TY - GEN A1 - Reiter, Sebastian A1 - Sengül, Akant A1 - Mai, Christian A1 - Spirito, Davide A1 - Wenger, Christian A1 - Fischer, Inga Anita T1 - On-chip refractive index sensors based on plasmonic TiN Nanohole Arrays T2 - 2024 IEEE Silicon Photonics Conference (SiPhotonics) Y1 - 2024 SN - 979-8-3503-9404-7 SN - 979-8-3503-9405-4 U6 - https://doi.org/10.1109/SiPhotonics60897.2024.10544048 SN - 1949-209X ER - TY - GEN A1 - Jose, Josmy A1 - Mai, Christian A1 - Wenger, Christian A1 - Fischer, Inga Anita T1 - Integration concept of plasmonic TiN nanohole arrays in a 200 mm BiCMOS Si technology for refractive index sensor applications T2 - iCCC2024 - iCampµs Cottbus Conference Y1 - 2024 U6 - https://doi.org/10.5162/iCCC2024/7.2 SP - 96 EP - 99 ER - TY - GEN A1 - Mai, Christian A1 - Peczek, Anna A1 - Kroh, Aleksandra A1 - Jose, Josmy A1 - Reiter, Sebastian A1 - Wenger, Christian A1 - Fischer, Inga Anita T1 - Towards a CMOS compatible refractive index sensor: cointegration of TiN nanohole arrays and Ge photodetectors in a 200 mm wafer silicon technology T2 - Optics Express N2 - In this work, we present the monolithic integration of a TiN nanohole array and a Ge photodetector towards a CMOS compatible fabrication of a refractive index sensor in a 200 mm wafer silicon technology. We developed a technology process that enables fabrication with high yields of around 90%. Ge photodetectors with a Ge layer thickness of 450 nm and an area of 1600 µm2 (40 µm x 40 µm) show dark current densities of around 129 mA/cm2 and responsivities of 0.114 A/W measured by top illumination (TE polarization; λ = 1310 nm; angle of incidence = 14 °) at a reverse bias of 1 V. Nanohole arrays were structured in a 150 nm thick TiN layer. They were integrated into the back end of line and placed spatially close to the Ge photodetectors. After the metallization, passivation, and pad opening, the nanohole arrays were released with the help of an amorphous silicon stop layer. A significant impact of the TiN nanohole arrays on the optical behavior of the photodetector could be proven on the wafer level. Photocurrent measurements by top illumination confirm a strong dependence of optical properties on the polarization of the incident light and the nanohole array design. We demonstrate very stable photocurrents on the wafer level with a standard deviation of σ < 6%. KW - plasmonics KW - sensor KW - nano hole array Y1 - 2024 U6 - https://doi.org/10.1364/OE.530081 SN - 1094-4087 VL - 32 IS - 17 SP - 29099 EP - 29111 PB - Optica Publishing Group ER - TY - GEN A1 - Reiter, Sebastian A1 - Han, Weijia A1 - Mai, Christian A1 - Spirito, Davide A1 - Jose, Josmy A1 - Zöllner, Marvin Hartwig A1 - Fursenko, Oksana A1 - Schubert, Markus Andreas A1 - Stemmler, Ivo A1 - Wenger, Christian A1 - Fischer, Inga Anita T1 - Titanium Nitride Plasmonic Nanohole Arrays for CMOS-compatible integrated refractive index sensing: influence of layer thickness on optical properties T2 - Plasmonics Y1 - 2023 U6 - https://doi.org/10.1007/s11468-023-01810-3 SN - 1557-1963 SP - 1 EP - 13 ER - TY - GEN A1 - Han, Weijia A1 - Reiter, Sebastian A1 - Schlipf, Jon A1 - Mai, Christian A1 - Spirito, Davide A1 - Jose, Josmy A1 - Wenger, Christian A1 - Fischer, Inga Anita T1 - Strongly enhanced sensitivities of CMOS compatible plasmonic titanium nitride nanohole arrays for refractive index sensing under oblique incidence T2 - Optics Express N2 - Titanium nitride (TiN) is a complementary metal-oxide-semiconductor (CMOS) compatible material with large potential for the fabrication of plasmonic structures suited for device integration. However, the comparatively large optical losses can be detrimental for application. This work reports a CMOS compatible TiN nanohole array (NHA) on top of a multilayer stack for potential use in integrated refractive index sensing with high sensitivities at wavelengths between 800 and 1500 nm. The stack, consisting of the TiN NHA on a silicon dioxide (SiO2) layer with Si as substrate (TiN NHA/SiO2/Si), is prepared using an industrial CMOS compatible process. The TiN NHA/SiO2/Si shows Fano resonances in reflectance spectra under oblique excitation, which are well reproduced by simulation using both finite difference time domain (FDTD) and rigorous coupled-wave analysis (RCWA) methods. The sensitivities derived from spectroscopic characterizations increase with the increasing incident angle and match well with the simulated