TY - GEN A1 - Hayat, Ahsan A1 - Ratzke, Markus A1 - Alvarado Chavarin, Carlos A1 - Zöllner, Marvin Hartwig A1 - Corley-Wiciak, Agnieszka Anna A1 - Schubert, Markus Andreas A1 - Wenger, Christian A1 - Fischer, Inga Anita T1 - Structural and morphological properties of CeO2 films deposited by radio frequency magnetron sputtering for back-end-of-line integration T2 - Thin Solid Films Y1 - 2024 U6 - https://doi.org/10.1016/j.tsf.2024.140547 SN - 0040-6090 VL - 807 ER - TY - GEN A1 - Fritscher, Markus A1 - Singh, Simranjeet A1 - Rizzi, Tommaso A1 - Baroni, Andrea A1 - Reiser, Daniel A1 - Mallah, Maen A1 - Hartmann, David A1 - Bende, Ankit A1 - Kempen, Tim A1 - Uhlmann, Max A1 - Kahmen, Gerhard A1 - Fey, Dietmar A1 - Rana, Vikas A1 - Menzel, Stephan A1 - Reichenbach, Marc A1 - Krstic, Milos A1 - Merchant, Farhad A1 - Wenger, Christian T1 - A flexible and fast digital twin for RRAM systems applied for training resilient neural networks T2 - Scientific Reports N2 - Resistive Random Access Memory (RRAM) has gained considerable momentum due to its non-volatility and energy efficiency. Material and device scientists have been proposing novel material stacks that can mimic the “ideal memristor” which can deliver performance, energy efficiency, reliability and accuracy. However, designing RRAM-based systems is challenging. Engineering a new material stack, designing a device, and experimenting takes significant time for material and device researchers. Furthermore, the acceptability of the device is ultimately decided at the system level. We see a gap here where there is a need for facilitating material and device researchers with a “push button” modeling framework that allows to evaluate the efficacy of the device at system level during early device design stages. Speed, accuracy, and adaptability are the fundamental requirements of this modelling framework. In this paper, we propose a digital twin (DT)-like modeling framework that automatically creates RRAM device models from device measurement data. Furthermore, the model incorporates the peripheral circuit to ensure accurate energy and performance evaluations. We demonstrate the DT generation and DT usage for multiple RRAM technologies and applications and illustrate the achieved performance of our GPU implementation. We conclude with the application of our modeling approach to measurement data from two distinct fabricated devices, validating its effectiveness in a neural network processing an Electrocardiogram (ECG) dataset and incorporating Fault Aware Training (FAT). KW - RRAM KW - Neural network KW - digital twin Y1 - 2024 U6 - https://doi.org/10.1038/s41598-024-73439-z SN - 2045-2322 VL - 14 IS - 1 PB - Springer Science and Business Media LLC ER - TY - GEN A1 - Lukosius, Mindaugas A1 - Lukose, Rasuolė A1 - Dubey, P. K. A1 - Raju, A. I. A1 - Capista, Daniele A1 - Lisker, Marco A1 - Mai, A. A1 - Wenger, Christian T1 - Graphene for photonic applications T2 - 2024 47th MIPRO ICT and Electronics Convention (MIPRO) N2 - Integrating graphene into Silicon Complementary Metal-Oxide-Semiconductor (CMOS) technology for photonic applications holds immense promise, but it encounters challenges in establishing large-scale graphene processes. These challenges encompass growth through techniques like Chemical Vapor Deposition (CVD), transfer, encapsulation, and contact formation within a routine 200mm wafer pilot line typically utilized for integrated circuit fabrication. This study is dedicated to exploring various facets of graphene research within a 200 mm pilot line, with a focus on overcoming challenges through the fabrication of proof-of-concept photonic graphene-based devices. The synthesis of graphene targeted epi-Ge(100)/Si(100) substrates, grown within the IHP pilot line, showcasing the potential for high-quality graphene deposition across 200mm wafers. Alternatively, employing different orientations such as (110) has been explored to enhance graphene mobility, achieving a remarkable mobility of 2300 cm 2 /Vs at present. The study systematically investigates graphene quality, thickness, and homogeneity utilizing techniques such as Raman spectroscopy, Atomic Force Microscopy (AFM), and Scanning Electron Microscopy (SEM). Additionally, simulations and fabrication of the graphene ring modulators have been conducted at both the component and device levels, incorporating realistic graphene properties. These results indicate a modulation depth of 1.6 dB/μm and a 3dB bandwidth of 7 GHz, showcasing the potential of graphene-based photonic devices for high-speed communication applications. KW - Graphene Y1 - 2024 SN - 979-8-3503-8250-1 SN - 979-8-3503-8249-5 U6 - https://doi.org/10.1109/MIPRO60963.2024.10569652 SN - 2623-8764 SP - 1614 EP - 1618 PB - IEEE ER - TY - GEN A1 - Fritscher, Markus A1 - Wenger, Christian A1 - Krstic, Milos T1 - From device to application - integrating RRAM Accelerator Blocks into large AI