TY - GEN A1 - Naumann, Franziska A1 - Reck, Johanna A1 - Gargouri, Hassan A1 - Gruska, Bernd A1 - Blümich, Adrian A1 - Mahmoodinezhad, Ali A1 - Janowitz, Christoph A1 - Henkel, Karsten A1 - Flege, Jan Ingo T1 - In situ real-time and ex situ spectroscopic analysis of Al₂O₃ films prepared by plasma enhanced atomic layer deposition T2 - Journal of Vacuum Science and Technology B N2 - In situ real-time ellipsometry (irtE) with a very high time resolution of 24 ms was applied to monitor the inductively coupled plasma enhanced atomic layer deposition (ALD) process of Al₂O₃ thin films to precisely resolve each step of the ALD process and its complete cycle. The influence of plasma power, plasma pulse duration, and deposition temperature on the film growth characteristics was investigated. Ex situ ellipsometry [UV-VIS-NIR-SE (ultraviolet-visible-nearinfrared-spectroscopic ellipsometry) and IR-SE (infrared spectroscopic ellipsometry)] and x-ray photoelectron spectroscopy revealed the bulk properties (thickness, refractive index, chemical composition, and carbon incorporation) of the films, which together with the in situ results are compared to those of the films prepared by thermal ALD (T-ALD). The ICPEALD (inductively coupled plasma enhanced ALD) films were deposited at substrate temperatures between 80 and 250 °C and the role of plasma power (50–300 W) and its pulse duration (1–20 s) was investigated at 250 °C. The reference T-ALD layers were prepared at 200 °C. The ICPEALD process of Al₂O₃ shows an increased growth rate, and the produced films exhibit higher carbon contaminations than the T-ALD Al₂O₃ films. Plasma pulse times of up to 15 s further increase the content of carbon and CH species; at the same time, the refractive index decreases. The optical properties of ICPEALD deposited Al₂O₃ films are comparable with those of the T-ALD films for low plasma power and short plasma pulse durations. For the ICPEALD films, UV absorption is found and it is dependent on the deposition parameters. irtE resolves process effects that correlate with the bulk properties of Al₂O₃, such as impurities and oxygen deficiencies. KW - Plamsa enhanced atomic layer deposition (PEALD) KW - spectroscopic ellipsometry KW - X-ray photoelectron spectroscopy KW - real-time monitoring KW - aluminum oxide (Al₂O₃) Y1 - 2020 U6 - https://doi.org/10.1116/1.5122797 SN - 0734-211X SN - 1071-1023 SN - 2166-2746 SN - 2166-2754 VL - 38 IS - 1 ER - TY - GEN A1 - Sowińska, Małgorzata A1 - Henkel, Karsten A1 - Schmeißer, Dieter A1 - Kärkkänen, Irina A1 - Schneidewind, Jessica A1 - Naumann, Franziska A1 - Gruska, Bernd A1 - Gargouri, Hassan T1 - Plasma-enhanced atomic layer deposition of titanium oxynitrides films: A comparative spectroscopic and electrical study T2 - Journal of Vacuum Science and Technology A N2 - The process parameters’ impact of the plasma-enhanced atomic layer deposition (PE-ALD) method on the oxygen to nitrogen (O/N) ratio in titanium oxynitride (TiOxNy) films was studied. Titanium(IV)isopropoxide in combination with NH3 plasma and tetrakis(dimethylamino) titanium by applying N2 plasma processes were investigated. Samples were characterized by the in situ spectroscopic ellipsometry, x-ray photoelectron spectroscopy, and electrical characterization (current–voltage: I-V and capacitance–voltage: C-V) methods. The O/N ratio in the TiOxNy films is found to be very sensitive for their electric properties such as conductivity, dielectric breakdown, and permittivity. Our results indicate that these PE-ALD film properties can be tuned, via the O/N ratio, by the selection of the process parameters and precursor/coreactant combination. KW - plasma enhanced atomic layer deposition KW - titanium oxynitride KW - X-ray photoelectron spectroscopy KW - ellipsometry KW - current-voltage KW - capacitance-voltage Y1 - 2016 U6 - https://doi.org/10.1116/1.4936227 SN - 0734-2101 SN - 1520-8559 IS - 34 SP - 01A127-1 EP - 01A127-9 ER - TY - GEN A1 - Das, Chittaranjan A1 - Henkel, Karsten A1 - Tallarida, Massimo A1 - Schmeißer, Dieter A1 - Gargouri, Hassan A1 - Kärkkänen, Irina A1 - Schneidewind, Jessica A1 - Gruska, Bernd A1 - Arens, Michael T1 - Thermal and plasma enhanced atomic layer deposition of TiO2: Comparison of spectroscopic and electric properties T2 - Journal of Vacuum Science and Technology A N2 - Titanium oxide (TiO2) deposited by atomic layer deposition (ALD) is used as a protective layer in photocatalytic water splitting system as well as a dielectric in resistive memory switching. The way ALD is performed (thermally or plasma-assisted) may change the growth rate as well as the electronic properties of the deposited films. In the present work, the authors verify the influence of the ALD mode on functional parameters, by comparing the growth rate and electronic properties of TiO2 films deposited by thermal (T-) and plasma-enhanced (PE-) ALD. The authors complete the study with the electrical characterization of selected samples by means of capacitance–voltage