TY - GEN A1 - Jia, Ruolan A1 - Pechmann, Stefan A1 - Markus, Fritscher A1 - Wenger, Christian A1 - Zhang, Lei A1 - Hagelauer, Amelie T1 - Soft-Error Analysis of RRAM 1T1R Compute-In-Memory Core for Artificial Neural Networks T2 - 2024 39th Conference on Design of Circuits and Integrated Systems (DCIS) N2 - This work analyses SEU-induced soft-errors in analog compute-in-memory cores using resistive random-access memory (RRAM) for artificial neural networks, where their bitcells utilize one-transistor-one-RRAM (1T1R) structure. This is modeled by combining the Stanford-PKU RRAM Model and the model of the radiation-induced photocurrent in access transistors. As results, this work derives the maximal RRAM crossbar size without occurring any logic flip and indicates the requirements for RRAM technology to achieve a SEU-resilient 1T1R compute-in memory cores. KW - RRAM Y1 - 2024 U6 - https://doi.org/10.1109/DCIS62603.2024.10769203 SP - 1 EP - 5 PB - IEEE ER - TY - GEN A1 - Perez-Bosch Quesada, Emilio A1 - Mistroni, Alberto A1 - Jia, Ruolan A1 - Dorai Swamy Reddy, Keerthi A1 - Reichmann, Felix A1 - Castan, Helena A1 - Dueñas, Salvador A1 - Wenger, Christian A1 - Perez, Eduardo T1 - Forming and resistive switching of HfO₂-based RRAM devices at cryogenic temperature T2 - IEEE Electron Device Letters N2 - Reliable data storage technologies able to operate at cryogenic temperatures are critical to implement scalable quantum computers and develop deep-space exploration systems, among other applications. Their scarce availability is pushing towards the development of emerging memories that can perform such storage in a non-volatile fashion. Resistive Random-Access Memories (RRAM) have demonstrated their switching capabilities down to 4K. However, their operability at lower temperatures still remain as a challenge. In this work, we demonstrate for the first time the forming and resistive switching capabilities of CMOS-compatible RRAM devices at 1.4K. The HfO2-based devices are deployed following an array of 1-transistor-1-resistor (1T1R) cells. Their switching performance at 1.4K was also tested in the multilevel-cell (MLC) approach, storing up to 4 resistance levels per cell. KW - RRAM Y1 - 2024 U6 - https://doi.org/10.1109/LED.2024.3485873 SN - 0741-3106 VL - 45 IS - 12 SP - 2391 EP - 2394 PB - Institute of Electrical and Electronics Engineers (IEEE) ER - TY - GEN A1 - Perez-Bosch Quesada, Emilio A1 - Rizzi, Tommaso A1 - Gupta, Aditya A1 - Mahadevaiah, Mamathamba Kalishettyhalli A1 - Schubert, Andreas A1 - Pechmann, Stefan A1 - Jia, Ruolan A1 - Uhlmann, Max A1 - Hagelauer, Amelie A1 - Wenger, Christian A1 - Pérez, Eduardo T1 - Multi-Level Programming on Radiation-Hard 1T1R Memristive Devices for In-Memory Computing T2 - 14th Spanish Conference on Electron Devices (CDE 2023), Valencia, Spain, 06-08 June 2023 N2 - This work presents a quasi-static electrical characterization of 1-transistor-1-resistor memristive structures designed following hardness-by-design techniques integrated in the CMOS fabrication process to assure multi-level capabilities in harsh radiation environments. Modulating the gate voltage of the enclosed layout transistor connected in series with the memristive device, it was possible to achieve excellent switching capabilities from a single high resistance state to a total of eight different low resistance states (more than 3 bits). Thus, the fabricated devices are suitable for their integration in larger in-memory computing systems and in multi-level memory applications. Index Terms—radiation-hard, hardness-by-design, memristive devices, Enclosed Layout Transistor, in-memory computing KW - RRAM Y1 - 2023 SN - 979-8-3503-0240-0 U6 - https://doi.org/10.1109/CDE58627.2023.10339525 PB - Institute of Electrical and Electronics Engineers (IEEE) ER -