systems T2 - 2024 IEEE Computer Society Annual Symposium on VLSI (ISVLSI) N2 - This work provides an introduction to design methodologies for RRAM-based systems. We illustrate the impact of device variation on the performance of neural networks and propose a circuit-level integration approach for RRAM-based compute blocks. Moreover, we demonstrate a possible architectural integration by incorporating RRAM-based VMM blocks fabricated in a 130 nm CMOS process into a RISC-V. KW - RRAM Y1 - 2024 SN - 979-8-3503-5411-9 SN - 979-8-3503-5412-6 U6 - https://doi.org/10.1109/ISVLSI61997.2024.00111 SN - 2159-3477 SP - 592 EP - 592 PB - IEEE ER - TY - GEN A1 - Fritscher, Markus A1 - Uhlmann, Max A1 - Ostrovskyy, Philip A1 - Reiser, Daniel A1 - Chen, Junchao A1 - Schubert, Andreas A1 - Schulze, Carsten A1 - Kahmen, Gerhard A1 - Fey, Dietmar A1 - Reichenbach, Marc A1 - Krstic, Milos A1 - Wenger, Christian T1 - Area-efficient digital design using RRAM-CMOS standard cells T2 - 2024 IEEE Computer Society Annual Symposium on VLSI (ISVLSI) N2 - Extending the scalability of digital integrated circuits through novel device concepts is an attractive option. Among these concepts, resistive random access memory (RRAM) devices allow fast and nonvolatile operation. However, building large memristive systems is still challenging since large analog circuits have to be designed and integrated. In this paper, we propose a novel solution - the implementation of digital standard cells by the means of RRAM devices. While this methodology is universal, with applications ranging from few-device-circuits to large macroblocks, we demonstrate it for a 2T2R-cell. The benefits of using RRAM devices are demonstrated by implementing a NAND standard cell merely consuming the area of two transistors. This cell is about 25 % smaller than the equivalent CMOS NAND in the same technology. We use these cells to implement a half adder, beating the area of the equivalent CMOS implementation using more sophisticates gates by 15 %. Lastly, we fully integrate this novel standard cell into a digital standard cell library and perform a synthesis and layout of a RISC-V CPU core. KW - RRAM Y1 - 2024 SN - 979-8-3503-5411-9 SN - 979-8-3503-5412-6 U6 - https://doi.org/10.1109/ISVLSI61997.2024.00026 SN - 2159-3477 VL - 18 SP - 81 EP - 87 PB - IEEE ER - TY - GEN A1 - Vinuesa, Guillermo A1 - Garcia, Hector A1 - Duenas, Salvador A1 - Castan, Helena A1 - Iñiguez de la Torre, Ignacio A1 - Gonzalez, Tomas A1 - Dorai Swamy Reddy, Keerthi A1 - Uhlmann, Max A1 - Wenger, Christian A1 - Perez, Eduardo T1 - Effect of the temperature on the performance and dynamic behavior of HfO2-Based Rram Devices T2 - ECS Meeting Abstracts N2 - Over the past decades, the demand for semiconductor memory devices has been steadily increasing, and is currently experiencing an unprecedented boost due to the development and expansion of artificial intelligence. Among emerging high-density non-volatile memories, resistive random-access memory (RRAM) is one of the best recourses for all kind of applications, such as neuromorphic computing or hardware security [1]. Although many materials have been evaluated for RRAM development, some of them with excellent results, HfO2 is one of the established materials in CMOS domain due to its compatibility with standard materials and processes [2]. The main goal of this work is to study the switching capability and stability of HfO2-based RRAMs, as well as to explore their ability in the field of analogue applications, by analyzing the evolution of the resistance states that allow multilevel control. Indeed, analogue operation is a key point for achieving electronic neural synapses in neuromorphic systems, with synaptic weight information encoded in the different resistance states. This research has been carried out over a wide temperature range, between 40 and 340 K, as we are interested in testing the extent to which performance is maintained or modified, with a view to designing neuromorphic circuits that are also suitable in the low-temperature realm. We aim to prove that these simple, fast, high integration density structures can also be used in circuits designed for specific applications, such as aerospace systems. The RRAM devices studied in this work are TiN/Ti/8 nm-HfO2/TiN metal-insulator-metal (MIM) capacitors. Dielectric layers were atomic layer deposited (ALD). It has been demonstrated that the Ti coat in the top electrode acts as a scavenger that absorbs oxygen atoms from the HfO2 layer, and facilitates the creation of conductive filaments of oxygen vacancies [3]. In fact, the oxygen reservoir capability of Ti is well known, as it is able to attract and release oxygen atoms from or to the HfO2 layer during the RRAM operation [4]. The clustering of vacancies extends through the entire thickness of the oxide and, after an electroformig step, it joins the upper and lower electrodes and the device