011 U6 - https://doi.org/10.1021/ac201626b SN - 1520-6882 VL - 83 IS - 24 SP - 9314 EP - 9320 ER - TY - PAT A1 - Kupnik, Mario A1 - Khuri-Yakub, Butrus T. T1 - Monolithic integrated CMUTs fabricated by low temperature wafer bonding Y1 - 2010 UR - https://www.google.ch/patents/US20100225200?hl=de&cl=en ER - TY - PAT A1 - Kupnik, Mario A1 - Khuri-Yakub, Butrus T. T1 - High-temperature electrostatic transducers and fabrication method Y1 - 2010 UR - http://www.google.com.na/patents/US7843022 ER - TY - CHAP A1 - Ho, Min-Chieh A1 - Kupnik, Mario A1 - Vaithilingam, Srikant A1 - Khuri-Yakub, Butrus T. T1 - Fabrication and model validation for CMUTs operated in permanent contact mode T2 - IEEE International Ultrasonics Symposium 2011, Orlando, Florida, USA, October 18-21, 2011 Y1 - 2011 SN - 978-1-4577-1252-4 SN - 978-1-4577-1253-1 SP - 1016 EP - 1019 PB - IEEE CY - Piscataway, NJ ER - TY - CHAP A1 - Ho, Min-Chieh A1 - Kupnik, Mario A1 - Khuri-Yakub, Butrus T. T1 - FEA of CMUTs suitable for wide gas pressure range applications T2 - 2010 IEEE International Ultrasonics Symposium (IUS 2010), San Diego, California, USA, 11 - 14 October 2010, vol. 2 Y1 - 2010 SP - 1234 EP - 1237 PB - IEEE CY - Piscataway, NJ ER - TY - GEN A1 - Wong, Serena H. A1 - Kupnik, Mario A1 - Watkins, Ronald D. A1 - Butts-Pauly, Kim A1 - Khuri-Yakub, Butrus T. T1 - Capacitive micromachined ultrasonic transducers for therapeutic ultrasound applications T2 - IEEE transactions on bio-medical electronics Y1 - 2010 SN - 0018-9294 VL - 57 IS - 1 SP - 114 EP - 123 ER - TY - GEN A1 - Lin, Der-Song A1 - Zhuang, Xuefeng A1 - Wong, Serena H. A1 - Kupnik, Mario A1 - Khuri-Yakub, Butrus T. T1 - Encapsulation of Capacitive Micromachined Ultrasonic Transducers Using Viscoelastic Polymer T2 - Journal of Microelectromechanical Systems Y1 - 2010 U6 - https://doi.org/10.1109/JMEMS.2010.2076786 SN - 1941-0158 VL - 19 IS - 6 SP - 1341 EP - 1351 ER - TY - PAT A1 - Kupnik, Mario A1 - Khuri-Yakub, Butrus T. T1 - Direct wafer-bonded 2D CMUT array Y1 - 2010 UR - https://www.google.com/patents/US7846102 ER - TY - CHAP A1 - Yoon, Hyo-Seon A1 - Ho, Min-Chieh A1 - Apte, Nikhil A1 - Cristman, Paul A1 - Vaithilingam, Srikant A1 - Kupnik, Mario A1 - Butts-Pauly, Kim A1 - Khuri-Yakub, Butrus T. T1 - Fabrication of CMUT cells with gold center mass for higher output pressure T2 - 10th International Symposium on Therapeutic Ultrasound, ISTU 2010, Tokyo, Japan, 9 - 12 June 2010 Y1 - 2010 SN - 978-0-7354-0917-0 SP - 183 EP - 188 PB - American Inst. of Physics CY - Melville, NY ER - TY - CHAP A1 - Kupnik, Mario A1 - Vaithilingam, Srikant A1 - Torashima, Kazutoshi A1 - Wygant, Ira O. A1 - Khuri-Yakub, Butrus T. T1 - CMUT fabrication based on a thick buried oxide layer T2 - IEEE International Ultrasonics Symposium proceedings Y1 - 2010 SN - 978-1-4577-0381-2 SP - 547 EP - 550 PB - IEEE CY - Piscataway, NJ ER - TY - CHAP A1 - Lee, Hyunjoo J. A1 - Park, Kwan Kyu A1 - Kupnik, Mario A1 - Oralkan, Ömer A1 - Khuri-Yakub, Butrus T. T1 - Highly sensitive detection of DMMP using a CMUT chemical sensor T2 - 2010 IEEE sensors, Waikoloa, Hawaii, USA, 1 - 4 November 2010, the Ninth IEEE Sensors Conference 2010 Y1 - 2010 SN - 978-1-4244-8168-2 U6 - https://doi.org/10.1109/ICSENS.2010.5690493 SP - 2122 EP - 2126 PB - IEEE CY - Piscataway, NJ ER - TY - CHAP A1 - Bäck, David A1 - Oralkan, Ömer A1 - Kupnik, Mario A1 - Willatzen, Morten A1 - Khuri-Yakub, Butrus T. A1 - Jensen, Jorgen Arendt T1 - Simulating Capacitive Micromachined Ultrasonic Transducers (CMUTs) using Field II T2 - IEEE Ultrasonics Symposium, San Diego, California, 2010 Y1 - 2010 SN - 978-1-4577-0381-2 SP - 439 EP - 442 PB - IEEE CY - Piscataway, NJ ER - TY - CHAP A1 - Lin, Der-Song