TY - GEN A1 - Naumann, Franziska A1 - Reck, Johanna A1 - Gargouri, Hassan A1 - Gruska, Bernd A1 - Blümich, Adrian A1 - Mahmoodinezhad, Ali A1 - Janowitz, Christoph A1 - Henkel, Karsten A1 - Flege, Jan Ingo T1 - In situ real-time and ex situ spectroscopic analysis of Al₂O₃ films prepared by plasma enhanced atomic layer deposition T2 - Journal of Vacuum Science and Technology B N2 - In situ real-time ellipsometry (irtE) with a very high time resolution of 24 ms was applied to monitor the inductively coupled plasma enhanced atomic layer deposition (ALD) process of Al₂O₃ thin films to precisely resolve each step of the ALD process and its complete cycle. The influence of plasma power, plasma pulse duration, and deposition temperature on the film growth characteristics was investigated. Ex situ ellipsometry [UV-VIS-NIR-SE (ultraviolet-visible-nearinfrared-spectroscopic ellipsometry) and IR-SE (infrared spectroscopic ellipsometry)] and x-ray photoelectron spectroscopy revealed the bulk properties (thickness, refractive index, chemical composition, and carbon incorporation) of the films, which together with the in situ results are compared to those of the films prepared by thermal ALD (T-ALD). The ICPEALD (inductively coupled plasma enhanced ALD) films were deposited at substrate temperatures between 80 and 250 °C and the role of plasma power (50–300 W) and its pulse duration (1–20 s) was investigated at 250 °C. The reference T-ALD layers were prepared at 200 °C. The ICPEALD process of Al₂O₃ shows an increased growth rate, and the produced films exhibit higher carbon contaminations than the T-ALD Al₂O₃ films. Plasma pulse times of up to 15 s further increase the content of carbon and CH species; at the same time, the refractive index decreases. The optical properties of ICPEALD deposited Al₂O₃ films are comparable with those of the T-ALD films for low plasma power and short plasma pulse durations. For the ICPEALD films, UV absorption is found and it is dependent on the deposition parameters. irtE resolves process effects that correlate with the bulk properties of Al₂O₃, such as impurities and oxygen deficiencies. KW - Plamsa enhanced atomic layer deposition (PEALD) KW - spectroscopic ellipsometry KW - X-ray photoelectron spectroscopy KW - real-time monitoring KW - aluminum oxide (Al₂O₃) Y1 - 2020 U6 - https://doi.org/10.1116/1.5122797 SN - 0734-211X SN - 1071-1023 SN - 2166-2746 SN - 2166-2754 VL - 38 IS - 1 ER - TY - GEN A1 - Mahmoodinezhad, Ali A1 - Janowitz, Christoph A1 - Naumann, Franziska A1 - Plate, Paul A1 - Gargouri, Hassan A1 - Henkel, Karsten A1 - Schmeißer, Dieter A1 - Flege, Jan Ingo T1 - Low-temperature growth of gallium oxide thin films by plasma-enhanced atomic layer deposition T2 - Journal of Vacuum Science and Technology A N2 - Gallium oxide (Ga2O3) thin films were deposited by plasma-enhanced atomic layer deposition (PEALD) applying a capacitively coupled plasma source where trimethylgallium (TMGa) as the gallium precursor and oxygen (O2) plasma were used in a substrate temperature (Ts)in the range of 80–200 °C. TMGa exhibits high vapor pressure and therefore facilitates deposition at lower substrate temperatures. The Ga2O3 films were characterized by spectroscopic ellipsometry (SE), x-ray photoelectron spectroscopy (XPS), and capacitance-voltage (C-V) measurements. The SE data show linear thickness evolution with a growth rate of ∼0.66 Å per cycle and inhomogeneity of ≤2% for all samples. The refractive index of the Ga2O3 thin films is 1.86 ± 0.01 (at 632.8 nm) and independent of temperature, whereas the bandgap slightly decreases from 4.68 eV at Ts of 80 °C to 4.57 eV at 200 °C. XPS analysis revealed ideal stoichiometric gallium to oxygen ratios of 2:3 for the Ga2O3 layers with the lowest carbon contribution of ∼10% for the sample prepared at 150 °C. The permittivity of the layers is 9.7 ± 0.2 (at 10 kHz). In addition, fixed and mobile oxide charge densities of 2–4E12 and 1–2E12 cm−2, respectively, were observed in the C-V characteristics. Moreover, the Ga2O3 films show breakdown fields in the range of 2.2–2.7 MV/cm. Excellent optical and electrical material properties are maintained even at low substrate temperatures as low as 80 °C. Hence, the TMGa/O2 PEALD process is suitable for electronic and optoelectronic applications where low-temperature growth is required. KW - Plamsa enhanced atomic layer deposition (PEALD) KW - low-temperature growth KW - gallium oxide (Ga2O3) KW - x-ray photoelectron spectroscopy KW - spectroscopic ellipsometry KW - capacitance voltage measurements Y1 - 2020 U6 - https://doi.org/10.1116/1.5134800 SN - 0734-2101 SN - 1520-8559 VL - 38 IS - 2 ER - TY - GEN A1 - Janowitz, Christoph A1 - Mahmoodinezhad, Ali A1 - Naumann, Franziska A1 - Plate, Paul A1 - Henkel, Karsten A1 - Flege, Jan Ingo T1 - XPS and UPS investigation of an ALD prepared Al2O3/ZnO heterojunction T2 - Verhandlungen der DPG - SurfaceScience21 N2 - The band alignment of two large band gap oxides was studied by a combination of XPS and UPS using consecutive sputter steps to unravel the electronic structure and elemental composition of each layer and the interface region. An Al2O3/ZnO heterointerface (10 nm Al2O3 on 59 nm ZnO) was grown on top of a Si single crystal substrate by consecutive thermal and plasma-assisted atomic layer deposition (ALD) respectively. The valence band maximum of Al2O3 was found to be 1.1 eV below that of ZnO, the conduction band minimum 2.3 eV above, resulting in a type-I staggered heterojunction. A reduction of ZnO to elemental Zn in the interface region was detected by the apparent shoulder of the Zn 2p and 2s core levels and by the Zn LMM Auger. This suggests an ALD interface formation mechanism different from previous models identified for other heterointerfaces. KW - X-ray photoelectron spectroscopy KW - ultraviolet photoelectron spectroscopy KW - atomic layer deposition KW - large bandgap materials KW - band offsets Y1 - 2021 UR - https://www.dpg-verhandlungen.de/year/2021/conference/surfacescience/part/o/session/74/contribution/4 VL - 2021 PB - Deutsche Physikalische Gesellschaft e.V. CY - Bad Honnef ER - TY - GEN A1 - Mahmoodinezhad, Ali A1 - Morales, Carlos A1 - Naumann, Franziska A1 - Plate, Paul A1 - Meyer, Robert A1 - Janowitz, Christoph A1 - Henkel, Karsten A1 - Kot, Małgorzata A1 - Flege, Jan Ingo T1 - Low-temperature atomic layer deposition of indium oxide thin films using trimethylindium and oxygen plasma T2 - Verhandlungen der DPG - SurfaceScience21 N2 - Indium oxide thin films were deposited on Si (100) by plasma-enhanced atomic layer deposition (PEALD) using trimethylindium (TMIn) and oxygen plasma (O2) in a low-temperature range of 80 to 200 °C. The In2O3 layers were characterized by in-situ spectroscopic ellipsometry (SE), ex-situ X-ray photoelectron spectroscopy (XPS) and electrical measurements. The SE data show a growth rate of 0.56 Å/cycle within the ALD window (100 to 150 °C) with a thickness inhomogeneity of ≤1.2%. In addition, the highest refractive index is 2.07 (at 632.8 nm) for the layer grown at 150 °C, and the films exhibit indirect and direct band gaps of 2.8±0.1 eV and 3.3±0.2 eV, respectively. XPS characterization indicates no carbon incorporation and a temperature-dependent off-stoichiometry of the layers. The chemical analysis of the In 3d and O 1s core levels confirms the formation of In-O bonds and suggests the additional presence of hydroxyl groups and defects. With increasing temperature, the contribution of OH groups and defects decreases whereas that of In-O bonds increases. Notably, higher growth temperatures result in an indium rich phase within the layers. KW - Indium oxide KW - Plasma enhanced atomic layer deposition KW - Spectroscopic ellipsometry KW - X-ray photoelectron spectroscopy Y1 - 2021 UR - https://www.dpg-verhandlungen.de/year/2021/conference/surfacescience/part/o/session/74/contribution/8 VL - 2021 PB - Deutsche Physikalische Gesellschaft e.V. CY - Bad Honnef ER - TY - GEN A1 - Mahmoodinezhad, Ali A1 - Morales, Carlos A1 - Naumann, Franziska A1 - Plate, Paul A1 - Meyer, Robert A1 - Janowitz, Christoph A1 - Henkel, Karsten A1 - Kot, Małgorzata A1 - Zöllner, Marvin Hartwig A1 - Wenger, Christian A1 - Flege, Jan Ingo T1 - Low-temperature atomic layer deposition of indium oxide thin films using trimethylindium and oxygen plasma T2 - Journal of Vacuum Science and Technology A N2 - Indium oxide (InxOy) thin films were deposited by plasma-enhanced atomic layer deposition (PEALD) using trimethylindium and oxygen plasma in a low-temperature range of 80–200 °C. The optical properties, chemical composition, crystallographic structure, and electrical characteristics of these layers were investigated by spectroscopic ellipsometry (SE), x-ray photoelectron spectroscopy (XPS), x-ray diffraction (XRD), as well as current-voltage and capacitance-voltage measurements. The SE results yielded a nearly constant growth rate of 0.56 Å per cycle and a thickness inhomogeneity of ≤1.2% across 