reaches the low resistance state (LRS). By applying adequate electrical signals, the filaments can be partially dissolved, which brings the device into the high-resistance state (HRS), with lower current values. The set process brings the device to the LRS state, while the reset one brings it to the HRS. The dependence of electrical conductivity on external applied electrical excitation allows triggering the device between the both states in a non-volatile manner [5]. The experimental equipment used consisted of a Keithley 4200-SCS semiconductor parameter analyzer and a Lake Shore cryogenic probe station. Fig.1 shows current-voltage cycles measured at different temperatures; the averages values at each temperature, both in logarithmic and linear scale, are also shown. The functional window increases as temperature decreases. The evolutions of set and reset voltage values with temperature are depicted in Fig.2, whereas the current values (measured at 0.1 V) corresponding to the LRS and HRS can be seen in Fig.3. LRS resistance decreases as temperature increases, in agreement with semiconductor behaviour, probably due to a hopping conduction mechanism. Both set and reset voltages decrease as temperature increases; the reset process is smoother at high temperatures. The reduction in reset voltage variability as temperature increases is very notable. Finally, Fig. 4 shows a picture of the transient behaviour; in the right panel of the same figure, the amplitudes of the current transients in the reset state have been included in the external loop. To sum up, the resistive switching phenomena is studied in a wide temperature range. The LRS shows semiconducting behavior with temperature, most likely related to a hopping conduction mechanism. Switching voltages decrease as temperature increases, with a notable reduction in reset voltage variability. An excellent control of intermediate resistance state is shown through current transients at several voltages in the reset process. REFERENCES [1] M. Asif et al., Materials Today Electronics 1, 100004 (2022). [2] S. Slesazeck et al., Nanotechnology 30, 352003 (2019). [3] Z. Fang et al., IEEE Electron Device Letters 35, 9, 912-914 (2014). [4] H. Y. Lee et al., IEEE Electron Device Letters 31, 1, 44-46 (2010). [5] D. J. Wouters et al., Proceedings of the IEEE 103, 8, 1274-1288 (2015). Figure 1 KW - RRAM Y1 - 2024 U6 - https://doi.org/10.1149/MA2024-01211297mtgabs SN - 2151-2043 VL - MA2024-01 IS - 21 SP - 1297 EP - 1297 PB - The Electrochemical Society ER - TY - GEN A1 - Wen, Jianan A1 - Baroni, Andrea A1 - Perez, Eduardo A1 - Uhlmann, Max A1 - Fritscher, Markus A1 - KrishneGowda, Karthik A1 - Ulbricht, Markus A1 - Wenger, Christian A1 - Krstic, Milos T1 - Towards reliable and energy-efficient RRAM based discrete fourier transform accelerator T2 - 2024 Design, Automation & Test in Europe Conference & Exhibition (DATE) N2 - The Discrete Fourier Transform (DFT) holds a prominent place in the field of signal processing. The development of DFT accelerators in edge devices requires high energy efficiency due to the limited battery capacity. In this context, emerging devices such as resistive RAM (RRAM) provide a promising solution. They enable the design of high-density crossbar arrays and facilitate massively parallel and in situ computations within memory. However, the reliability and performance of the RRAM-based systems are compromised by the device non-idealities, especially when executing DFT computations that demand high precision. In this paper, we propose a novel adaptive variability-aware crossbar mapping scheme to address the computational errors caused by the device variability. To quantitatively assess the impact of variability in a communication scenario, we implemented an end-to-end simulation framework integrating the modulation and demodulation schemes. When combining the presented mapping scheme with an optimized architecture to compute DFT and inverse DFT(IDFT), compared to the state-of-the-art architecture, our simulation results demonstrate energy and area savings of up to 57 % and 18 %, respectively. Meanwhile, the DFT matrix mapping error is reduced by 83% compared to conventional mapping. In a case study involving 16-quadrature amplitude modulation (QAM), with the optimized architecture prioritizing energy efficiency, we observed a bit error rate (BER) reduction from 1.6e-2 to 7.3e-5. As for the conventional architecture, the BER is optimized from 2.9e-3 to zero. KW - RRAM Y1 - 2024 SN - 978-3-9819263-8-5 SN - 979-8-3503-4860-6 U6 - https://doi.org/10.23919/DATE58400.2024.10546709 SN - 1558-1101 SP - 1 EP - 6 PB - IEEE ER - TY - GEN A1 - Maldonado, David A1 - Baroni, Andrea A1 - Aldana, Samuel A1 - Dorai Swamy Reddy, Keerthi A1 - Pechmann, Stefan A1 - Wenger, Christian A1 - Roldán, Juan Bautista A1 - Pérez, Eduardo T1 - Kinetic Monte Carlo simulation analysis of the conductance drift in