TY - GEN A1 - Zschech, Ehrenfried A1 - Ho, O. S. A1 - Schmeißer, Dieter A1 - Meyer, Moritz Andreas A1 - Vairagar, A. V. A1 - Schneider, G. A1 - Hauschildt, Meike A1 - Kraatz, Matthias A1 - Sukharev, V. T1 - Geometry and Microstructure Effect on EM-Induced Copper Interconnect Degradation T2 - IEEE Transactions on Device and Materials Reliability KW - Microstructure Y1 - 2009 UR - http://ieeexplore.ieee.org/xpls/icp.jsp?arnumber=4796372 SN - 1530-4388 VL - 9 IS - 1 SP - 20 EP - 30 ER -