4-in. substrates in the temperature range of 100–150 °C. The refractive index (at 632.8 nm) was found to be 2.07 for the films deposited at 150 °C. The PEALD-InxOy layers exhibit a direct (3.3 ± 0.2 eV) and an indirect (2.8 ± 0.1 eV) bandgap with an uptrend for both with increasing substrate temperature. Based on XPS characterization, all InxOy samples are free of carbon impurities and show a temperature-dependent off-stoichiometry indicating oxygen vacancies. XRD diffraction patterns demonstrate an onset of crystallization at 150 °C. Consistent with the optical, XPS, and XRD data, the films deposited at ≥150 °C possess higher electrical conductivity. Our findings prove that a low-temperature PEALD process of InxOy is feasible and promising for a high-quality thin-film deposition without chemical impurities on thermally fragile substrates. KW - Indium oxide KW - Plasma-enhanced atomic layer deposition KW - X-ray photoelectron spectroscopy KW - Ellipsometry KW - X-ray diffraction KW - Electrical properties Y1 - 2021 U6 - https://doi.org/10.1116/6.0001375 SN - 0734-2101 SN - 1520-8559 VL - 39 IS - 6 ER - TY - GEN A1 - Janowitz, Christoph A1 - Mahmoodinezhad, Ali A1 - Kot, Małgorzata A1 - Morales, Carlos A1 - Naumann, Franziska A1 - Plate, Paul A1 - Zöllner, Marvin Hartwig A1 - Bärwolf, Florian A1 - Stolarek, David A1 - Wenger, Christian A1 - Henkel, Karsten A1 - Flege, Jan Ingo T1 - Toward controlling the Al2O3/ZnO interface properties by in situ ALD preparation T2 - Dalton Transactions N2 - An Al2O3/ZnO heterojunction was grown on a Si single crystal substrate by subsequent thermal and plasma-assisted atomic layer deposition (ALD) in situ. The band offsets of the heterointerface were then studied by consecutive removal of the layers by argon sputtering, followed by in situ X-ray photoelectron spectroscopy. The valence band maximum and conduction band minimum of Al2O3 are found to be 1.1 eV below and 2.3 eV above those of ZnO, resulting in a type-I staggered heterojunction. An apparent reduction of ZnO to elemental Zn in the interface region was detected in the Zn 2p core level and Zn L3MM Auger spectra. This suggests an interface formation different from previous models. The reduction of ZnO to Zn in the interface region accompanied by the creation of oxygen vacancies in ZnO results in an upward band bending at the interface. Therefore, this study suggests that interfacial properties such as the band bending as well as the valence and conduction band offsets should be in situ controllable to a certain extent by careful selection of the process parameters. KW - ALD heterojunction KW - band alignement KW - ZnO KW - Al2O3 KW - interface properties Y1 - 2022 U6 - https://doi.org/10.1039/D1DT04008A SN - 1477-9234 SN - 1477-9226 VL - 51 SP - 9291 EP - 9301 ER - TY - GEN A1 - Morales, Carlos A1 - Plate, Paul A1 - Marth, Ludwig A1 - Naumann, Franziska A1 - Kot, Małgorzata A1 - Janowitz, Christoph A1 - Kus, Peter A1 - Zöllner, Marvin Hartwig A1 - Wenger, Christian A1 - Henkel, Karsten A1 - Flege, Jan Ingo T1 - Bottom-up design of a supercycle recipe for atomic layer deposition of tunable Indium Gallium Zinc Oxide thin films T2 - ACS Applied Electronic Materials N2 - We present a successful bottom-up approach to design a generic plasma-enhanced atomic layer deposition (PEALD) supercycle recipe to grow high-quality indium gallium zinc oxide (IGZO) thin films with tunable composition at a relatively low temperature of 150 °C. In situ real-time ellipsometric characterization in combination with ex situ complementary techniques has been used to optimize the deposition process and quality of the films by identifying and solving growth challenges such as degree of oxidation, nucleation delays, or elemental composition. The developed supercycle approach enables facile control of the target composition by adapting the subcycle ratios within the supercycle process. Compared to other low-temperature deposition techniques resulting in amorphous films, our PEALD–IGZO process at 150 °C results in nearly amorphous, nanocrystalline films. The preparation of IGZO films at low temperature by a supercycle PEALD approach allows controlling the thickness, composition, and electrical properties while preventing thermally induced segregation. KW - IGZO KW - PEALD KW - supercycle KW - XPS depth profiling KW - current density Y1 - 2024 U6 - https://doi.org/10.1021/acsaelm.4c00730 SN - 2637-6113 VL - 6 IS - 8 SP - 5694 EP - 5704 PB - American Chemical Society (ACS) ER -