TY - GEN A1 - Lukosius, Mindaugas A1 - Lukose, Rasuolė A1 - Lisker, Marco A1 - Dubey, P. K. A1 - Raju, A. I. A1 - Capista, Daniele A1 - Majnoon, Farnaz A1 - Mai, A. A1 - Wenger, Christian T1 - Developments of Graphene devices in 200 mm CMOS pilot line T2 - Proc. Nanotechnology Materials and Devices Conference (NMDC 2023),Paestum, Italy, 22-25 October 2023 N2 - Due to the unique electronic band structure, graphene has opened great potential to extend the functionality of a large variety of devices. Despite the significant progress in the fabrication of various graphene based microelectronic devices, the integration of graphene devices still lack the stability and compatibility with Si-technology processes. Therefore, the investigation and preparation of graphene devices in conditions resembling as close as possible the Si technology environment is of highest importance. This study aims to explore various aspects of graphene research on a 200mm pilot line, with a focus on simulations and fabrication of graphene modulator. To be more precise, it includes design and fabrication of the layouts, necessary mask sets, creation of the flows, fabrication, and measurements of the Gr modulators on 200 mm wafers. KW - Graphene Y1 - 2023 SN - 979-8-3503-3546-0 U6 - https://doi.org/10.1109/NMDC57951.2023.10343569 SP - 505 EP - 506 PB - Institute of Electrical and Electronics Engineers (IEEE) ER - TY - GEN A1 - Maldonado, David A1 - Cantudo, Antonio A1 - Pérez, Eduardo A1 - Romero-Zaliz, Rocio A1 - Perez-Bosch Quesada, Emilio A1 - Mahadevaiah, Mamathamba Kalishettyhalli A1 - Jimenez-Molinos, Francisco A1 - Wenger, Christian A1 - Roldan, Juan Bautista T1 - TiN/Ti/HfO2/TiN Memristive Devices for Neuromorphic Computing: From Synaptic Plasticity to Stochastic Resonance T2 - Frontiers in Neuroscience N2 - We characterize TiN/Ti/HfO2/TiN memristive devices for neuromorphic computing. We analyze different features that allow the devices to mimic biological synapses and present the models to reproduce analytically some of the data measured. In particular, we have measured the spike timing dependent plasticity behavior in our devices and later on we have modeled it. The spike timing dependent plasticity model was implemented as the learning rule of a spiking neural network that was trained to recognize the MNIST dataset. Variability is implemented and its influence on the network recognition accuracy is considered accounting for the number of neurons in the network and the number of training epochs. Finally, stochastic resonance is studied as another synaptic feature.It is shown that this effect is important and greatly depends on the noise statistical characteristics. KW - RRAM KW - Neural network Y1 - 2023 U6 - https://doi.org/10.3389/fnins.2023.1271956 SN - 1662-4548 VL - 17 ER - TY - GEN A1 - Perez-Bosch Quesada, Emilio A1 - Rizzi, Tommaso A1 - Gupta, Aditya A1 - Mahadevaiah, Mamathamba Kalishettyhalli A1 - Schubert, Andreas A1 - Pechmann, Stefan A1 - Jia, Ruolan A1 - Uhlmann, Max A1 - Hagelauer, Amelie A1 - Wenger, Christian A1 - Pérez, Eduardo T1 - Multi-Level Programming on Radiation-Hard 1T1R Memristive Devices for In-Memory Computing T2 - 14th Spanish Conference on Electron Devices (CDE 2023), Valencia, Spain, 06-08 June 2023 N2 - This work presents a quasi-static electrical characterization of 1-transistor-1-resistor memristive structures designed following hardness-by-design techniques integrated in the CMOS fabrication process to assure multi-level capabilities in harsh radiation environments. Modulating the gate voltage of the enclosed layout transistor connected in series with the memristive device, it was possible to achieve excellent switching capabilities from a single high resistance state to a total of eight different low resistance states (more than 3 bits). Thus, the fabricated devices are suitable for their integration in larger in-memory computing systems and in multi-level memory applications. Index Terms—radiation-hard, hardness-by-design, memristive devices, Enclosed Layout Transistor, in-memory computing KW - RRAM Y1 - 2023 SN - 979-8-3503-0240-0 U6 - https://doi.org/10.1109/CDE58627.2023.10339525 PB - Institute