TY - CHAP A1 - Lopacinski, Lukasz A1 - Eissa, Mohamed Hussein A1 - Panic, Goran A1 - Brzozowski, Marcin A1 - Hasani, Alireza A1 - Kraemer, Rolf T1 - Implementation of a Multi-Core Data Link Layer Processor for THz Communication T2 - IEEE 87th Vehicular Technology Conference (VTC 2018), 03 - 06 June 2018, Porto, Portugal Y1 - 2018 SN - 978-1-5386-6355-4 U6 - https://doi.org/10.1109/VTCSpring.2018.8417522 PB - IEEE CY - Piscataway, NJ ER - TY - GEN A1 - Lopacinski, Lukasz A1 - Marinkovic, Miroslav A1 - Panic, Goran A1 - Eissa, Mohamed Hussein A1 - Hasani, Alireza A1 - Krishnegowda, Karthik A1 - Kraemer, Rolf T1 - Data Link Layer Processor for 100 Gbps Terahertz Wireless Communications in 28 nm CMOS Technology T2 - IEEE Access Y1 - 2019 U6 - https://doi.org/10.1109/ACCESS.2019.2907156 SN - 2169-3536 IS - 7 SP - 44489 EP - 44502 ER - TY - GEN A1 - Lopacinski, Lukasz A1 - Eissa, Mohamed Hussein A1 - Panic, Goran A1 - Hasani, Alireza A1 - Kraemer, Rolf T1 - Modular Data Link Layer Processing for THz Communication T2 - 22nd International Symposium on Design and Diagnostics of Electronic Circuits and Systems (DDECS 2019), Cluj-Napoca, Romania, 24 - 26 April 2019 Y1 - 2019 SN - 978-1-7281-0073-9 SN - 978-1-7281-0072-2 SN - 978-1-7281-0074-6 U6 - https://doi.org/10.1109/DDECS.2019.8724657 SN - 2473-2117 SN - 2334-3133 ER - TY - GEN A1 - Panic, Goran A1 - Eissa, Mohamed Hussein A1 - Lopacinski, Lukasz A1 - Maletic, Nebojsa A1 - Kraemer, Rolf T1 - Modular Baseband Processing for mm-Wave and THz Communication T2 - Proceedings of the 8th Small Systems Simulation Symposium 2020, Niš, Serbia, 12th-14th February 2020 Y1 - 2020 UR - http://ssss.elfak.rs/wp-content/uploads/2020/02/8.pdf SP - 49 EP - 53 ER -