TY - GEN A1 - Ehrig, Lutz A1 - Kaiser, Bert A1 - Conrad, Holger A1 - Schenk, Hermann A1 - Schuffenhauer, David A1 - Stolz, Michael A1 - Gaudet, Matthieu A1 - Schenk, Harald A1 - Kolkovsky, Vladimir T1 - MEMS-Loudspeaker - A Novel Class of Electroacoustic Transducers for Mobile Audio Applications T2 - Tonmeistertagung - VDT International Convention, Cologne, Germany, 2018, Proc. TMT 30 N2 - Wireless earphones require a tremendous degree of integration: In addition to the electroacoustic transducer at least the power supply and a radio module have to be accommodated, supplemented by several microphones for hands-free applications or for noise reduction, as well as position and bio sensors, memory and CPU. With increasing integration, the pressure on the individual components increases in terms of size, energy efficiency and costs. In the field of microphones, MEMS technology has enjoyed great popularity for almost 10 years, and due to their benefits (size, cost, integration) MEMS microphones have almost completely supersede other microphone technologies in mobile audio devices and opened up new fields of applications. Y1 - 2018 VL - TMT 30 SP - 189 EP - 192 ER - TY - GEN A1 - Kolkovsky, Vladimir A1 - Stübner, R. A1 - Langa, Sergiu A1 - Wende, U. A1 - Kaiser, Bert A1 - Conrad, Holger A1 - Schenk, Harald T1 - Influence of annealing in H atmosphere on the electrical properties of Al₃O₃ layers grown on p-type Si by the atomic layer deposition technique T2 - Solid-State Electronics Y1 - 2016 U6 - https://doi.org/10.1016/j.sse.2016.06.005 SN - 0038-1101 VL - 123 SP - 89 EP - 95 ER -