TY - GEN A1 - Park, Kwan Kyu A1 - Lee, Hyunjoo J. A1 - Kupnik, Mario A1 - Oralkan, Ömer A1 - Ramseyer, Jean-Pierre A1 - Lang, Hans Peter A1 - Hegner, Martin A1 - Gerber, Christoph A1 - Khuri-Yakub, Butrus T. T1 - Capacitive micromachined ultrasonic transducer (CMUT) as a chemical sensor for DMMP detection T2 - Sensors and Actuators B: Chemical Y1 - 2011 U6 - https://doi.org/10.1016/j.snb.2011.09.036 SN - 0925-4005 VL - 160 IS - 1 SP - 1120 EP - 1127 ER - TY - CHAP A1 - Kupnik, Mario A1 - Cunningham, Shawn J. T1 - Chapter wafer bonding in MEMS materials and process handbook N2 - Wafer bonding is an integral part of the fabrication of MEMS, optoelectronics, and heterogeneous wafer stacks, including silicon-on-insulator. Wafer bonding can be divided into two technological groups: direct bonding and intermediate layer bonding. Direct bonding relies on the cohesive bond that is formed when the surfaces of two wafers are brought together under specific temperature and pressure conditions. Direct bonding relies on critical parameters such as surface energy, surface roughness, and surface morphology. Intermediate layer bonding relies on the cohesive bond that is formed when the surfaces of two wafers are mated with an intermediate layer. The intermediate layer can be an adhesive, polymer, solder, glass frit, or metal. Surface roughness and topography are less critical for bonding with an intermediate layer. Wafer bonding has found application in MEMS to fabricate MEMS devices, to encapsulate the MEMS device in an hermetic environment, and to transfer bond a complete MEMS device to a wafer with integrated circuits. Wafer bonding has found its earliest applications for pressure sensors and accelerometers, but the applications remain boundless. KW - wafer bonding KW - microfabrication Y1 - 2011 UR - http://www.springerlink.com/content/pukq62673543q611/ ER - TY - GEN A1 - Park, Kwan Kyu A1 - Lee, Hyunjoo J. A1 - Kupnik, Mario A1 - Khuri-Yakub, Butrus T. T1 - Fabrication of capacitive micromachined ultrasonic transducers via local oxidation and direct wafer bonding T2 - Journal of Microelectromechanical Systems Y1 - 2011 U6 - https://doi.org/10.1109/JMEMS.2010.2093567 SN - 1941-0158 VL - 20 IS - 1 SP - 95 EP - 103 ER - TY - GEN A1 - Lee, Hyunjoo J. A1 - Park, Kwan Kyu A1 - Kupnik, Mario A1 - Oralkan, Ömer A1 - Khuri-Yakub, Butrus T. T1 - Chemical vapor detection using a capacitive micromachined ultrasonic transducer T2 - Analytical chemistry Y1 - 2011 U6 - https://doi.org/10.1021/ac201626b SN - 1520-6882 VL - 83 IS - 24 SP - 9314 EP - 9320 ER - TY - PAT A1 - Kupnik, Mario A1 - Khuri-Yakub, Butrus T. T1 - Monolithic integrated CMUTs fabricated by low temperature wafer bonding Y1 - 2010 UR - https://www.google.ch/patents/US20100225200?hl=de&cl=en ER - TY - PAT A1 - Kupnik, Mario A1 - Khuri-Yakub, Butrus T. T1 - High-temperature electrostatic transducers and fabrication method Y1 - 2010 UR - http://www.google.com.na/patents/US7843022 ER - TY - CHAP A1 - Ho, Min-Chieh A1 - Kupnik, Mario A1 - Vaithilingam, Srikant A1 - Khuri-Yakub, Butrus T. T1 - Fabrication and model validation for CMUTs operated in permanent contact mode T2 - IEEE International Ultrasonics Symposium 2011, Orlando, Florida, USA, October 18-21, 2011 Y1 - 2011 SN - 978-1-4577-1252-4 SN - 978-1-4577-1253-1 SP - 1016 EP - 1019 PB - IEEE CY - Piscataway, NJ ER - TY - CHAP A1 - Ho, Min-Chieh A1 - Kupnik, Mario A1 - Khuri-Yakub, Butrus T. T1 - FEA of CMUTs suitable for wide gas pressure range applications T2 - 2010 IEEE International Ultrasonics Symposium (IUS 2010), San Diego, California, USA, 11 - 14 October 2010, vol. 2 Y1 - 2010 SP - 1234 EP - 1237 PB - IEEE CY - Piscataway, NJ ER - TY - GEN A1 - Wong, Serena H. A1 - Kupnik, Mario A1 - Watkins, Ronald D. A1 - Butts-Pauly, Kim A1 - Khuri-Yakub, Butrus T. T1 - Capacitive micromachined ultrasonic transducers for therapeutic ultrasound applications T2 - IEEE transactions on bio-medical electronics Y1 - 2010 SN - 0018-9294 VL - 57 IS - 1 SP - 114 EP - 123 ER - TY - GEN A1 - Lin, Der-Song A1 - Zhuang, Xuefeng A1 - Wong, Serena H. A1 - Kupnik, Mario A1 - Khuri-Yakub, Butrus T. T1 - Encapsulation of Capacitive Micromachined Ultrasonic Transducers Using Viscoelastic Polymer T2 - Journal of Microelectromechanical Systems Y1 - 2010 U6 - https://doi.org/10.1109/JMEMS.2010.2076786 SN - 1941-0158 VL - 19 IS - 6 SP - 1341 EP - 1351 ER -