sensitivities. Our systematic simulation-based investigation of the sensitivity of the TiN NHA/SiO2/Si stack under varied conditions reveals that very large sensitivities up to 2305 nm per refractive index unit (nm RIU−1) are predicted when the refractive index of superstrate is similar to that of the SiO2 layer. We analyze in detail how the interplay between plasmonic and photonic resonances such as surface plasmon polaritons (SPPs), localized surface plasmon resonances (LSPRs), Rayleigh Anomalies (RAs), and photonic microcavity modes (Fabry-Pérot resonances) contributes to this result. This work not only reveals the tunability of TiN nanostructures for plasmonic applications but also paves the way to explore efficient devices for sensing in broad conditions. KW - TiN KW - Plasmonics Y1 - 2023 U6 - https://doi.org/10.1364/OE.481993 SN - 1094-4087 VL - 31 IS - 11 SP - 17389 EP - 17407 ER - TY - GEN A1 - Reiter, Sebastian A1 - Ratzke, Markus A1 - Nitsch, Paul-Gregor A1 - Mai, Christian A1 - Spirito, Davide A1 - Corley-Wiciak, Agnieszka Anna A1 - Wenger, Christian A1 - Fischer, Inga A. T1 - Optical response of titanium nitride plasmonic nanohole arrays : impact of square and hexagonal array geometry, pitch, and nanohole diameter T2 - Plasmonics N2 - Plasmonic nanohole arrays (NHAs) exhibit extraordinary optical transmission (EOT) evoked by resonant excitation of surface plasmons at an excitation wavelength, which is highly sensitive to changes in refractive index in the surrounding dielectric. This can enable the use of plasmonic NHAs in on-chip refractive index sensors. Such sensors can be realized on the cost-effective silicon platform by the integration of a plasmonic NHA and a Ge photodetector, provided that complementary metal–oxide–semiconductor (CMOS)-compatible materials are used for their fabrication. Titanium nitride (TiN) as a biocompatible and CMOS-compatible plasmonic transition metal nitride is well-suited for integration on the silicon platform; however, the comparatively large losses within the material require geometry optimization strategies in order to improve the optical properties of TiN NHAs for sensing. In this work, we investigated different TiN NHA geometries both in experiment and simulation. We extensively characterized square and hexagonal arrays with varying pitches and nanohole diameters and provide a detailed comparison of their optical properties. We also discuss characterization results for surface refractive index changes imposed by depositing a thin Al2O3 layer on top of the NHAs. While we do not observe a clear advantage of hexagonal arrays compared to square arrays for sensing, our results highlight the importance of geometry optimization for TiN NHAs integrated with devices. KW - Plasmonic nanohole array KW - Titanium nitride KW - Hexagonal array KW - Square array KW - Nanohole diameters Y1 - 2025 UR - https://link.springer.com/article/10.1007/s11468-025-02934-4 U6 - https://doi.org/10.1007/s11468-025-02934-4 VL - 20 SP - 8825 EP - 8834 PB - Springer CY - New York, NY ER - TY - GEN A1 - Dorai Swamy Reddy, Keerthi A1 - Pérez, Eduardo A1 - Baroni, Andrea A1 - Mahadevaiah, Mamathamba Kalishettyhalli A1 - Marschmeyer, Steffen A1 - Fraschke, Mirko A1 - Lisker, Marco A1 - Wenger, Christian A1 - Mai, Andreas T1 - Optimization of technology processes for enhanced CMOS-integrated 1T-1R RRAM device performance T2 - The European Physical Journal B N2 - Implementing artificial synapses that emulate the synaptic behavior observed in the brain is one of the most critical requirements for neuromorphic computing. Resistive random-access memories (RRAM) have been proposed as a candidate for artificial synaptic devices. For this applicability, RRAM device performance depends on the technology used to fabricate the metal–insulator–metal (MIM) stack and the technology chosen for the selector device. To analyze these dependencies, the integrated RRAM devices in a 4k-bit array are studied on a 200 mm wafer scale in this work. The RRAM devices are integrated into two different CMOS transistor technologies of IHP, namely 250 nm and 130 nm and the devices are compared in terms of their pristine state current. The devices in 130 nm technology have shown lower number of high pristine state current devices per die in comparison to the 250 nm technology. For the 130 nm technology, the forming voltage is reduced due to the decrease of HfO2 dielectric thickness