TY - GEN A1 - Schenk, Harald A1 - Narimani, Keyvan A1 - Scholles, Michael A1 - Shashank, Shashank A1 - Langa, Sergiu A1 - Pineda Gomez, Roberto A1 - Ruffert, Christine T1 - Highly Modular Microsystem Inchworm Motor Based on a Nanoscopic Electrostatic Drive T2 - MikroSystemTechnik Kongress 2021 : Mikroelektronik / Mikrosystemtechnik und ihre Anwendungen Innovative Produkte für zukunftsfähige Märkte 08. – 10. November 2021, Stuttgart-Ludwigsburg N2 - We present results for a microsystem inchworm motor based on Nanoscopic Electrostatic Drive (NED) actuators, fabricated by single crystalline silicon bulk micro-machining on a silicon-on-insulator (SOI) wafer. Actuator elements can easily be added to or removed from the inchworm drive allowing a high adaptability of force and contact area with the movable surface as well as an efficient use of the system’s footprint. In principle, travel ranges of several mm can be easily obtained due to very modular design of the system. The presented inchworm drive is capable of controllable motion up to 1 mm and can generate a force of 1.4 mN at 130V corresponding to a force density of 0.8 mN/mm2 with an average maximum DC power consumption of 11.8 muW in each cycle. Furthermore, the voltage-displacement characteristics of the actuator element was validated by finite element method (FEM). Y1 - 2021 UR - https://www.vde-verlag.de/proceedings-de/455656160.html SN - 978-3-8007-5656-8 SN - 978-3-8007-5657-5 PB - VDE e.V. ER - TY - GEN A1 - Schenk, Harald A1 - Villasmunta, Francesco A1 - Steglich, Patrick A1 - Schrader, Sigurd A1 - Mai, Andreas T1 - Numerical Simulation of Optical Through-Silicon Waveguide for 3D Photonic Interconnections T2 - 2021 International Conference on Numerical Simulation of Optoelectronic Devices (NUSOD) N2 - Optical interconnections are a promising step for-ward to overcome the intrinsic limitations of electrical inter-connections in integrated circuits. In this work, we present a finite element method (FEM) simulation study of a dielectric waveguide etched through the full thickness of a silicon substrate. In particular, it is investigated the effect of the bridge-to-core size ratio on the first two supported modes. Then, the influence of the waveguide sidewalls tapering angle on the three-dimensional beam propagation is studied. Such optical through-silicon waveguide (OTSW), if nonadiabatically tapered can provide effective mode size conversion and favour the coupling of external light sources to photonic integrated circuits. Y1 - 2021 UR - https://ieeexplore.ieee.org/document/9541464 SN - 978-1-6654-1276-6 SN - 978-1-6654-4836-9 U6 - https://doi.org/10.1109/NUSOD52207.2021.9541464 SN - 2158-3242 SN - 2158-3234 PB - IEEE ER - TY - GEN A1 - Schenk, Harald A1 - Schweiger, Severin A1 - Koch, Sandro G. T1 - Two-Photon-Lithography Substrate Reflection and Absorption Compensation for Additive Manufacturing of Metamaterials on MEMS T2 - 2021 44th International Spring Seminar on Electronics Technology (ISSE) N2 - Structuring polymers on micro-electro-mechanical-systems (MEMS) for the manufacturing of acoustical and optical metamaterials using the two-photon polymerization process depends on reliable and controllable regulation of the intensity. Reflecting surfaces, diffracting elements and structures with poor heat dissipation can be problematic obstacles for the incident focused and pulsed laser beam. Thermal and optical simulations were performed and compared to test structures. A compensated fabrication approach was successfully applied to create optimized conditions in the polymerized volume. Y1 - 2021 UR - https://ieeexplore.ieee.org/document/9467575 SN - 978-1-6654-1477-7 SN - 978-1-6654-3061-6 U6 - https://doi.org/10.1109/ISSE51996.2021.9467575 SN - 2161-2536 SN - 2161-2528 ER - TY - GEN A1 - Schweiger, Severin A1 - Schulze, Tim F. A1 - Schlipf, Simon A1 - Reinig, Peter A1 - Schenk, Harald T1 - Characterization of two-photon-polymerization lithography structures via Raman spectroscopy and nanoindentation T2 - Journal of Optical Microsystems N2 - Additive manufacturing using two-photon polymerization (TPP) lithography is increasingly used in industry and research. Parameter sweeps of cuboid structures fabricated using TPP lithography were investigated across the parameters of the laser power and scan speed to find dependent mechanical material properties. The employed photoresists were examined using Raman spectroscopy to find the degree of conversion (DC) of monomer to polymer, and subsequently, micro- or nanoindentation was used to find Young’s modulus (E). For the photoresist IP-Dip, the