Multilevel HfO2-based RRAM devices T2 - Nanoscale N2 - The drift characteristics of valence change memory (VCM) devices have been analyzed through both experimental analysis and 3D kinetic Monte Carlo (kMC) simulations. KW - RRAM Y1 - 2024 U6 - https://doi.org/10.1039/d4nr02975e SN - 2040-3364 VL - 16 IS - 40 SP - 19021 EP - 19033 PB - Royal Society of Chemistry (RSC) ER - TY - GEN A1 - Uhlmann, Max A1 - Rizzi, Tommaso A1 - Wen, Jianan A1 - Pérez-Bosch Quesada, Emilio A1 - Al Beattie, Bakr A1 - Ochs, Karlheinz A1 - Pérez, Eduardo A1 - Ostrovskyy, Philip A1 - Carta, Corrado A1 - Wenger, Christian A1 - Kahmen, Gerhard T1 - LUT-based RRAM model for neural accelerator circuit simulation T2 - Proceedings of the 18th ACM International Symposium on Nanoscale Architectures N2 - Neural hardware accelerators have been proven to be energy-efficient when used to solve tasks which can be mapped into an artificial neural network (ANN) structure. Resistive random-access memories (RRAMs) are currently under investigation together with several different memristive devices as promising technologies to build such accelerators combined together with complementary metal-oxide semiconductor (CMOS)-technologies in integrated circuits (ICs). While many research groups are actively developing sophisticated physical-based representations to better understand the underlying phenomena characterizing these devices, not much work has been dedicated to exploit the trade-off between simulation time and accuracy in the definition of low computational demanding models suitable to be used at many abstraction layers. Indeed, the design of complex mixed-signal systems as a neural hardware accelerators requires frequent interaction between the application- and the circuit-level that can be enabled only with the support of accurate and fast-simulating devices’ models. In this work, we propose a solution to fill the aforementioned gap with a lookup table (LUT)-based Verilog-A model of IHP’s 1-transistor-1-RRAM (1T1R) cell. In addition, the implementation challenges of conveying the communication between the abstract ANN simulation and the circuital analysis are tackled with a design flow for resistive neural hardware accelerators that features a custom Python wrapper. As a demonstration of the proposed design flow and 1T1R model, an ANN for the MNIST handwritten digit recognition task is assessed with the last layer verified in circuit simulation. The obtained recognition confidence intervals show a considerable discrepancy between the purely application-level PyTorch simulation and the proposed design flow which spans across the abstraction layers down to the circuital analysis. KW - RRAM KW - Neural network Y1 - 2023 U6 - https://doi.org/10.1145/3611315.3633273 SP - 1 EP - 6 PB - ACM CY - New York, NY, USA ER - TY - GEN A1 - Strobel, Carsten A1 - Alvarado Chavarin, Carlos A1 - Völkel, Sandra A1 - Jahn, Andreas A1 - Hiess, Andre A1 - Knaut, Martin A1 - Albert, Matthias A1 - Wenger, Christian A1 - Steinke, Olaff A1 - Stephan, Ulf A1 - Röhlecke, Sören A1 - Mikolajick, Thomas T1 - Enhanced Electrical Properties of Optimized Vertical Graphene-Base Hot Electron Transistors T2 - ACS Applied Electronic Materials N2 - The arrival of high-mobility two-dimensional materials like graphene leads to the renaissance of former vertical semiconductor–metal–semiconductor (SMS) hot electron transistors. Because of the monolayer thickness of graphene, improved SMS transistors with a semimetallic graphene-base electrode are now feasible for high-frequency applications. In this study we report about a device that consists of amorphous silicon, graphene, and crystalline silicon. For the first time, this device is fabricated by a four-mask lithography process which leads to significant improvements in the device performance. A strongly increased common-emitter current gain of 2% could be achieved while the on–off ratio improved to 1.6 × 105, which is already higher than predicted theoretically. This could be mainly attributed to better interface characteristics and decreased lateral dimensions of the devices. A cutoff frequency of approximately 26 MHz could be forecasted based on the DC measurements of the device. KW - Graphene KW - Transistor Y1 - 2023 U6 - https://doi.org/10.1021/acsaelm.2c01725 SN - 2637-6113 VL - 5 IS - 3 SP - 1670 EP - 1675 ER - TY - GEN A1 - Kloes, Alexander A1 - Bischoff, Carl A1 - Leise, Jakob A1 - Perez-Bosch Quesada, Emilio A1 - Wenger, Christian A1 - Pérez, Eduardo T1 - Stochastic switching of memristors and consideration in circuit simulation T2 - Solid State Electronics N2 - We explore the stochastic switching of oxide-based memristive devices by using the Stanford model for circuit simulation. From measurements, the device-to-device (D2D) and cycle-to-cycle (C2C) statistical variation is extracted. In the low-resistive state (LRS) dispersion by D2D variability is dominant. In the