TY - GEN A1 - Lukosius, Mindaugas A1 - Lukose, Rasuolė A1 - Dubey, P. K. A1 - Raju, A. I. A1 - Capista, Daniele A1 - Lisker, Marco A1 - Mai, A. A1 - Wenger, Christian T1 - Graphene for photonic applications T2 - 2024 47th MIPRO ICT and Electronics Convention (MIPRO) N2 - Integrating graphene into Silicon Complementary Metal-Oxide-Semiconductor (CMOS) technology for photonic applications holds immense promise, but it encounters challenges in establishing large-scale graphene processes. These challenges encompass growth through techniques like Chemical Vapor Deposition (CVD), transfer, encapsulation, and contact formation within a routine 200mm wafer pilot line typically utilized for integrated circuit fabrication. This study is dedicated to exploring various facets of graphene research within a 200 mm pilot line, with a focus on overcoming challenges through the fabrication of proof-of-concept photonic graphene-based devices. The synthesis of graphene targeted epi-Ge(100)/Si(100) substrates, grown within the IHP pilot line, showcasing the potential for high-quality graphene deposition across 200mm wafers. Alternatively, employing different orientations such as (110) has been explored to enhance graphene mobility, achieving a remarkable mobility of 2300 cm 2 /Vs at present. The study systematically investigates graphene quality, thickness, and homogeneity utilizing techniques such as Raman spectroscopy, Atomic Force Microscopy (AFM), and Scanning Electron Microscopy (SEM). Additionally, simulations and fabrication of the graphene ring modulators have been conducted at both the component and device levels, incorporating realistic graphene properties. These results indicate a modulation depth of 1.6 dB/μm and a 3dB bandwidth of 7 GHz, showcasing the potential of graphene-based photonic devices for high-speed communication applications. KW - Graphene Y1 - 2024 SN - 979-8-3503-8250-1 SN - 979-8-3503-8249-5 U6 - https://doi.org/10.1109/MIPRO60963.2024.10569652 SN - 2623-8764 SP - 1614 EP - 1618 PB - IEEE ER -