TY - GEN A1 - Adelmann, Christoph A1 - Schram, Tom A1 - Chew, Soon Aik A1 - Woicik, J. C. A1 - Brizzi, Simone A1 - Tallarida, Massimo A1 - Schmeißer, Dieter A1 - Horiguchi, Naoto A1 - Elshocht, Sven van A1 - Ragnarsson, Lars-Åke T1 - On the scalability of doped hafnia thin films T2 - Applied Physics Letters N2 - The scaling behavior of Gd- and Al-doped HfO2 films as gate dielectrics in metal-oxide-semiconductor (MOS) capacitors was studied. For equivalent oxide thicknesses (EOTs) in the range of 10 Å, crystallized Gd:HfO2 showed higher leakage current densities than crystallized Al:HfO2, with undoped HfO2 in between. Ultimately, the scalability of Al:HfO2 was limited by the ability to crystallize the films at a given thermal budget. As a result, for post-deposition annealing at 800 °C, the EOT of Al:HfO2 based MOS capacitors was limited to ∼8 Å. However, for such an EOT, leakage current densities were reduced by about 100× with respect to HfO2. This demonstrates the high potential of Al:HfO2 for low-standby-power MOS devices. KW - scalability KW - hafnia thin films KW - Al:HfO2 KW - Gd:HfO2 KW - EXAFS KW - equivalent oxide thickness (EOT) KW - leakage current KW - X-ray absorption spectroscopy (XAS) Y1 - 2014 U6 - https://doi.org/10.1063/1.4870075 SN - 0003-6951 SN - 1077-3118 IS - 104 SP - 122906-1 EP - 122906-4 ER -