high-resistive state (HRS) C2C dispersion becomes the main source of fluctuation. A statistical procedure for the extraction of parameters of the compact model is presented. Thereby, in a circuit simulation the typical D2D and C2C fluctuations of the current–voltage (I-V) characteristics can be emulated by extracting statistical parameters of key model parameters. The statistical distributions of the parameters are used in a Monte Carlo simulation to reproduce the I-V D2D and C2C dispersions which show a good agreement to the measured curves. The results allow the simulation of the on/off current variation for the design of memory cells or can be used to emulate the synaptic behavior of these devices in artificial neural networks realized by a crossbar array of memristors. KW - RRAM KW - memristive device KW - variability Y1 - 2023 U6 - https://doi.org/10.1016/j.sse.2023.108606 SN - 0038-1101 VL - 201 ER - TY - GEN A1 - Perez-Bosch Quesada, Emilio A1 - Mahadevaiah, Mamathamba Kalishettyhalli A1 - Rizzi, Tommaso A1 - Wen, Jianan A1 - Ulbricht, Markus A1 - Krstic, Milos A1 - Wenger, Christian A1 - Pérez, Eduardo T1 - Experimental Assessment of Multilevel RRAM-based Vector-Matrix Multiplication Operations for In-Memory Computing T2 - IEEE Transactions on Electron Devices N2 - Resistive random access memory (RRAM)-based hardware accelerators are playing an important role in the implementation of in-memory computing (IMC) systems for artificial intelligence applications. The latter heavily rely on vector-matrix multiplication (VMM) operations that can be efficiently boosted by RRAM devices. However, the stochastic nature of the RRAM technology is still challenging real hardware implementations. To study the accuracy degradation of consecutive VMM operations, in this work we programed two RRAM subarrays composed of 8x8 one-transistor-one-resistor (1T1R) cells following two different distributions of conductive levels. We analyze their robustness against 1000 identical consecutive VMM operations and monitor the inherent devices’ nonidealities along the test. We finally quantize the accuracy loss of the operations in the digital domain and consider the trade-offs between linearly distributing the resistive states of the RRAM cells and their robustness against nonidealities for future implementation of IMC hardware systems. KW - RRAM KW - Vector Matrix Multiplication KW - variability Y1 - 2023 U6 - https://doi.org/10.1109/TED.2023.3244509 SN - 0018-9383 VL - 70 IS - 4 SP - 2009 EP - 2014 ER - TY - GEN A1 - Akhtar, Fatima A1 - Dabrowski, Jaroslaw A1 - Lukose, Rasuole A1 - Wenger, Christian A1 - Lukosius, Mindaugas T1 - Chemical Vapor Deposition Growth of Graphene on 200 mm Ge (110)/Si Wafers and Ab Initio Analysis of Differences in Growth Mechanisms on Ge (110) and Ge (001) T2 - ACS Applied Materials & Interfaces N2 - For the fabrication of modern graphene devices, uniform growth of high-quality monolayer graphene on wafer scale is important. This work reports on the growth of large-scale graphene on semiconducting 8 inch Ge(110)/Si wafers by chemical vapor deposition and a DFT analysis of the growth process. Good graphene quality is indicated by the small FWHM (32 cm–1) of the Raman 2D band, low intensity ratio of the Raman D and G bands (0.06), and homogeneous SEM images and is confirmed by Hall measurements: high mobility (2700 cm2/Vs) and low sheet resistance (800 Ω/sq). In contrast to Ge(001), Ge(110) does not undergo faceting during the growth. We argue that Ge(001) roughens as a result of vacancy accumulation at pinned steps, easy motion of bonded graphene edges across (107) facets, and low energy cost to expand Ge area by surface vicinals, but on Ge(110), these mechanisms do not work due to different surface geometries and complex reconstruction. KW - Graphene KW - Chemical Vapor Deposition Y1 - 2023 U6 - https://doi.org/10.1021/acsami.3c05860 SN - 1944-8244 VL - 15 IS - 30 SP - 36966 EP - 36974 ER - TY - GEN A1 - Rizzi, Tommaso A1 - Baroni, Andrea A1 - Glukhov, Artem A1 - Bertozzi, Davide A1 - Wenger, Christian A1 - Ielmini, Daniele A1 - Zambelli, Cristian T1 - Process-Voltage-Temperature Variations Assessment in Energy-Aware Resistive RAM-Based FPGAs T2 - IEEE Transactions on Device and Materials Reliability N2 - Resistive Random Access Memory (RRAM) technology holds promises to improve the Field Programmable Gate Array (FPGA) performance, reduce the area footprint, and dramatically lower run-time energy requirements compared to the state-of-the-art CMOS-based products. However, the integration of RRAM in FPGAs is hindered by the high programming power consumption and by non-ideal behaviors of the device due to its stochastic nature that may overshadow the benefits in normal operation mode. To cope with these challenges, optimized programming strategies have to be investigated. In this work, we explore the impact that different procedures to set the