TY - CHAP A1 - Schacht, Ralph A1 - Punch, Jeff A1 - Merten, Enrico A1 - Rzepka, Sven A1 - Michel, Bernd ED - Schacht, Ralph T1 - Thermo-Fluidic Coupled Analysis of Flip-Chip Mounted Thermal Test Chips on a PCB – a Numerical and Experimental Study T2 - 21st International Workshop on Thermal Investigations of ICs and Systems N2 - CFD Analysis of Flip-Chip Mounted Devices on PCB – A Numerical and Experimental Study KW - CFD KW - Flip KW - Chip KW - Thermal Test Chip Y1 - 2015 UR - www.therminic2015.eu SN - 978-1-4673-9705-6 PB - IEEE CY - Piscataway, NJ ER -