TY - THES A1 - Dudek, Piotr T. T1 - Atomic scale engineering of HfO2–based dielectrics for future DRAM applications N2 - Modern dielectrics in combination with appropriate metal electrodes have a great potential to solve many difficulties associated with continuing miniaturization process in the microelectronic industry. One significant branch of microelectronics incorporates dynamic random access memory (DRAM) market. The DRAM devices scaled for over 35 years starting from 4 kb density to several Gb nowadays. The scaling process led to the dielectric material thickness reduction, resulting in higher leakage current density, and as a consequence higher power consumption. As a possible solution for this problem, alternative dielectric materials with improved electrical and material science parameters were intensively studied by many research groups. The higher dielectric constant allows the use of physically thicker layers with high capacitance but strongly reduced leakage current density. This work focused on deposition and characterization of thin insulating layers. The material engineering process was based on Si cleanroom compatible HfO2 thin films deposited on TiN metal electrodes. A combined materials science and dielectric characterization study showed that Ba added HfO2 (BaHfO3) films and Ti added BaHfO3 (BaHf0.5Ti0.5O3) layers are promising candidates for future generation of state of the art DRAMs. In especial a strong increase of the dielectric permittivity k was achieved for thin films of cubic BaHfO3 (k~38) and BaHf0.5Ti0.5O3 (k~90) with respect to monoclinic HfO2 (k~19). Meanwhile the CET values scaled down to 1 nm for BaHfO3 and ~0.8 nm for BaHf0.5Ti0.5O3 with respect to HfO2 (CET=1.5 nm). The Hf4+ ions substitution in BaHfO3 by Ti4+ ions led to a significant decrease of thermal budget from 900°C for BaHfO3 to 700°C for BaHf0.5Ti0.5O3. Future studies need to focus on the use of appropriate metal electrodes (high work function) and on film deposition process (homogeneity) for better current leakage control. KW - Dielectrics KW - High-k materials KW - Atomic Scale Engineering KW - HfO2-based materials KW - XPS Y1 - 2011 U6 - http://nbn-resolving.de/urn/resolver.pl?urn:nbn:de:kobv:co1-opus-22775 UR - http://opus.kobv.de/btu/volltexte/2011/2277/ ER - TY - GEN A1 - Dudek, Piotr T. A1 - Lupina, Grzegorz A1 - Kozłowski, Grzegorz A1 - Zaumseil, Peter A1 - Bauer, Jakob A1 - Fursenko, Oksana A1 - Dabrowski, Jarek Marek A1 - Schmidt, R. A1 - Lippert, Gunther A1 - Müssig, Hans-Joachim A1 - Schröder, Thomas A1 - Schmeißer, Dieter A1 - Zschech, Ehrenfried T1 - Atomic-scale engineering of future high-k dynamic random access memory dielectrics: The example of partial Hf substitution by Ti in BaHfO3 T2 - Journal of Vacuum Science and Technology / B Y1 - 2011 SN - 2166-2754 VL - 29 IS - 1 ER - TY - GEN A1 - Kolanek, Krzysztof A1 - Hermann, Peter A1 - Dudek, Piotr T. A1 - Gotszalk, Teodor A1 - Chumakov, Dmytro A1 - Weisheit, Martin A1 - Hecker, Michael A1 - Zschech, Ehrenfried T1 - Local anodic oxidation by atomic force microscopy for nano-Raman strain measurements on silicon-germanium thin films T2 - Thin Solid Films KW - oxidation KW - microscope KW - measurements KW - thin films Y1 - 2010 SN - 0040-6090 VL - 518 IS - 12 SP - 3267 EP - 3272 ER -