device have on the run-time performance. Process, voltage, and temperature (PVT) variations as well as time-dependent drift effect of the RRAM device are considered in the assessment of 4T1R MUX designs characteristics. The comparison with tradition CMOS implementations reveals how the choice of the target resistive state and the programming algorithm are key design aspects to reduce the run-time delay and energy metrics, while at the same time improving the robustness against the different sources of variations. KW - RRAM KW - FPGA Y1 - 2023 U6 - https://doi.org/10.1109/TDMR.2023.3259015 SN - 1530-4388 VL - 23 IS - 3 SP - 328 EP - 336 ER - TY - GEN A1 - Uhlmann, Max A1 - Pérez-Bosch Quesada, Emilio A1 - Fritscher, Markus A1 - Pérez, Eduardo A1 - Schubert, Markus Andreas A1 - Reichenbach, Marc A1 - Ostrovskyy, Philip A1 - Wenger, Christian A1 - Kahmen, Gerhard T1 - One-Transistor-Multiple-RRAM Cells for Energy-Efficient In-Memory Computing T2 - 21st IEEE Interregional NEWCAS Conference (NEWCAS) N2 - The use of resistive random-access memory (RRAM) for in-memory computing (IMC) architectures has significantly improved the energy-efficiency of artificial neural networks (ANN) over the past years. Current RRAM-technologies are physically limited to a defined unambiguously distinguishable number of stable states and a maximum resistive value and are compatible with present complementary metal-oxide semiconductor (CMOS)-technologies. In this work, we improved the accuracy of current ANN models by using increased weight resolutions of memristive devices, combining two or more in-series RRAM cells, integrated in the back end of line (BEOL) of the CMOS process. Based on system level simulations, 1T2R devices were fabricated in IHP's 130nm SiGe:BiCMOS technology node, demonstrating an increased number of states. We achieved an increase in weight resolution from 3 bit in ITIR cells to 6.5 bit in our 1T2R cell. The experimental data of 1T2R devices gives indications for the performance and energy-efficiency improvement in ITNR arrays for ANN applications. KW - RRAM KW - In-Memory Computing Y1 - 2023 SN - 979-8-3503-0024-6 SN - 979-8-3503-0025-3 U6 - https://doi.org/10.1109/NEWCAS57931.2023.10198073 SN - 2474-9672 SN - 2472-467X PB - Institute of Electrical and Electronics Engineers (IEEE) ER - TY - GEN A1 - Strobel, Carsten A1 - Alvarado Chavarin, Carlos A1 - Wenger, Christian A1 - Albert, Matthias A1 - Mikolajick, Thomas T1 - Vertical Graphene-Based Transistors for Power Electronics, Optoelectronics and Radio-Frequency Applications T2 - IEEE Nanotechnology Materials and Devices Conference (NMDC), Paestum, Italy, 22-25 October 2023 N2 - The combination of two-dimensional materials, such as graphene, with established thin films offers great opportunities for enabling next-generation vertical transistors for various applications. This paper gives a brief overview about different vertical transistor concepts using twodimensional materials proposed so far, e.g. the hot electron transistor and the Barristor. With the arrival of twodimensional materials, the hot electron transistor also experienced a revival with predicted cut-off frequencies in the THz range. The Barristor overcomes the weak current saturation of lateral graphene field-effect transistors and high on-off ratios up to 107 were demonstrated, which are suitable parameters for logic applications. By combining a semiconductor-graphene-semiconductor design of the simplest hot electron transistor with the Barristor operating principle a new device, called graphene adjustable-barriers transistor, can be realized. This new device concept provides the potential for RF, power electronics, and optoelectronic applications. KW - Graphene Y1 - 2023 SN - 979-8-3503-3546-0 SN - 979-8-3503-3547-7 U6 - https://doi.org/10.1109/NMDC57951.2023.10344102 SN - 2473-0718 SP - 196 EP - 201 PB - Institute of Electrical and Electronics Engineers (IEEE) ER - TY - GEN A1 - Morales, Carlos A1 - Mahmoodinezhad, Ali A1 - Tschammer, Rudi A1 - Kosto, Yuliia A1 - Alvarado Chavarin, Carlos A1 - Schubert, Markus Andreas A1 - Wenger, Christian A1 - Henkel, Karsten A1 - Flege, Jan Ingo T1 - Combination of Multiple Operando and In-Situ Characterization Techniques in a Single Cluster System for Atomic Layer Deposition: Unraveling the Early Stages of Growth of Ultrathin Al2O3 Films on Metallic Ti Substrates T2 - Inorganics N2 - This work presents a new ultra-high vacuum cluster tool to perform systematic studies of the early growth stages of atomic layer deposited (ALD) ultrathin films following a surface science approach. By combining operando (spectroscopic ellipsometry and quadrupole mass spectrometry) and in situ (X-ray photoelectron spectroscopy) characterization techniques, the cluster allows us to follow the evolution of substrate, film, and reaction intermediates as a function of the total number of ALD cycles, as well as perform a