TY - CHAP A1 - Gehrlich, Lukas A1 - Ohsiek, Susanne A1 - Klein, C. A1 - Geiß, M. A1 - Friedemann, Michael A1 - Kücher, Peter A1 - Schmeißer, Dieter T1 - Ultrathin TaN/Ta barrier modifications to fullfill next technology node requirements T2 - 2011 IEEE International Interconnect Technology Conference and 2011 Materials for Advanced Metallization (IITC/MAM 2011), Dresden, Germany, 8 - 12 May 2011 Y1 - 2011 SN - 978-1-4577-0503-8 U6 - https://doi.org/10.1109/IITC.2011.5940322 SP - 82 EP - 84 PB - IEEE CY - Piscataway, NJ ER -