of Electrical and Electronics Engineers (IEEE) ER - TY - GEN A1 - Pérez, Eduardo A1 - Maldonado, David A1 - Mahadevaiah, Mamathamba Kalishettyhalli A1 - Perez-Bosch Quesada, Emilio A1 - Cantudo, Antonio A1 - Jimenez-Molinos, Francisco A1 - Wenger, Christian A1 - Roldan, Juan Bautista T1 - A comparison of resistive switching parameters for memristive devices with HfO2 monolayers and Al2O3/HfO2 bilayers at the wafer scale T2 - 14th Spanish Conference on Electron Devices (CDE 2023), Valencia, Spain, 06-08 June 2023 N2 - Memristive devices integrated in 200 mm wafers manufactured in 130 nm CMOS technology with two different dielectrics, namely, a HfO2 monolayer and an Al2O3/HfO2 bilayer, have been measured. The cycle-to-cycle (C2C) and device-todevice (D2D) variability have been analyzed at the wafer scale using different numerical methods to extract the set (Vset) and reset (Vreset) voltages. Some interesting differences between both technologies were found in terms of switching characteristics KW - RRAM Y1 - 2023 SN - 979-8-3503-0240-0 U6 - https://doi.org/10.1109/CDE58627.2023.10339417 PB - Institute of Electrical and Electronics Engineers (IEEE) ER - TY - GEN A1 - Reiser, Daniel A1 - Reichenbach, Marc A1 - Rizzi, Tommaso A1 - Baroni, Andrea A1 - Fritscher, Markus A1 - Wenger, Christian A1 - Zambelli, Cristian A1 - Bertozzi, Davide T1 - Technology-Aware Drift Resilience Analysis of RRAM Crossbar Array Configurations T2 - 21st IEEE Interregional NEWCAS Conference (NEWCAS), 26-28 June 2023, Edinburgh, United Kingdom N2 - In-memory computing with resistive-switching random access memory (RRAM) crossbar arrays has the potential to overcome the major bottlenecks faced by digital hardware for data-heavy workloads such as deep learning. However, RRAM devices are subject to several non-idealities that result in significant inference accuracy drops compared with software baseline accuracy. A critical one is related to the drift of the conductance states appearing immediately at the end of program and verify algorithms that are mandatory for accurate multi-level conductance operation. The support of drift models in state-of-the-art simulation tools of memristive computationin-memory is currently only in the early stage, since they overlook key device- and array-level parameters affecting drift resilience such as the programming algorithm of RRAM cells, the choice of target conductance states and the weight-toconductance mapping scheme. The goal of this paper is to fully expose these parameters to RRAM crossbar designers as a multi-dimensional optimization space of drift resilience. For this purpose, a simulation framework is developed, which comes with the suitable abstractions to propagate the effects of those RRAM crossbar configuration parameters to their ultimate implications over inference performance stability. KW - RRAM Y1 - 2023 SN - 979-8-3503-0024-6 SN - 979-8-3503-0025-3 U6 - https://doi.org/10.1109/NEWCAS57931.2023 PB - IEEE CY - Piscataway, NJ ER - TY - GEN A1 - Franck, Max A1 - Dabrowski, Jarek A1 - Schubert, Markus Andreas A1 - Vignaud, Dominique A1 - Achehboune, Mohamed A1 - Colomer, Jean‐François A1 - Henrard, Luc A1 - Wenger, Christian A1 - Lukosius, Mindaugas T1 - Investigating Impacts of Local Pressure and Temperature on CVD Growth of Hexagonal Boron Nitride on Ge(001)/Si T2 - Advanced Materials Interfaces N2 - AbstractThe chemical vapor deposition (CVD) growth of hexagonal boron nitride (hBN) on Ge substrates is a promising pathway to high‐quality hBN thin films without metal contaminations for microelectronic applications, but the effect of CVD process parameters on the hBN properties is not well understood yet. The influence of local changes in pressure and temperature due to different reactor configurations on the structure and quality of hBN films grown on Ge(001)/Si is studied. Injection of the borazine precursor close to the sample surface results in an inhomogeneous film thickness, attributed to an inhomogeneous pressure distribution at the surface, as shown by computational fluid dynamics simulations. The additional formation of nanocrystalline islands is attributed to unfavorable gas phase