constant diagnosis and evaluation of the ALD process, detecting possible malfunctions that could affect the growth, reproducibility, and conclusions derived from data analysis. The homemade ALD reactor allows the use of multiple precursors and oxidants and its operation under pump and flow-type modes. To illustrate our experimental approach, we revisit the well-known thermal ALD growth of Al2O3 using trimethylaluminum and water. We deeply discuss the role of the metallic Ti thin film substrate at room temperature and 200 °C, highlighting the differences between the heterodeposition (<10 cycles) and the homodeposition (>10 cycles) growth regimes at both conditions. This surface science approach will benefit our understanding of the ALD process, paving the way toward more efficient and controllable manufacturing processes. KW - Atomic layer deposition (ALD) KW - in-situ KW - operando KW - X-ray photoelectron spectroscopy KW - ellipsometry KW - quadrupol mass spectrometry (QMS) Y1 - 2023 U6 - https://doi.org/10.3390/inorganics11120477 SN - 2304-6740 VL - 11 IS - 12 ER - TY - GEN A1 - Capista, Daniele A1 - Lukose, Rasuole A1 - Majnoon, Farnaz A1 - Lisker, Marco A1 - Wenger, Christian A1 - Lukosius, Mindaugas T1 - Study on the metal -graphene contact resistance achieved with one -dimensional contact architecture T2 - IEEE Nanotechnology Materials and Devices Conference (NMDC 2023), Paestum, Italy, 22-25 October 2023 N2 - Graphene has always been considered as one of the materials with the greatest potential for the realization of improved microelectronic and photonic devices. But to actually reach its full potential in Si CMOS technology, graphene -based devices need to overcome different challenges. They do not only need to have better performances than standard devices, but they also need to be compatible with the production of standard Si based devices. To address the first challenge the main route requires the optimization of the contact resistance, that highly reduces the devices performance, while the second challenges requires the integration of graphene inside the standard production lines used for microelectronic. In this work we used an 8” wafer pilot -line to realize our devices and we studied the behavior of the contact resistance between metal and graphene obtained by one -dimensional contact architecture between the two materials. The contact resistance has been measured by means of Transmission Line Method (TLM) with several contact patterning. KW - Graphene Y1 - 2023 SN - 979-8-3503-3546-0 U6 - https://doi.org/10.1109/NMDC57951.2023.10343775 SP - 118 EP - 119 PB - Institute of Electrical and Electronics Engineers (IEEE) ER - TY - GEN A1 - Lukosius, Mindaugas A1 - Lukose, Rasuolė A1 - Lisker, Marco A1 - Dubey, P. K. A1 - Raju, A. I. A1 - Capista, Daniele A1 - Majnoon, Farnaz A1 - Mai, A. A1 - Wenger, Christian T1 - Developments of Graphene devices in 200 mm CMOS pilot line T2 - Proc. Nanotechnology Materials and Devices Conference (NMDC 2023),Paestum, Italy, 22-25 October 2023 N2 - Due to the unique electronic band structure, graphene has opened great potential to extend the functionality of a large variety of devices. Despite the significant progress in the fabrication of various graphene based microelectronic devices, the integration of graphene devices still lack the stability and compatibility with Si-technology processes. Therefore, the investigation and preparation of graphene devices in conditions resembling as close as possible the Si technology environment is of highest importance. This study aims to explore various aspects of graphene research on a 200mm pilot line, with a focus on simulations and fabrication of graphene modulator. To be more precise, it includes design and fabrication of the layouts, necessary mask sets, creation of the flows, fabrication, and measurements of the Gr modulators on 200 mm wafers. KW - Graphene Y1 - 2023 SN - 979-8-3503-3546-0 U6 - https://doi.org/10.1109/NMDC57951.2023.10343569 SP - 505 EP - 506 PB - Institute of Electrical and Electronics Engineers (IEEE) ER - TY - GEN A1 - Maldonado, David A1 - Cantudo, Antonio A1 - Pérez, Eduardo A1 - Romero-Zaliz, Rocio A1 - Perez-Bosch Quesada, Emilio A1 - Mahadevaiah, Mamathamba Kalishettyhalli A1 - Jimenez-Molinos, Francisco A1 - Wenger, Christian A1 - Roldan, Juan Bautista T1 - TiN/Ti/HfO2/TiN Memristive Devices for Neuromorphic Computing: From Synaptic Plasticity to Stochastic Resonance T2 - Frontiers in Neuroscience N2 - We characterize TiN/Ti/HfO2/TiN memristive devices for neuromorphic computing. We analyze different features that allow the devices to mimic biological synapses and present the models to reproduce analytically some of the data measured. In particular, we have measured the spike timing dependent plasticity behavior in our devices and later on we have modeled it. The spike timing dependent plasticity model was implemented as the learning