A1 - Zhuang, Xuefeng A1 - Wodnicki, Robert A1 - Woychik, Charles. G. A1 - Oralkan, Ömer A1 - Kupnik, Mario A1 - Khuri-Yakub, Butrus T. T1 - Packaging of large and low-pitch size 2D ultrasonic transducer arrays T2 - IEEE 23rd International Conference on Micro Electro Mechanical Systems (MEMS), 2010 Y1 - 2010 SN - 978-1-424-45761-8 SN - 978-1-4244-5763-2 SP - 508 EP - 511 PB - IEEE CY - Piscataway, NJ ER - TY - CHAP A1 - Wygant, Ira O. A1 - Kupnik, Mario A1 - Khuri-Yakub, Butrus T. T1 - Design, Fabrication, and Design Verification of 50-kHz CMUTs for High-Intensity Airborne Ultrasound T2 - 20th International Congress on Acoustics 2010 (ICA 2010), Sydney, Australia, 23 - 27 August 2010, Vol. 2 Y1 - 2010 PB - Curran CY - Red Hook, NY ER - TY - CHAP A1 - Wygant, Ira O. A1 - Kupnik, Mario A1 - Khuri-Yakub, Butrus T. T1 - Deriving a simulation model of a single 40-kHz CMUT cell from impedance and interferometer measurements Y1 - 2010 ER - TY - JOUR A1 - Kost, A. A1 - Bastos, J. P. A. A1 - Miethner, K. A1 - Jänicke, Lutz T1 - Improvement of Nonlinear Impedance Boundary Conditions Y1 - 2002 ER - TY - JOUR A1 - Koltermann, P. I. A1 - Bastos, J. P. A. A1 - Sadowski, N. A1 - Batistela, N. J. A1 - Kost, A. A1 - Jänicke, Lutz A1 - Miethner, K. T1 - Non-linear Magnetic Field Model by FEM taking into account Hysteresis characteristics with M-B variables Y1 - 2002 ER - TY - JOUR A1 - Jänicke, Lutz A1 - Kost, A. T1 - Efficiency Properties of Adaptive Mesh Generation Y1 - 2002 ER - TY - CHAP A1 - Park, Kwan Kyu A1 - Kupnik, Mario A1 - Lee, Hyunjoo J. A1 - Oralkan, Ömer A1 - Khuri-Yakub, Butrus T. T1 - Zero-bias resonant sensor with an oxide-nitride layer as charge trap T2 - 2010 IEEE sensors, Waikoloa, Hawaii, USA, 1 - 4 November 2010 Y1 - 2010 SN - 978-1-4244-8168-2 SP - 1024 EP - 1028 PB - IEEE CY - Piscataway, NJ ER - TY - CHAP A1 - Tsuji, Yukihide A1 - Kupnik, Mario A1 - Khuri-Yakub, Butrus T. T1 - Low temperature process for CMUT fabrication with wafer bonding technique T2 - 2010 IEEE International Ultrasonics Symposium (IUS 2010), San Diego, California, USA, 11 - 14 October 2010 Y1 - 2010 SN - 978-1-4577-0381-2 SP - 551 EP - 554 PB - IEEE CY - Piscataway, NJ ER - TY - GEN A1 - Kpogli, K. A1 - Kost, A. T1 - Local error estimation and strategic mesh generation for time-dependent problems in electromagnetics coupled with heat conduction T2 - IEEE Transactions on Magnetics Y1 - 2003 SN - 0018-9464 VL - 39 IS - 3 SP - 1701 EP - 1704 ER - TY - CHAP A1 - Park, Kwan Kyu A1 - Kupnik, Mario A1 - Lee, Hyunjoo J. A1 - Khuri-Yakub, Butrus T. T1 - Modeling CMUT of multi-cell configuration T2 - IEEE Ultrasonics Symposium (IUS), 2010, 11 - 14 Oct. 2010, Town & Country Inn & Convention Center, San Diego Y1 - 2010 SN - 978-1-4577-0381-2 SP - 431 EP - 434 PB - IEEE CY - Piscataway, NJ ER - TY - CHAP A1 - Kost, A. T1 - The Need of Computational Electromagnetics for Solving Problems in EMC and Antenna Design T2 - The Fourth International Conference on Computation in Electromagnetics, CEM 2002, 8 - 11 April 2002, the Cumberland Hotel, Bournemouth, UK Y1 - 2002 PB - IEE CY - London ER - TY - JOUR A1 - Weinzierl, D. T1 - Simulation of Mode Stirred Chambers Excited by Wires using TLM Method Y1 - 2002 ER - TY - CHAP A1 - Hahn, A. A1 - Kost, A. T1 - Comparison of Fields and Shielding in Perforated Aluminium and Steel Boxes T2 - Selected papers from the Tenth Biennial IEEE Conference on Electromagnetic Field Computation (CEFC '02), Perugia University, Perugia, Italy, June 16 - 19, 2002 Y1 - 2002 PB - IEEE Magnetics Soc. CY - Piscataway ER - TY - CHAP A1 - Kost, A. T1 - Solving Problems in Electromagnetic Compatibility by Different Methods of Computational Electromagnetics Y1 - 2002 ER -