attained DC and E ranged from 20% to 45% and 1 to 2.1 GPa, respectively. The results were compared with reports found in the literature. For IP-Q, the attained DC and E ranged from 53% to 80% and 0.5 to 1.3 GPa, respectively. The characterized properties of IP-Q manifest as the current state of knowledge of the material. Y1 - 2022 U6 - https://doi.org/10.1117/1.jom.2.3.033501 SN - 2708-5260 VL - Vol. 2 IS - 3 ER - TY - PAT A1 - Kurth, Eberhard A1 - Kunath, Christian A1 - Schenk, Harald T1 - Ion-sensitive structure and method for producing the same Y1 - 2023 UR - https://register.dpma.de/DPMAregister/pat/register?AKZ=1020152049213 ER - TY - PAT A1 - Conrad, Holger A1 - Gaudet, Matthieu A1 - Schenk, Harald A1 - Uhlig, Sebastian T1 - Micromechanical devices with mechanical actuators Y1 - 2023 UR - https://www.freepatentsonline.com/11639718.html ER - TY - PAT A1 - Schenk, Harald A1 - Conrad, Holger T1 - MEMS transducer for interacting with a volume flow of a fluid, and method for producing the same Y1 - 2023 UR - https://www.freepatentsonline.com/11554950.html ER - TY - GEN A1 - Monsalve Guaracao, Jorge Mario A1 - Kaiser, Bert A1 - Schenk, Harald T1 - Design of Micromachined Ultrasonic Transducers for Variability with the Sample-Average Approximation Method T2 - Tagungsband MikroSystemTechnik Kongress 2023, Dresden, 23. - 25. Oktober 2023 Y1 - 2023 SN - 978-3-8007-6204-0 SN - 978-3-8007-6203-3 SP - S. 639 PB - VDE Verlag CY - Berlin ER - TY - GEN A1 - Villasmunta, Francesco A1 - Steglich, Patrick A1 - Heinrich, Friedhelm A1 - Villringer, Claus A1 - Mai, Andreas A1 - Schrader, Sigurd A1 - Schenk, Harald T1 - Optical Through-Silicon Waveguides for 3D-Chip-Interconnections N2 - Integrated optical interconnections in silicon chips have the potential to replace electrical interconnects between integrated circuits thanks to their high bandwidth and low energy communication promises. A silicon dielectric waveguide can be etched through the full thickness of a silicon substrate providing a monolithically integrated solution for 2.5D and 3D photonic architectures. The optical through-silicon waveguide design presented here is based on Finite Difference Time Domain simulations, while the fabrication takes advantage of the innovative plasma cryo-etching process that provides smooth sidewalls and tapering angle tunability. Such structures can provide effective mode size conversion, therefore favoring the coupling of external light sources to photonic integrated circuits and the stacking of multiple optically interconnected dies. KW - Integrated Optics KW - Micro Optics KW - Optical Information Transmission Y1 - 2023 UR - https://www.dgao-proceedings.de/abstract/abstract_only.php?id=2920 ER - TY - GEN A1 - Uhlig, Sebastian A1 - Gaudet, Matthieu A1 - Langa, Sergiu A1 - Ruffert, Christine A1 - Jongmanns, Marcel A1 - Schenk, Harald T1 - Highly integrable silicon micropumps using lateral electrostatic bending actuators T2 - Microsystem Technologies N2 - We present the design, fabrication, and characterization of an innovative silicon-based micropump with high potential for portable lab-on-chip (LoC) as well as point-of-care (PoC) applications. The actuators of the pump are electrostatic driven in-plane bending devices, which were presented earlier (Borcia et al. in Phys Rev Fluids 3(8): 084202, 2018. 10.1103/PhysRevFluids.3.084202; Uhlig et al. in Micromachines, 9(4), 2018. 10.3390/mi9040190). This paper presents the characterization results achieved with the micropump. The dielectric non-polar liquid Novec7100™ was used as a test liquid due to its adequate physical properties. When applying a periodic voltage of 130 V, a flow rate of up to 80 µL/min was detected. The counter pressure amounts up to 30 kPa and the correspondent fluidic power (volumetric flow rate times the counter pressure) was calculated to 10 µW. The pump contains passive flap valves at the inlet and outlet, which are based on a bending cantilever design. Depending on the application requirements, the micropump can be designed modularly to adjust the specific parameters by an adequate arrangement of pump base units. In this paper, the proof of principle is shown using a single base unit with different number of stacked NED-actuator beams, as well as the serial arrangement of base units. Both modular concepts target the increase of backpressure of the NED-micropump in an inherently different way compared to conventional membrane micropumps. Y1 - 2024 U6 - https://doi.org/10.1007/s00542-024-05635-w SN - 0946-7076 VL - 30 IS - 8 SP - 949 EP - 960 PB - Springer Science and Business Media LLC ER -