TY - THES A1 - Meyer, Moritz Andreas T1 - Effects of advanced process approaches on electromigration degradation of Cu on-chip interconnects KW - Elektromigration Y1 - 2007 U6 - http://nbn-resolving.de/urn/resolver.pl?urn:nbn:de:kobv:co1-opus-3509 UR - http://opus4.kobv.de/opus4-btu/frontdoor/index/index/docId/343 ER - TY - GEN A1 - Zschech, Ehrenfried A1 - Ho, O. S. A1 - Schmeißer, Dieter A1 - Meyer, Moritz Andreas A1 - Vairagar, A. V. A1 - Schneider, G. A1 - Hauschildt, Meike A1 - Kraatz, Matthias A1 - Sukharev, V. T1 - Geometry and Microstructure Effect on EM-Induced Copper Interconnect Degradation T2 - IEEE Transactions on Device and Materials Reliability KW - Microstructure Y1 - 2009 UR - http://ieeexplore.ieee.org/xpls/icp.jsp?arnumber=4796372 SN - 1530-4388 VL - 9 IS - 1 SP - 20 EP - 30 ER - TY - GEN A1 - Ho, Paul S. A1 - Zschech, Ehrenfried A1 - Schmeißer, Dieter A1 - Meyer, Moritz Andreas A1 - Huebner, Rene A1 - Hauschildt, Meike A1 - Zhang, Lijuan A1 - Gall, Martin A1 - Kraatz, Matthias T1 - Scaling effects on microstructure and reliability for cu interconnects KW - scaling KW - microstructure KW - interconnects Y1 - 2010 ER -