reactions due to the radiative heating of the injector. Both issues are mitigated by increasing the injector‐sample distance, leading to an 86% reduction in pressure variability on the sample surface and a 200 °C reduction in precursor temperature. The resulting hBN films exhibit no nanocrystalline islands, improved thickness homogeneity, and high crystalline quality (Raman FWHM = 23 cm−1). This is competitive with hBN films grown on other non‐metal substrates but achieved at lower temperature and with a low thickness of only a few nanometers. KW - Boron Nitride KW - 2D material Y1 - 2025 U6 - https://doi.org/10.1002/admi.202400467 SN - 2196-7350 VL - 12 IS - 1 PB - Wiley ER - TY - GEN A1 - Wen, Jianan A1 - Vargas, Fabian Luis A1 - Zhu, Fukun A1 - Reiser, Daniel A1 - Baroni, Andrea A1 - Fritscher, Markus A1 - Perez, Eduardo A1 - Reichenbach, Marc A1 - Wenger, Christian A1 - Krstic, Milos T1 - RRAMulator : an efficient FPGA-based emulator for RRAM crossbar with device variability and energy consumption evaluation T2 - Microelectronics Reliability N2 - The in-memory computing (IMC) systems based on emerging technologies have gained significant attention due to their potential to enhance performance and energy efficiency by minimizing data movement between memory and processing unit, which is especially beneficial for data-intensive applications. Designing and evaluating systems utilizing emerging memory technologies, such as resistive RAM (RRAM), poses considerable challenges due to the limited support from electronics design automation (EDA) tools for rapid development and design space exploration. Additionally, incorporating technology-dependent variability into system-level simulations is critical to accurately assess the impact on system reliability and performance. To bridge this gap, we propose RRAMulator, a field-programmable gate array (FPGA) based hardware emulator for RRAM crossbar array. To avoid the complex device models capturing the nonlinear current–voltage (IV) relationships that degrade emulation speed and increase hardware utilization, we propose a device and variability modeling approach based on device measurements. We deploy look-up tables (LUTs) for device modeling and use the multivariate kernel density estimation (KDE) method to augment existing data, extending data variety and avoiding repetitive data usage. The proposed emulator achieves cycle-accurate, real-time emulations and provides information such as latency and energy consumption for matrix mapping and vector–matrix multiplications (VMMs). Experimental results show a significant reduction in emulation time compared to conventional behavioral simulations. Additionally, an RRAM-based discrete Fourier transform (DFT) accelerator is analyzed as a case study featuring a range of in-depth system assessments. KW - RRAM Y1 - 2025 U6 - https://doi.org/10.1016/j.microrel.2025.115630 SN - 0026-2714 VL - 168 SP - 1 EP - 10 PB - Elsevier BV CY - Amsterdam ER - TY - GEN A1 - Spetzler, Benjamin A1 - Fritscher, Markus A1 - Park, Seongae A1 - Kim, Nayoun A1 - Wenger, Christian A1 - Ziegler, Martin T1 - AI-driven model for optimized pulse programming of memristive devices T2 - APL Machine Learning N2 - Next-generation artificial intelligence (AI) hardware based on memristive devices offers a promising approach to reducing the increasingly large energy consumption of AI applications. However, programming memristive AI hardware to achieve a desired synaptic weight configuration remains challenging because it requires accurate and energy-efficient algorithms for selecting the optimal weight-update pulses. Here, we present a computationally efficient AI model for predicting the weight update of memristive devices and guiding device programming. The synaptic weight-update behavior of bilayer HfO2/TiO2 memristive devices is characterized over a range of pulse parameters to provide experimental data for the AI model. Three different artificial neural network (ANN) configurations are trained and evaluated regarding the amount of training data required for accurate predictions and the computational costs. Finally, we apply the model to an antipulse weight-update