rule of a spiking neural network that was trained to recognize the MNIST dataset. Variability is implemented and its influence on the network recognition accuracy is considered accounting for the number of neurons in the network and the number of training epochs. Finally, stochastic resonance is studied as another synaptic feature.It is shown that this effect is important and greatly depends on the noise statistical characteristics. KW - RRAM KW - Neural network Y1 - 2023 U6 - https://doi.org/10.3389/fnins.2023.1271956 SN - 1662-4548 VL - 17 ER - TY - GEN A1 - Perez-Bosch Quesada, Emilio A1 - Rizzi, Tommaso A1 - Gupta, Aditya A1 - Mahadevaiah, Mamathamba Kalishettyhalli A1 - Schubert, Andreas A1 - Pechmann, Stefan A1 - Jia, Ruolan A1 - Uhlmann, Max A1 - Hagelauer, Amelie A1 - Wenger, Christian A1 - Pérez, Eduardo T1 - Multi-Level Programming on Radiation-Hard 1T1R Memristive Devices for In-Memory Computing T2 - 14th Spanish Conference on Electron Devices (CDE 2023), Valencia, Spain, 06-08 June 2023 N2 - This work presents a quasi-static electrical characterization of 1-transistor-1-resistor memristive structures designed following hardness-by-design techniques integrated in the CMOS fabrication process to assure multi-level capabilities in harsh radiation environments. Modulating the gate voltage of the enclosed layout transistor connected in series with the memristive device, it was possible to achieve excellent switching capabilities from a single high resistance state to a total of eight different low resistance states (more than 3 bits). Thus, the fabricated devices are suitable for their integration in larger in-memory computing systems and in multi-level memory applications. Index Terms—radiation-hard, hardness-by-design, memristive devices, Enclosed Layout Transistor, in-memory computing KW - RRAM Y1 - 2023 SN - 979-8-3503-0240-0 U6 - https://doi.org/10.1109/CDE58627.2023.10339525 PB - Institute of Electrical and Electronics Engineers (IEEE) ER - TY - GEN A1 - Pérez, Eduardo A1 - Maldonado, David A1 - Mahadevaiah, Mamathamba Kalishettyhalli A1 - Perez-Bosch Quesada, Emilio A1 - Cantudo, Antonio A1 - Jimenez-Molinos, Francisco A1 - Wenger, Christian A1 - Roldan, Juan Bautista T1 - A comparison of resistive switching parameters for memristive devices with HfO2 monolayers and Al2O3/HfO2 bilayers at the wafer scale T2 - 14th Spanish Conference on Electron Devices (CDE 2023), Valencia, Spain, 06-08 June 2023 N2 - Memristive devices integrated in 200 mm wafers manufactured in 130 nm CMOS technology with two different dielectrics, namely, a HfO2 monolayer and an Al2O3/HfO2 bilayer, have been measured. The cycle-to-cycle (C2C) and device-todevice (D2D) variability have been analyzed at the wafer scale using different numerical methods to extract the set (Vset) and reset (Vreset) voltages. Some interesting differences between both technologies were found in terms of switching characteristics KW - RRAM Y1 - 2023 SN - 979-8-3503-0240-0 U6 - https://doi.org/10.1109/CDE58627.2023.10339417 PB - Institute of Electrical and Electronics Engineers (IEEE) ER - TY - GEN A1 - Reiser, Daniel A1 - Reichenbach, Marc A1 - Rizzi, Tommaso A1 - Baroni, Andrea A1 - Fritscher, Markus A1 - Wenger, Christian A1 - Zambelli, Cristian A1 - Bertozzi, Davide T1 - Technology-Aware Drift Resilience Analysis of RRAM Crossbar Array Configurations T2 - 21st IEEE Interregional NEWCAS Conference (NEWCAS), 26-28 June 2023, Edinburgh, United Kingdom N2 - In-memory computing with resistive-switching random access memory (RRAM) crossbar arrays has the potential to overcome the major bottlenecks faced by digital hardware for data-heavy workloads such as deep learning. However, RRAM devices are subject to several non-idealities that result in significant inference accuracy drops compared with software baseline accuracy. A critical one is related to the drift of the conductance states appearing immediately at the end of program and verify algorithms that are mandatory for accurate multi-level conductance operation. The support of drift models in state-of-the-art simulation tools of memristive computationin-memory is currently only in the early stage, since they overlook key device- and array-level parameters affecting drift resilience such as the programming algorithm of RRAM cells, the choice of target conductance states and the weight-toconductance mapping scheme. The goal of this paper is to fully expose these parameters to RRAM crossbar designers as a multi-dimensional optimization space of drift resilience. For this purpose, a simulation framework is developed, which comes with the suitable abstractions to propagate the effects of those RRAM crossbar configuration parameters to their ultimate implications over inference performance stability. KW - RRAM Y1 - 2023 SN - 979-8-3503-0024-6 SN - 979-8-3503-0025-3 U6 - https://doi.org/10.1109/NEWCAS57931.2023 PB - IEEE CY - Piscataway, NJ ER -