TY - PAT A1 - Schenk, Harald T1 - Apparatus and method for controlling or regulating an oscillating deflectable micromechanical element Y1 - 2011 ER - TY - PAT A1 - Schenk, Harald A1 - Sander, T. A1 - Heber, J. A1 - Klose, T. A1 - Bergmann, A. A1 - Gerwig, C. A1 - Knieling, T. T1 - Micromechanical device with temperature stabilization and method for adjusting a defined temperature or a defined temperature course on a micromechanical device Y1 - 2012 ER - TY - PAT A1 - Schenk, Harald A1 - Zimmer, F. A1 - Wolter, A. T1 - Mikrooptisches Beugungsgitter sowie Verfahren zur Herstellung T2 - Micro-optical electromagnetic radiation diffraction grating and method for manufacture Y1 - 2017 ER - TY - PAT A1 - Schenk, Harald A1 - Dürr, P. A1 - Kück, H. T1 - Micromechanical component comprising an oscillating body T1 - Mikromechanisches Bauelement mit Schwingkörper Y1 - 2002 ER - TY - PAT A1 - Costache, Florenta Adriana A1 - Schenk, Harald A1 - Bornhorst, Kirstin A1 - Schirrmann, Christian T1 - Fluidic variable focal length optical lens and method of manufacturing the same Y1 - 2012 ER - TY - PAT A1 - Schenk, Harald A1 - Kenda, A. A1 - Scherf, W. A1 - Kraft, M. T1 - Miniaturized fourier transform spectrometer Y1 - 2007 ER - TY - GEN A1 - Monsalve, Jorge M. A1 - Jongmanns, Marcel A1 - Koch, Sandro G. A1 - Schenk, Harald T1 - Flow measurement by means of wideband acoustic signals in single-mode waveguides T2 - Journal of sensors and sensor systems N2 - A novel concept of an acoustic flowmeter, based on single-mode waveguides, is proposed, implemented, and analysed in this work. Instead of transmitting a pulse diagonally across the duct's cross-section, this device operates with two ducts that operate simultaneously as pipes and as waveguides. Below the frequency threshold for single-mode propagation, acoustic waves are forced to traverse the waveguides with a plane front, precluding the possibility of beam drifting, inner reflections, and spreading losses. This enables the designer to flexibly increase the sound path and perform a highly sensitive measurement of the flow velocity and speed of sound, even if the excitation frequency is required to be kept below a relatively low value. A device based on this principle was constructed and tested for flow measurements in air. It consists of two waveguides of a circular cross-section (5 mmdiameter) coupled to electroacoustic transducers for the transmission of a wideband chirp (9.8–18.2 kHz). Usage of a wideband signal was possible due to the combined frequency response of a special kind of micromachined ultrasound transducer (MUT) and a commercial micro-electromechanical system (MEMS) microphone. The constructed flowmeter was capable of measuring flow velocities up until the transition to turbulent flow at 16 Lmin-1with a resolution of 0.3 Lmin-1, and it also detected changes of less than 0.2 ms-1in the speed of sound. This topology for flow measurement could prove advantageous for applications where gases of variable composition are conducted in ducts of diameters in the millimetre range. Y1 - 2025 U6 - https://doi.org/10.5194/jsss-14-275-2025 SN - 2194-878X VL - 14 IS - 2 SP - 275 EP - 284 PB - Copernicus Publications CY - Göttingen, Germany ER - TY - GEN A1 - Villasmunta, Francesco A1 - Heise, Patrick A1 - Breiter, Manuela A1 - Schrader, Sigurd A1 - Schenk, Harald A1 - Regehly, Martin A1 - Mai, Andreas T1 - Monolithically integrated optical through-silicon waveguides for 3D chip-to-chip photonic interconnects T2 - IEEE journal of selected topics in quantum electronics N2 - The scaling limitations of electrical interconnects are driving the demand for efficient optical chip-to-chip links. We report the first monolithic integration of air-clad optical through-silicon waveguides in