process to demonstrate its performance. The results show that accurate and computationally inexpensive predictions are possible with comparatively few datasets and small ANNs. The normalized weight-update processes are predicted with accuracies comparable with larger model architectures but require only 896 floating point operations and 8.33 nJ per inference. This makes the model a promising candidate for integration into AI-driven device controllers as a precise and energy-efficient solution for memristive device programming. KW - RRAM KW - Neural network KW - Device model Y1 - 2025 U6 - https://doi.org/10.1063/5.0251113 SN - 2770-9019 VL - 3 IS - 2 SP - 1 EP - 7 PB - AIP Publishing ER - TY - GEN A1 - Fritscher, Markus A1 - Uhlmann, Max A1 - Ostrovskyy, Philip A1 - Reiser, Daniel A1 - Chen, Junchao A1 - Wen, Jianan A1 - Schulze, Carsten A1 - Kahmen, Gerhard A1 - Fey, Dietmar A1 - Reichenbach, Marc A1 - Krstic, Milos A1 - Wenger, Christian ED - Wenger, Christian T1 - RISC-V CPU design using RRAM-CMOS standard cells T2 - IEEE transactions on very large scale integration (VLSI) systems N2 - The breakdown of Dennard scaling has been the driver for many innovations such as multicore CPUs and has fueled the research into novel devices such as resistive random access memory (RRAM). These devices might be a means to extend the scalability of integrated circuits since they allow for fast and nonvolatile operation. Unfortunately, large analog circuits need to be designed and integrated in order to benefit from these cells, hindering the implementation of large systems. This work elaborates on a novel solution, namely, creating digital standard cells utilizing RRAM devices. Albeit this approach can be used both for small gates and large macroblocks, we illustrate it for a 2T2R-cell. Since RRAM devices can be vertically stacked with transistors, this enables us to construct a nand standard cell, which merely consumes the area of two transistors. This leads to a 25% area reduction compared to an equivalent CMOS nand gate. We illustrate achievable area savings with a half-adder circuit and integrate this novel cell into a digital standard cell library. A synthesized RISC-V core using RRAM-based cells results in a 10.7% smaller area than the equivalent design using standard CMOS gates. KW - RRAM KW - Logic gates Y1 - 2025 UR - https://ieeexplore.ieee.org/document/10960690 U6 - https://doi.org/10.1109/TVLSI.2025.3554476 SN - 1063-8210 SP - 1 EP - 9 PB - Institute of Electrical and Electronics Engineers (IEEE) CY - New York ER - TY - GEN A1 - Strobel, Carsten A1 - Chavarin, Carlos A. A1 - Knaut, Martin A1 - Wenger, Christian A1 - Heinzig, André A1 - Mikolajick, Thomas T1 - Demonstration of a graphene adjustable‐barriers phototransistor with tunable ultra‐high responsivity T2 - Advanced Optical Materials N2 - The development of high‐speed dual‐band photodetectors with high responsivity is important for several applications such as optical communication, biomedical imaging or spectroscopy. In this work, a phototransistor with ultra‐high responsivity is demonstrated, which potentially also allows for very high bandwidths. The device is called graphene adjustable‐barriers phototransistor and is potentially capable for dual‐band detection in the visible‐infrared (VIS‐IR) range. A material combination of intrinsic hydrogenated amorphous silicon, graphene, and n‐type germanium (n‐Ge) is used for the demonstrator. The device operation is based on the light induced modulation of the graphene Fermi energy level and Schottky barrier heights. For the first time, the functional mechanism of the device is successfully demonstrated in the VIS range with responsivities exceeding 107 A/W at a gate voltage of 20V. The bandwidth of the device is 1.2 kHz and is so far limited by the defective gate material hydrogenated amorphous silicon and relaxed feature sizes of the demonstrator. These results are an important step toward a new generation of high‐responsivity high‐speed photo detection devices. KW - Graphene KW - Detector Y1 - 2025 U6 - https://doi.org/10.1002/adom.202500344 SN - 2195-1071 SP - 1 EP - 9 PB - Wiley-VCH GmbH CY - Weinheim ER -