TY - CHAP A1 - Kot, Małgorzata A1 - Naumann, Franziska A1 - Garain, Samiran A1 - Poźarowska, Emilia A1 - Gargouri, Hassan A1 - Henkel, Karsten A1 - Schmeißer, Dieter T1 - Aluminum nitride films prepared by plasma atomic layer deposition using different plasma sources T2 - Verhandlungen der Deutschen Physikalischen Gesellschaft, Reihe 6, Band 53,3 N2 - Aluminum nitride (AlN) thin films are promising for versatile applications in optoelectronics, electronics, piezoelectrics, and acoustics due to their remarkable properties such as wide band gap, high dielectric constant, low electrical conductivity, good piezoelectric coefficient and high ultrasonic velocity. We present a comparative study of AlN films grown by plasma-enhanced atomic layer deposition at 350°C silicon wafers in the SENTECH SI ALD LL system using TMA and NH3 where either a capacitively coupled plasma (CCP) or a direct PTSA (planar triple spiral antenna) source was applied. The films were characterized by ellipsometry, XPS and electrical measurements. The layer properties are discussed concerning the varied ALD process parameters. In general, the process using the direct PTSA source delivered films with higher refractive index and better homogeneity over the wafer achieving also higher growth rates per cycle (GPC) in reduced total cycle durations. Films with refractive index in the range of 2.05 and permittivity around 8 could be realized with a GPC of 1.54 Å/cycle. KW - Aluminium nitride KW - plasma-enhanced atomic layer deposition (PEALD) KW - ellispsometry KW - field emission scanning electron microscopy KW - atomic force microscopy KW - X-ray photoelectron spectroscopy KW - electrical characterization Y1 - 2018 SN - 0420-0195 SP - S. 170 PB - Deutsche Physikalische Gesellschaft CY - Bad Honnef ER -