TY - CHAP A1 - Schmückle, Franz-Josef A1 - Lenk, Friedrich A1 - Hutter, Matthias A1 - Klein, Matthias A1 - Oppermann, Hermann A1 - Engelmann, Gunter A1 - Töpper, Michael A1 - Riepe, Klaus J. A1 - Heinrich, Wolfgang T1 - W-band flip-chip VCO in thin-film environment T2 - 2005 IEEE MTT-S International Microwave Symposium, June 12 - 17, 2005, Long Beach, CA N2 - A flip-chip packaging approach for W-band GaAs chips is presented using thin-film structures on silicon as carrier substrate. Reliability investigations indicate that, depending on bump size, the CTE mismatch is not critical and an underfiller does not provide distinctive benefits. A 77 GHz VCO GaAs-HBT MMIC is flip-chip-mounted to demonstrate validity of the packaging scheme. Y1 - 2005 SN - 0-7803-8845-3 U6 - https://doi.org/10.1109/MWSYM.2005.1516837 PB - IEEE Operations Center CY - Piscataway, NJ ER - TY - CHAP A1 - Wallraven, Christian A1 - Fischer, J. A1 - Cunningham, Douglas William A1 - Bartz, Dirk A1 - Bülthoff, Heinrich H. T1 - The Evaluation of Stylized Facial Expressions T2 - Proceedings, Symposium on Applied Perception in Graphics and Visualization, APGV 2006, Boston, Massachusetts, July 28 - 29, 2006 Y1 - 2006 SN - 1-59593-429-4 SP - 85 EP - 92 PB - ACM Press CY - New York, NY ER - TY - CHAP A1 - Fischer, J. A1 - Cunningham, Douglas William A1 - Bartz, Dirk A1 - Wallraven, Christian A1 - Bülthoff, Heinrich H. A1 - Strasser, W. T1 - Measuring the Discernibility of Virtual Objects in Conventional and Stylized Augmented Reality Y1 - 2006 ER -