TY - GEN A1 - Mai, Christian A1 - Marschmeyer, Steffen A1 - Peczek, Anna A1 - Kroh, Aleksandra A1 - Jose, Josmy A1 - Reiter, Sebastian A1 - Fischer, Inga Anita A1 - Wenger, Christian A1 - Mai, Andreas T1 - Integration Aspects of Plasmonic TiN-based Nano-Hole-Arrays on Ge Photodetectorsin a 200mm Wafer CMOS Compatible Silicon Technology T2 - ECS Transactions N2 - In this work we present the progress in regard to the integration of a surface plasmon resonance refractive index sensor into a CMOS compatible 200 mm wafer silicon-based technology. Our approach pursues the combination of germanium photodetectors with metallic nanohole arrays. The paper is focused on the technology development to fabricate large area photodetectors based on a modern design concept. In a first iteration we achieved a leakage current density of 82 mA/cm2 at reverse bias of 0.5 V and a maximum optical responsivity of 0.103 A/W measured with TE polarized light at λ = 1310 nm and a reversed bias of 1 V. For the realization of nanohole arrays we used thin Titanium nitride (TiN) layers deposited by a sputtering process. We were able to produce very homogenous TiN layers with a thickness deviation of around 10 % and RMS of 1.413 nm for 150 nm thick TiN layers. KW - plasmonics KW - nanohole array KW - germanium detector Y1 - 2022 U6 - https://doi.org/10.1149/10904.0035ecst SN - 1938-5862 VL - 109 IS - 4 SP - 35 EP - 46 ER - TY - GEN A1 - Reiter, Sebastian A1 - Sengül, Akant A1 - Mai, Christian A1 - Spirito, Davide A1 - Wenger, Christian A1 - Fischer, Inga Anita T1 - On-chip refractive index sensors based on plasmonic TiN Nanohole Arrays T2 - 2024 IEEE Silicon Photonics Conference (SiPhotonics) Y1 - 2024 SN - 979-8-3503-9404-7 SN - 979-8-3503-9405-4 U6 - https://doi.org/10.1109/SiPhotonics60897.2024.10544048 SN - 1949-209X ER - TY - GEN A1 - Jose, Josmy A1 - Mai, Christian A1 - Wenger, Christian A1 - Fischer, Inga Anita T1 - Integration concept of plasmonic TiN nanohole arrays in a 200 mm BiCMOS Si technology for refractive index sensor applications T2 - iCCC2024 - iCampµs Cottbus Conference Y1 - 2024 U6 - https://doi.org/10.5162/iCCC2024/7.2 SP - 96 EP - 99 ER - TY - GEN A1 - Mai, Christian A1 - Peczek, Anna A1 - Kroh, Aleksandra A1 - Jose, Josmy A1 - Reiter, Sebastian A1 - Wenger, Christian A1 - Fischer, Inga Anita T1 - Towards a CMOS compatible refractive index sensor: cointegration of TiN nanohole arrays and Ge photodetectors in a 200 mm wafer silicon technology T2 - Optics Express N2 - In this work, we present the monolithic integration of a TiN nanohole array and a Ge photodetector towards a CMOS compatible fabrication of a refractive index sensor in a 200 mm wafer silicon technology. We developed a technology process that enables fabrication with high yields of around 90%. Ge photodetectors with a Ge layer thickness of 450 nm and an area of 1600 µm2 (40 µm x 40 µm) show dark current densities of around 129 mA/cm2 and responsivities of 0.114 A/W measured by top illumination (TE polarization; λ = 1310 nm; angle of incidence = 14 °) at a reverse bias of 1 V. Nanohole arrays were structured in a 150 nm thick TiN layer. They were integrated into the back end of line and placed spatially close to the Ge photodetectors. After the metallization, passivation, and pad opening, the nanohole arrays were released with the help of an amorphous silicon stop layer. A significant impact of the TiN nanohole arrays on the optical behavior of the photodetector could be proven on the wafer level. Photocurrent measurements by top illumination confirm a strong dependence of optical properties on the polarization of the incident light and the nanohole array design. We demonstrate very stable photocurrents on the wafer level with a standard deviation of σ < 6%. KW - plasmonics KW - sensor KW - nano hole array Y1 - 2024 U6 - https://doi.org/10.1364/OE.530081 SN - 1094-4087 VL - 32 IS - 17 SP - 29099 EP - 29111 PB - Optica Publishing Group ER - TY - GEN A1 - Reiter, Sebastian A1 - Han, Weijia A1 - Mai, Christian A1 - Spirito, Davide A1 - Jose, Josmy A1 - Zöllner, Marvin Hartwig A1 - Fursenko, Oksana A1 - Schubert, Markus Andreas A1 - Stemmler, Ivo A1 - Wenger, Christian A1 - Fischer, Inga Anita T1 - Titanium Nitride Plasmonic Nanohole Arrays for CMOS-compatible integrated refractive index sensing: influence of layer thickness on optical properties T2 - Plasmonics Y1 - 2023 U6 - https://doi.org/10.1007/s11468-023-01810-3 