TY - GEN A1 - Schenk, Harald A1 - Villasmunta, Francesco A1 - Steglich, Patrick A1 - Schrader, Sigurd A1 - Mai, Andreas T1 - Numerical Simulation of Optical Through-Silicon Waveguide for 3D Photonic Interconnections T2 - 2021 International Conference on Numerical Simulation of Optoelectronic Devices (NUSOD) N2 - Optical interconnections are a promising step for-ward to overcome the intrinsic limitations of electrical inter-connections in integrated circuits. In this work, we present a finite element method (FEM) simulation study of a dielectric waveguide etched through the full thickness of a silicon substrate. In particular, it is investigated the effect of the bridge-to-core size ratio on the first two supported modes. Then, the influence of the waveguide sidewalls tapering angle on the three-dimensional beam propagation is studied. Such optical through-silicon waveguide (OTSW), if nonadiabatically tapered can provide effective mode size conversion and favour the coupling of external light sources to photonic integrated circuits. Y1 - 2021 UR - https://ieeexplore.ieee.org/document/9541464 SN - 978-1-6654-1276-6 SN - 978-1-6654-4836-9 U6 - https://doi.org/10.1109/NUSOD52207.2021.9541464 SN - 2158-3242 SN - 2158-3234 PB - IEEE ER - TY - GEN A1 - Villasmunta, Francesco A1 - Steglich, Patrick A1 - Heinrich, Friedhelm A1 - Villringer, Claus A1 - Mai, Andreas A1 - Schrader, Sigurd A1 - Schenk, Harald T1 - Optical Through-Silicon Waveguides for 3D-Chip-Interconnections N2 - Integrated optical interconnections in silicon chips have the potential to replace electrical interconnects between integrated circuits thanks to their high bandwidth and low energy communication promises. A silicon dielectric waveguide can be etched through the full thickness of a silicon substrate providing a monolithically integrated solution for 2.5D and 3D photonic architectures. The optical through-silicon waveguide design presented here is based on Finite Difference Time Domain simulations, while the fabrication takes advantage of the innovative plasma cryo-etching process that provides smooth sidewalls and tapering angle tunability. Such structures can provide effective mode size conversion, therefore favoring the coupling of external light sources to photonic integrated circuits and the stacking of multiple optically interconnected dies. KW - Integrated Optics KW - Micro Optics KW - Optical Information Transmission Y1 - 2023 UR - https://www.dgao-proceedings.de/abstract/abstract_only.php?id=2920 ER - TY - GEN A1 - Villasmunta, Francesco A1 - Steglich, Patrick A1 - Villringer, Claus A1 - Schrader, Sigurd A1 - Schenk, Harald A1 - Mai, Andreas A1 - Regehly, Martin ED - Schröder, Henning ED - Chen, Ray T. T1 - Design, fabrication, and characterization of integrated optical through-silicon waveguides for 3D photonic interconnections T2 - Optical Interconnects XXIV Y1 - 2024 U6 - https://doi.org/10.1117/12.3003146 PB - SPIE ER -