TY - CHAP A1 - Schmückle, Franz-Josef A1 - Lenk, Friedrich A1 - Hutter, M. A1 - Klein, M. A1 - Oppermann, H. A1 - Engelmann, G. A1 - Topper, M. A1 - Riepe, K. A1 - Heinrich, Wolfgang T1 - W-band flip-chip VCO in thin-film environment T2 - 2005 IEEE MTT-S International Microwave Symposium, June 12 - 17, 2005, Long Beach, CA N2 - A flip-chip packaging approach for W-band GaAs chips is presented using thin-film structures on silicon as carrier substrate. Reliability investigations indicate that, depending on bump size, the CTE mismatch is not critical and an underfiller does not provide distinctive benefits. A 77 GHz VCO GaAs-HBT MMIC is flip-chip-mounted to demonstrate validity of the packaging scheme. Y1 - 2005 SN - 0-7803-8845-3 U6 - https://doi.org/10.1109/MWSYM.2005.1516837 PB - IEEE Operations Center CY - Piscataway, NJ ER -