silicon, fabricated via Bosch and cryogenic deep reactive-ion etching. Rib, single-bridge, and double-bridge designs with 50 μm cores and up to 150 μm propagation lengths have been evaluated. Cryogenic-etched rib waveguides achieve the highest median transmission (66%, −1.80 dB), compared to Bosch-etched ribs (62%, −2.08 dB). Across all geometries, 3 dB alignment windows range from 9.3 μm to 49.2 μm, with Bosch-etched double-bridge waveguides providing the broadest tolerance. We show that geometric fidelity outweighs sidewall roughness for transmission and alignment in these large-core, multimode optical through-silicon waveguides. This technology provides a scalable, complementary metal-oxide semiconductor-compatible pathway toward 3D photonic interconnects. KW - Optical interconnections KW - Silicon photonics KW - Three-dimensional integrated circuits KW - Through-silicon vias (TSV) Y1 - 2026 U6 - https://doi.org/10.1109/JSTQE.2025.3615001 SN - 1077-260X SN - 1558-4542 VL - 32 IS - 2: 3-D Horizons in Photonics SP - 1 EP - 15 PB - Institute of Electrical and Electronics Engineers (IEEE) CY - New York, NY ER - TY - PAT A1 - Schenk, Harald A1 - Conrad, Holger T1 - MEMS-Wandler zum Interagieren mit einem Volumenstrom eines Fluids und Verfahren zum Herstellen desselben T1 - MEMS transducer for interacting with a volume flow of a fluid, and method for producing the same N2 - Ein MEMS-Wandler zum Interagieren mit einem Volumenstrom eines Fluids umfasst ein Substrat, das einen Schichtstapel mit einer Mehrzahl von Schichten aufweist, die eine Mehrzahl von Substratebenen bilden, und das eine Kavität in dem Schichtstapel aufweist. Der MEMS-Wandler umfasst ein elektromechanischen Wandler, der mit dem Substrat in der Kavität verbunden ist und ein sich in zumindest einer Bewegungsebene der Mehrzahl von Substratebenen verformbares Element aufweist, wobei eine Verformung des verformbaren Elements in der Bewegungsebene und der Volumenstrom des Fluids kausal zusammenhängen. Der MEMS-Wandler umfasst ein elektronischen Schaltung, die in ei- ner Schicht des Schichtstapels angeordnet ist, wobei die elektronische Schaltung mit dem elektromechanischen Wandler verbunden ist, und die ausgebildet ist, um eine Konvertierung zwischen einer Verformung des verformbaren Elements und einem elektrischen Signal bereitzustellen. Y1 - 2024 ER - TY - PAT A1 - Schenk, Harald A1 - Langa, Sergiu T1 - MEMS-Bauelement und Verfahren zum Herstellen eines MEMS-Bauelements N2 - Ein Verfahren zum Herstellen eines MEMS-Bauelements umfasst ein Bereitstellen eines Halbleitersubstrats, ein Ausführen eines anisotropen nasschemischen Ätzprozesses in dem Halbleitersubstrat, um zumindest ein bewegliches Element aus dem Halbleitersubstrat herauszubilden, und ein Erzeugen eines Schichtstapels, so dass das bewegliche Element in einer Kavität und in einer ersten MEMS-Schicht zwischen einer zweiten MEMS-Schicht und einer dritten MEMS-Schicht angeordnet ist, um mit einem in der Kavität angeordneten Fluid zu interagieren. Y1 - 2023 ER - TY - PAT A1 - Schenk, Harald A1 - Conrad, Holger A1 - Gaudet, Matthieu A1 - Schimmanz, Klaus A1 - Langa, Sergiu A1 - Kaiser, Bert T1 - MEMS transducer for interacting with a volume flow of a fluid and method for manufacturing the same N2 - A MEMS transducer for interacting with a volume flow of a fluid includes a substrate including a cavity, and an electromechanical transducer connected to the substrate in the cavity and including an element deformable along a lateral movement direction, wherein a deformation of the deformable element along the lateral movement direction and the volume flow of the fluid are causally related. Y1 - 2025 ER - TY - PAT A1 - Schenk, Harald A1 - Verma, Satish T1 - Micromachined sensor and method for sensing an analyte Y1 - 2025 ER -