TY - CHAP A1 - Tsuji, Yukihide A1 - Kupnik, Mario A1 - Khuri-Yakub, Butrus T. T1 - Low temperature process for CMUT fabrication with wafer bonding technique T2 - 2010 IEEE International Ultrasonics Symposium (IUS 2010), San Diego, California, USA, 11 - 14 October 2010 Y1 - 2010 SN - 978-1-4577-0381-2 SP - 551 EP - 554 PB - IEEE CY - Piscataway, NJ ER -