TY - CHAP A1 - Karavaev, Konstantin A1 - Tallarida, Massimo A1 - Schmeißer, Dieter A1 - Zschech, Ehrenfried T1 - In-situ ALD growth of Hafnium oxide films T2 - Verhandlungen der Deutschen Physikalischen Gesellschaft ; Reihe 6, Bd. 43 N2 - We report on a novel system for in-situ atomic layer growth (ALD) of high-k dielectric films. First results were obtained for Hf-oxide samples by using Hf-tetrachloride as precursor and water as oxidizer. We compare the photoelectron spectra of Si2p, O1s and Hf4f of our in-situ prepared films with samples (ex-situ) prepared by industrial ALD reactors and discuss similarities and differences observed in the core level spectra of the various samples by considering the different growth conditions. Y1 - 2008 UR - http://www.dpg-verhandlungen.de/year/2008/conference/berlin/part/ds/session/23/contribution/12 SN - 0420-0195 SP - S. 244 PB - Deutsche Physikalische Gesellschaft CY - Bad Honnef ER - TY - GEN A1 - Dudek, Piotr T. A1 - Lupina, Grzegorz A1 - Kozłowski, Grzegorz A1 - Zaumseil, Peter A1 - Bauer, Jakob A1 - Fursenko, Oksana A1 - Dabrowski, Jarek Marek A1 - Schmidt, R. A1 - Lippert, Gunther A1 - Müssig, Hans-Joachim A1 - Schröder, Thomas A1 - Schmeißer, Dieter A1 - Zschech, Ehrenfried T1 - Atomic-scale engineering of future high-k dynamic random access memory dielectrics: The example of partial Hf substitution by Ti in BaHfO3 T2 - Journal of Vacuum Science and Technology / B Y1 - 2011 SN - 2166-2754 VL - 29 IS - 1 ER - TY - CHAP A1 - Heim, S. A1 - Friedrich, Daniel A1 - Guttmann, P. A1 - Rehbein, S. A1 - Chumakov, Dmytro A1 - Ritz, Y. A1 - Schneider, G. A1 - Schmeißer, Dieter A1 - Zschech, Ehrenfried T1 - Dynamical X-ray Microscopy Study of Stress-Induced Voiding in Cu Interconnects KW - x-ray KW - Microscopy KW - Interconnects Y1 - 2009 UR - http://link.aip.org/link/?APCPCS/1143/20/1 ER - TY - CHAP A1 - Tallarida, Massimo A1 - Karavaev, Konstantin A1 - Schmeißer, Dieter A1 - Zschech, Ehrenfried T1 - HfO2 ALD-growth studied by in situ photoemission T2 - Proceedings of 15th Workshop on Dielectrics in Micoelectronics, Bad Saarow, 23 - 25 June 2008 KW - ald KW - photoemission Y1 - 2008 SP - 289 EP - 290 ER - TY - GEN A1 - Zschech, Ehrenfried A1 - Ho, O. S. A1 - Schmeißer, Dieter A1 - Meyer, Moritz Andreas A1 - Vairagar, A. V. A1 - Schneider, G. A1 - Hauschildt, Meike A1 - Kraatz, Matthias A1 - Sukharev, V. T1 - Geometry and Microstructure Effect on EM-Induced Copper Interconnect Degradation T2 - IEEE Transactions on Device and Materials Reliability KW - Microstructure Y1 - 2009 UR - http://ieeexplore.ieee.org/xpls/icp.jsp?arnumber=4796372 SN - 1530-4388 VL - 9 IS - 1 SP - 20 EP - 30 ER - TY - GEN A1 - Klocek, Jolanta A1 - Kolanek, Krzysztof A1 - Henkel, Karsten A1 - Zschech, Ehrenfried A1 - Schmeißer, Dieter T1 - Influence of the fullerene derivatives and cage polyhedral oligomeric silsesquioxanes on 3-aminopropyltrimethoxysilane based hybrid nanocomposites chemical, morphological and electrical properties T2 - Journal of Physics and Chemistry of Solids N2 - In this study we produced 3-aminopropyltrimethoxysilane based hybrid nanocomposites using fullerene derivative [6,6]–phenyl–C61–butyric acid methyl ester (PCBM) as nanodopants. Additionally, we modified obtained material with incompletely condensed cage polyhedral oligomeric silsesqiuox-anes (POSS) in order to improve its properties. Thin films were deposited by means of the spin-coating method. The films were characterized by atomic force microscopy (AFM), X-ray photoelectron spectroscopy (XPS) and capacitance–voltage (CV) measurements. We observed that a properly chosen PCBM concentration may be a crucial factor to obtain high quality APTMS based films by the spin-coating technique. XPS revealed the presence of the C-NH-C species within POSS containing films indicating chemical interaction between the amino group of APTMS and the POSS molecules. AFM results suggest that at high POSS monomer concentration in the range of 1% the creation of fractal-shaped aggregates takes place. The CV characterization of the samples exhibits a decrease of the APTMS based films dielectric constant due to the POSS and PCBM contribution. The combination of the applied methods delivers complementary information concerning the properties of the analyzed films. KW - low-k KW - fullerene KW - aminopropyltrimethoxysilane KW - silsesqiuoxane KW - X-ray photoelectron spectroscopy (XPS) KW - Atomic force microscopy (AFM) KW - Capacitance voltage (CV) Y1 - 2013 U6 - https://doi.org/10.1016/j.jpcs.2012.08.013 SN - 0022-3697 VL - 74 IS - 1 SP - 135 EP - 145 ER - TY - CHAP A1 - Tallarida, Massimo