from 8 nm to 5 nm. Additionally, 5% Al-doped 4 nm HfO2 dielectric displayed a similar reduction in forming voltage and a lower variation in the values. Finally, the multi-level switching between the dielectric layers in 250 nm and 130 nm technologies are compared, where 130 nm showed a more significant number of conductance levels of seven compared to only four levels observed in 250 nm technology. KW - RRAM Y1 - 2024 U6 - https://doi.org/10.1140/epjb/s10051-024-00821-1 SN - 1434-6028 VL - 97 PB - Springer Science and Business Media LLC ER - TY - GEN A1 - Lukosius, Mindaugas A1 - Lukose, Rasuolė A1 - Lisker, Marco A1 - Dubey, P. K. A1 - Raju, A. I. A1 - Capista, Daniele A1 - Majnoon, Farnaz A1 - Mai, A. A1 - Wenger, Christian T1 - Developments of Graphene devices in 200 mm CMOS pilot line T2 - Proc. Nanotechnology Materials and Devices Conference (NMDC 2023),Paestum, Italy, 22-25 October 2023 N2 - Due to the unique electronic band structure, graphene has opened great potential to extend the functionality of a large variety of devices. Despite the significant progress in the fabrication of various graphene based microelectronic devices, the integration of graphene devices still lack the stability and compatibility with Si-technology processes. Therefore, the investigation and preparation of graphene devices in conditions resembling as close as possible the Si technology environment is of highest importance. This study aims to explore various aspects of graphene research on a 200mm pilot line, with a focus on simulations and fabrication of graphene modulator. To be more precise, it includes design and fabrication of the layouts, necessary mask sets, creation of the flows, fabrication, and measurements of the Gr modulators on 200 mm wafers. KW - Graphene Y1 - 2023 SN - 979-8-3503-3546-0 U6 - https://doi.org/10.1109/NMDC57951.2023.10343569 SP - 505 EP - 506 PB - Institute of Electrical and Electronics Engineers (IEEE) ER - TY - GEN A1 - Fünning, Tabea A1 - Paul, Martin A1 - Manganelli, Costanza Lucia A1 - Wenger, Christian A1 - Mai, Andreas A1 - Steglich, Patrick T1 - Comparative simulation analysis of photonic ultrasound sensors based on silicon waveguides T2 - Scientific reports N2 - Pressure sensors based on photonic integrated circuits (PIC) offer the prospect of outstanding sensitivities, extreme miniaturization and have the potential for highly scalable production using CMOS compatible processing. PIC-based pressure sensors detect the change in optical properties, i.e. the intensity or phase of the optical carrier wave inside miniaturized waveguide structures. The detection of ultrasound is achieved by engineering the waveguide architecture such that a pressure causes a high change in the effective refractive index of the waveguide. A range of PIC-based pressure sensors have been reported, but a comparison of the sensitivity of the different approaches is not straightforward, since different pressure sensitive waveguide architectures as well as photonic layouts and measurement setups impact the performance. Additionally, the used sensitivity unit is not uniform throughout the different studies, further complicating a comparison. In this work, a detailed simulation study is carried out by finite element modeling of different pressure sensitive waveguide architectures for a consistent comparison. We analyze three different sensor architectures: (A) a free standing membrane located within a tiny air gap above the waveguide, (B) a waveguide located on top of a deflectable membrane as well as (C) a waveguide embedded inside a pressure-sensitive polymer cladding. The mechanical response of the structures and the resulting changes in mode propagation, i.e. the change of the effective refractive index, are analyzed. The waveguide sensitivities in RIU/MPa for different waveguide types (strip, slot) and polarization states (TE, TM) are compared. The results reveal inherent limitations of the different waveguide designs and create a basis for the selection of suitable designs for further ultrasound sensor development. Possibilities for enhancing waveguide sensitivity are identified and discussed. Additionally, we have shown that the studied approaches are extensible to SiN waveguides. KW - Ultrasound sensor Y1 - 2025 U6 - https://doi.org/10.1038/s41598-025-01953-9 SN - 2045-2322 VL - 15 IS - 1 SP - 1 EP - 13 PB - Springer Science and Business Media LLC CY - [London] ER -