SN - 1557-1963 SP - 1 EP - 13 ER - TY - GEN A1 - Han, Weijia A1 - Reiter, Sebastian A1 - Schlipf, Jon A1 - Mai, Christian A1 - Spirito, Davide A1 - Jose, Josmy A1 - Wenger, Christian A1 - Fischer, Inga Anita T1 - Strongly enhanced sensitivities of CMOS compatible plasmonic titanium nitride nanohole arrays for refractive index sensing under oblique incidence T2 - Optics Express N2 - Titanium nitride (TiN) is a complementary metal-oxide-semiconductor (CMOS) compatible material with large potential for the fabrication of plasmonic structures suited for device integration. However, the comparatively large optical losses can be detrimental for application. This work reports a CMOS compatible TiN nanohole array (NHA) on top of a multilayer stack for potential use in integrated refractive index sensing with high sensitivities at wavelengths between 800 and 1500 nm. The stack, consisting of the TiN NHA on a silicon dioxide (SiO2) layer with Si as substrate (TiN NHA/SiO2/Si), is prepared using an industrial CMOS compatible process. The TiN NHA/SiO2/Si shows Fano resonances in reflectance spectra under oblique excitation, which are well reproduced by simulation using both finite difference time domain (FDTD) and rigorous coupled-wave analysis (RCWA) methods. The sensitivities derived from spectroscopic characterizations increase with the increasing incident angle and match well with the simulated sensitivities. Our systematic simulation-based investigation of the sensitivity of the TiN NHA/SiO2/Si stack under varied conditions reveals that very large sensitivities up to 2305 nm per refractive index unit (nm RIU−1) are predicted when the refractive index of superstrate is similar to that of the SiO2 layer. We analyze in detail how the interplay between plasmonic and photonic resonances such as surface plasmon polaritons (SPPs), localized surface plasmon resonances (LSPRs), Rayleigh Anomalies (RAs), and photonic microcavity modes (Fabry-Pérot resonances) contributes to this result. This work not only reveals the tunability of TiN nanostructures for plasmonic applications but also paves the way to explore efficient devices for sensing in broad conditions. KW - TiN KW - Plasmonics Y1 - 2023 U6 - https://doi.org/10.1364/OE.481993 SN - 1094-4087 VL - 31 IS - 11 SP - 17389 EP - 17407 ER - TY - GEN A1 - Reiter, Sebastian A1 - Ratzke, Markus A1 - Nitsch, Paul-Gregor A1 - Mai, Christian A1 - Spirito, Davide A1 - Corley-Wiciak, Agnieszka Anna A1 - Wenger, Christian A1 - Fischer, Inga A. T1 - Optical response of titanium nitride plasmonic nanohole arrays : impact of square and hexagonal array geometry, pitch, and nanohole diameter T2 - Plasmonics N2 - Plasmonic nanohole arrays (NHAs) exhibit extraordinary optical transmission (EOT) evoked by resonant excitation of surface plasmons at an excitation wavelength, which is highly sensitive to changes in refractive index in the surrounding dielectric. This can enable the use of plasmonic NHAs in on-chip refractive index sensors. Such sensors can be realized on the cost-effective silicon platform by the integration of a plasmonic NHA and a Ge photodetector, provided that complementary metal–oxide–semiconductor (CMOS)-compatible materials are used for their fabrication. Titanium nitride (TiN) as a biocompatible and CMOS-compatible plasmonic transition metal nitride is well-suited for integration on the silicon platform; however, the comparatively large losses within the material require geometry optimization strategies in order to improve the optical properties of TiN NHAs for sensing. In this work, we investigated different TiN NHA geometries both in experiment and simulation. We extensively characterized square and hexagonal arrays with varying pitches and nanohole diameters and provide a detailed comparison of their optical properties. We also discuss characterization results for surface refractive index changes imposed by depositing a thin Al2O3 layer on top of the NHAs. While we do not observe a clear advantage of hexagonal arrays compared to square arrays for sensing, our results highlight the importance of geometry optimization for TiN NHAs integrated with devices. KW - Plasmonic nanohole array KW - Titanium nitride KW - Hexagonal array KW - Square array KW - Nanohole diameters Y1 - 2025 UR - https://link.springer.com/article/10.1007/s11468-025-02934-4 U6 - https://doi.org/10.1007/s11468-025-02934-4 