A1 - Karavaev, Konstantin A1 - Schmeißer, Dieter A1 - Zschech, Ehrenfried T1 - Photoemission and absorption spectroscopy for in situ investigations of the ALD growth T2 - Verhandlungen der Deutschen Physikalischen Gesellschaft, Reihe 6, Bd. 43 N2 - We have investigated the growth of Hf-oxide on Si by means of photoemission and X-ray absorption spectroscopy using synchrotron radiation at Bessy, Berlin. The Hf-oxide layers were grown via atomic layer deposition (ALD) using an in-situ ALD reactor attached to the investigation chamber. The XPS and XAS spectra were measured after every deposition cycle by transferring the sample into the investigation chamber without breaking the vacuum. From the experimental data we have obtained information about the early stages of the Hf-oxide growth, concerning in particular the reactivity of the interface with Si. Due to the possibility to study the layers after every cycle and with different oxidation parameters without exposing them to contaminants, the in situ investigation revealed to be a very important method to understand the growth properties of Hf-oxide. Y1 - 2008 UR - http://www.dpg-verhandlungen.de/year/2008/conference/berlin/part/ds/session/22/contribution/5 SN - 0420-0195 SP - S. 242 PB - Deutsche Physikalische Gesellschaft CY - Bad Honnef ER - TY - CHAP A1 - Hoffmann, Patrick A1 - Schmeißer, Dieter A1 - Engelmann, Hans-Jürgen A1 - Zschech, Ehrenfried A1 - Stegmann, Heiko A1 - Himpsel, Franz J. A1 - Denlinger, Jonathan D. ED - Tsui, Ting Y. T1 - Characterization of chemical bonding in low-k dielectric materials for interconnect isolation: A XAS and EELS Study T2 - Materials, technology and reliability of low-k dielectrics and copper interconnects, symposium held April 18 - 21, 2006, San Francisco, California Y1 - 2006 SN - 978-1-55899-870-5 SP - 55 EP - 62 PB - Materials Research Society CY - Warrendale, Pa. ER - TY - CHAP A1 - Friedrich, Daniel A1 - Michling, Marcel A1 - Klocek, Jolanta A1 - Schmeißer, Dieter A1 - Avdoshenko, Stas A1 - Chumakov, Dmytro A1 - Zschech, Ehrenfried T1 - Study of C60 based films formation by NEXAFS T2 - Verhandlungen der Deutschen Physikalischen Gesellschaft, Reihe 6, Bd. 44 N2 - The C60 fullerenes and some of its -OH, -CF3 and -Cl derivates are candidates for application as ultra-low-k insulators in the semiconductor industry. Future preparation of thin films based on these materials requires the stability of the substituted fullerenes against chemical handling and processing steps. The latter issue was addressed by our NEXAFS studies that were done by synchrotron radiation at the beam line U49/2-PGM2 at BESSY II. Performed were the C K-edge NEXAFS studies in total fluorescence and total electron yield modes. The C60 based films were deposited on silicon by spraying from solutions. The influence of the different substitutional groups with C60 molecules was studied. The data were compared to the reference spectra of a pure C60 film. For C60(OH)24, C60-Cl2 and C60(CF3)12 a variance of the intensity of the π*-resonance as well as shift to higher energies of 0.5 eV (-OH), 0.6 eV (-F), 0.7 eV (-Cl) were observed. The results confirm the necessary stability of the used C60 derivatives and shall be used for optimization of the film deposition chemistry and conditions. Y1 - 2009 SN - 0420-0195 SP - S. 145 PB - Deutsche Physikalische Gesellschaft CY - Bad Honnef ER - TY - GEN A1 - Kraatz, Matthias A1 - Gall, Martin A1 - Zschech, Ehrenfried A1 - Schmeißer, Dieter A1 - Ho, Paul S. T1 - A model for statistical electromigration simulation with dependence on capping layer and Cu microstructure in two dimensions T2 - Computational Materials Science N2 - A model has been developed to simulate electromigration degradation in an interconnect segment in two dimensions using finite differences. The model was deployed on a parallel computer to statistically assess the lifetimes. The simulation takes into account the diffusion paths for electromigration mass transport along the grain boundaries and the capping layer. The microstructure is generated with a Monte Carlo algorithm, using a modified Potts model. Diffusivities along the grain boundaries and the capping layers were applied as multiples of a base diffusivity and were statistically scattered. The simulation results correlate well with electromigration tests. KW - Electromigration KW - Grain growth KW - Computer simulation KW - 2D KW - Copper Interconnects KW - On-chip KW - Statistics KW - Parallel computing Y1 - 2016 U6 - https://doi.org/10.1016/j.commatsci.2016.04.020 SN - 1879-0801 SN - 0927-0256 VL - 120 SP - 29 EP - 35 ER -