TY - GEN A1 - Lin, Der-Song A1 - Zhuang, Xuefeng A1 - Wong, Serena H. A1 - Kupnik, Mario A1 - Khuri-Yakub, Butrus T. T1 - Encapsulation of Capacitive Micromachined Ultrasonic Transducers Using Viscoelastic Polymer T2 - Journal of Microelectromechanical Systems Y1 - 2010 U6 - https://doi.org/10.1109/JMEMS.2010.2076786 SN - 1941-0158 VL - 19 IS - 6 SP - 1341 EP - 1351 ER - TY - CHAP A1 - Lin, Der-Song A1 - Zhuang, Xuefeng A1 - Wodnicki, Robert A1 - Woychik, Charles. G. A1 - Oralkan, Ă–mer A1 - Kupnik, Mario A1 - Khuri-Yakub, Butrus T. T1 - Packaging of large and low-pitch size 2D ultrasonic transducer arrays T2 - IEEE 23rd International Conference on Micro Electro Mechanical Systems (MEMS), 2010 Y1 - 2010 SN - 978-1-424-45761-8 SN - 978-1-4244-5763-2 SP - 508 EP - 511 PB - IEEE CY - Piscataway, NJ ER -