TY - CHAP A1 - Mecking, S. A1 - Debski, Wojciech Andrzej T1 - A 0.35µm CMOS 1.9mA VCO-Core with Off-Chip Inductance on LTCC for System-in-a-Package Solutions of a 5-GHz-WLAN Transceiver Y1 - 2003 ER - TY - CHAP A1 - Debski, Wojciech Andrzej A1 - Langmann, U. A1 - Weger, Peter A1 - Mayr, P. A1 - Matz, R. T1 - Keramische System-in-Package-Technologie für 5GHz-Transceivermodul T2 - Deutsche IMAPS-Konferenz 2005, 10. - 11.10.05, München Y1 - 2005 N1 - CD-ROM PB - IMAPS Deutschland CY - München ER - TY - JOUR A1 - Debski, Wojciech Andrzej A1 - Weger, Peter T1 - A Monolithically Integrated 23-24 GHz Tuned Down-Converter in 0.13 µm CMOS Y1 - 2007 ER - TY - JOUR A1 - Debski, Wojciech Andrzej A1 - Weger, Peter T1 - 5-6 GHz Low-Power, High Linearity Differential CMOS LNA with Robust ESD Protection Y1 - 2007 ER - TY - THES A1 - Debski, Wojciech Andrzej T1 - Multi-band adaptive WLAN receivers in 0.13 µm CMOS KW - Drahtloses lokales Netz KW - CMOS-Schaltung Y1 - 2007 U6 - http://nbn-resolving.de/urn/resolver.pl?urn:nbn:de:kobv:co1-opus-3689 ER -