TY - GEN A1 - Kot, Małgorzata A1 - Henkel, Karsten A1 - Naumann, Franziska A1 - Gargouri, Hassan A1 - Tarnawska, Lidia Lupina A1 - Wilker, Viola A1 - Kus, Peter A1 - Pożarowska, Emilia A1 - Garain, Samiran A1 - Rouissi, Zied A1 - Schmeißer, Dieter T1 - Comparison of plasma-enhanced atomic layer deposition AlN films prepared with different plasma sources T2 - Journal of Vacuum Science and Technology A N2 - A comparative study of thin aluminum nitride (AlN) films deposited by plasma-enhanced atomic layer deposition in the SENTECH SI ALD LL system applying either a direct inductively coupled plasma (ICP) or an indirect capacitively coupled plasma (CCP) source is presented. The films prepared with the ICP source (based on a planar triple spiral antenna) exhibit improved properties concerning the growth rate per cycle, total cycle duration, homogeneity, refractive index, fixed and mobile electrical charges, and residual oxygen content compared to the CCP source, where the comparison is based on the applied plasma power of 200 W. The increase of the plasma power to 600 W in the ICP process significantly reduces the residual oxygen content and enhances the electrical breakdown field. The AlN layers grown under these conditions, with a growth rate per cycle of 1.54 Å/cycle, contain residual oxygen and carbon concentrations of about 10% and 4%, respectively, and possess a refractive index of 2.07 (at 632.8 nm). KW - Plamsa-enhanced atomic layer deposition (PEALD) KW - inductively coupled KW - capacitively coupled KW - plamsa source KW - ellipsometry KW - X-ray photoelectron spectroscopy (XPS) KW - X-ray diffraction (XRD) KW - Field emission scanning electron microscopy (FESEM) KW - capacitance-voltage (CV) KW - atomic force microscopy Y1 - 2019 U6 - https://doi.org/10.1116/1.5079628 SN - 0734-2101 SN - 1520-8559 VL - 37 IS - 2 ER -