VL - 20 SP - 8825 EP - 8834 PB - Springer CY - New York, NY ER - TY - GEN A1 - Pechmann, Stefan A1 - Mai, Timo A1 - Völkel, Matthias A1 - Mahadevaiah, Mamathamba Kalishettyhalli A1 - Pérez, Eduardo A1 - Perez-Bosch Quesada, Emilio A1 - Reichenbach, Marc A1 - Wenger, Christian A1 - Hagelauer, Amelie T1 - A Versatile, Voltage-Pulse Based Read and Programming Circuit for Multi-Level RRAM Cells T2 - Electronics N2 - In this work, we present an integrated read and programming circuit for Resistive Random Access Memory (RRAM) cells. Since there are a lot of different RRAM technologies in research and the process variations of this new memory technology often spread over a wide range of electrical properties, the proposed circuit focuses on versatility in order to be adaptable to different cell properties. The circuit is suitable for both read and programming operations based on voltage pulses of flexible length and height. The implemented read method is based on evaluating the voltage drop over a measurement resistor and can distinguish up to eight different states, which are coded in binary, thereby realizing a digitization of the analog memory value. The circuit was fabricated in the 130 nm CMOS process line of IHP. The simulations were done using a physics-based, multi-level RRAM model. The measurement results prove the functionality of the read circuit and the programming system and demonstrate that the read system can distinguish up to eight different states with an overall resistance ratio of 7.9. KW - RRAM KW - Multilevel switching KW - Programming circuit Y1 - 2021 U6 - https://doi.org/10.3390/electronics10050530 SN - 2079-9292 VL - 10 IS - 5 ER - TY - GEN A1 - Mahadevaiah, Mamathamba Kalishettyhalli A1 - Pérez, Eduardo A1 - Lisker, Marco A1 - Schubert, Markus Andreas A1 - Perez-Bosch Quesada, Emilio A1 - Wenger, Christian A1 - Mai, Andreas T1 - Modulating the Filamentary-Based Resistive Switching Properties of HfO2 Memristive Devices by Adding Al2O3 Layers T2 - Electronics : open access journal N2 - The resistive switching properties of HfO2 based 1T-1R memristive devices are electrically modified by adding ultra-thin layers of Al2O3 into the memristive device. Three different types of memristive stacks are fabricated in the 130 nm CMOS technology of IHP. The switching properties of the memristive devices are discussed with respect to forming voltages, low resistance state and high resistance state characteristics and their variabilities. The experimental I–V characteristics of set and reset operations are evaluated by using the quantum point contact model. The properties of the conduction filament in the on and off states of the memristive devices are discussed with respect to the model parameters obtained from the QPC fit. KW - RRAM KW - HfO2 KW - filamentary switching Y1 - 2022 U6 - https://doi.org/10.3390/electronics11101540 SN - 2079-9292 VL - 11 IS - 10 ER - TY - GEN A1 - Lukosius, Mindaugas A1 - Lukose, Rasuolė A1 - Lisker, Marco A1 - Luongo, G. A1 - Elviretti, M. A1 - Mai, Andreas A1 - Wenger, Christian T1 - Graphene Research in 200 mm CMOS Pilot Line T2 - 45th Jubilee International Convention on Information, Communication and Electronic Technology (MIPRO), 2022 N2 - Due to the unique electronic structures, graphene and other 2D Materials are considered as materials which can enable and extend the functionalities and performance in a large variety of applications, among them in microelectronics. At this point, the investigation and preparation of graphene devices in conditions resembling as close as possible the Si technology environment is of highest importance.Towards these goals, this paper focuses on the full spectra of graphene research aspects in 200mm pilot line. We investigated different process module developments such as CMOS compatible growth of high quality graphene on germanium and its growth mechanisms, transfer related challenges on target substrates, patterning, passivation and various concepts of contacting of graphene on a full 200 mm wafers. Finally, we fabricated proof-of-concept test structures e.g. TLM, Hall bars and capacitor structures to prove the feasibility of graphene processing in the pilot line of IHP. KW - Graphene KW - CMOS Y1 - 2022 SN - 978-953-233-103-5 SN - 978-953-233-102-8 SN - 978-1-6654-8434-3 U6 - https://doi.org/10.23919/MIPRO55190.2022.9803362 SN - 2623-8764 SN - 1847-3938 SP - 113 EP - 117 ER -