and current–voltage measurements. In all samples, the authors found a significant presence of Ti3+ states, with the lowest content in the PE-ALD grown TiO2 films. The observation of Ti3+ states was accompanied by the presence of in-gap states above the valence band maximum. For films thinner than 10 nm, the authors found also a strong leakage current. Also in this case, the PE-ALD films showed the weakest leakage currents, showing a correlation between the presence of Ti3+ states and leakage current density. KW - titanium oxide (TiO2) KW - atomic layer deposition KW - plasma enhanced atomic layer deposition KW - synchrotron radiation photoelectron spectroscopy (SR-PES) KW - x-ray absorption spectroscopy KW - capacitance-voltage (CV) KW - current-voltage (IV) KW - ellipsometry KW - in-gap states Y1 - 2015 U6 - https://doi.org/10.1116/1.4903938 SN - 1520-8559 SN - 0734-2101 VL - 2015 IS - 33 SP - 01A144-1 EP - 01A144-8 ER - TY - CHAP A1 - Henkel, Karsten A1 - Das, Chittaranjan A1 - Sowinska, Małgorzata A1 - Tallarida, Massimo A1 - Schmeißer, Dieter A1 - Gargouri, Hassan A1 - Kärkkänen, Irina A1 - Schneidewind, Jessica A1 - Gruska, Bernd A1 - Arens, Michael ED - Glück, B. K. ED - Schmidt, S. ED - Stein, E. ED - Raschke, Jörg-Uwe ED - Richter, H. T1 - Charakterisierung von TiO2-ALD-Schichten und deren Nutzung für die Passivierung von Si-Photokathoden T2 - Tagungsband Photovoltaik-Meeting: Anwendungen-Qualität-Perspektiven, Senftenberg, 15.04.2015 N2 - Wir berichten zunächst über den Einfluss der Methode der Atomlagenabscheidung auf die TiO2-Schichteigenschaften. Insbesondere wird der Zusammenhang zwischen Ti3+- sowie Interbandzuständen mit elektrischen Kennlinien und deren Einfluss auf funktionale Schichteigenschaften diskutiert. Anschließend werden Mikrostrukturierung, Grenzflächen-Engineering und konforme Abscheidung einer TiO2-ALD-Schutzschicht effektiv zur Performance-Steigerung von p-Si-Photokathoden angewendet. KW - TiO2 KW - Korrosion KW - Atomlagenabscheidung KW - Silizium KW - Photokathoden KW - Linear Scan Voltametry KW - Photoelektronenspektroskopie Y1 - 2015 SP - 3 EP - 8 PB - BTU Cottbus-Senftenberg CY - Senftenberg ER - TY - GEN A1 - Henkel, Karsten A1 - Gargouri, Hassan A1 - Gruska, Bernd A1 - Arens, Michael A1 - Tallarida, Massimo A1 - Schmeißer, Dieter T1 - Capacitance and conductance versus voltage characterization of Al2O3 layers prepared by PE-ALD at 25°C ≤ T ≤ 200°C T2 - Journal of Vacuum Science and Technology A N2 - In this work, plasma enhanced atomic layer deposited (PE-ALD) samples were prepared at substrate temperatures in the range between room temperature (RT) and 200 °C and investigated by capacitance–voltage and conductance–voltage recordings. The measurements are compared to standard thermal atomic layer deposition (T-ALD) at 200 °C. Very low interface state density (D it) ~1011 eV−1 cm−2 could be achieved for the PE-ALD process at 200 °C substrate temperature after postdeposition anneal (PDA) in forming gas at 450 °C. The PDA works very effectively for both the PE-ALD and T-ALD at 200 °C substrate temperature delivering also similar values of negative fixed charge density (N fix) around −2.5 × 1012 cm−2. At the substrate temperature of 150 °C, highest N fix (−2.9 × 1012 cm−2) and moderate D it (2.7 × 1011 eV−1 cm−2) values were observed. The as deposited PE-ALD layer at RT shows both low D it in the range of (1 to 3) × 1011 eV−1 cm−2 and low N fix (−4.4 × 1011 cm−2) at the same time. The dependencies of N fix, D it, and relative permittivity on the substrate temperatures and its adjustability are discussed. KW - Atomic layer deposition (ALD) KW - Al2O3 KW - dielectric properties KW - interface state density KW - fixed oxide charge KW - permittivity Y1 - 2014 UR - http://link.aip.org/link/?JVA/32/01A107&aemail=author U6 - https://doi.org/10.1116/1.4831897 VL - 1 IS - 32 SP - 01A107-1 EP - 01A107-10 ER - TY - CHAP A1 - Henkel, Karsten A1 - Tallarida, Massimo A1 - Haeberle, Jörg A1 - Gargouri, Hassan A1 - Naumann, Franziska A1 - Gruska, Bernd A1 - Arens, Michael A1 - Schmeißer, Dieter ED - Glück, Bernhard K. ED - Schmidt, Sindy ED - Stein, Erhard ED - Raschke, Jörg-Uwe ED - Richter, Hans T1 - PE-ALD-Al2O3-Schichten für die Passivierung von Solarzellen T2 - Tagungsband Photovoltaik-Meeting: Anwendungen-Qualität-Perspektiven, Senftenberg, 16.04.2014 N2 - Dünne Al2O3-Schichten wurden bei Substrattemperaturen zwischen Raumtemperatur und 200°C mittels PE-ALD auf Si-Substraten abgeschieden und ellipsometrisch, spektroskopisch und elektrisch charakterisiert. Ihr Potenzial für die chemische und Feldeffektpassivierung der Oberflächenrekombination wird bewertet. KW - Al2O3 KW - Atomlagenabscheidung (ALD) KW - Passivierung KW - PE-ALD KW - negative fixe Oxidladungen Y1 - 2014 SP - 7 EP - 14 PB - Cottbus-Senftenberg CY - BTU ER - TY - CHAP A1 - Tallarida, Massimo A1 - Henkel, Karsten A1 - Gargouri, Hassan A1 - Haeberle, Jörg A1 - Gruska, Bernd A1 - Arens, Matthias A1 - Schmeißer, Dieter T1 - New opportunities with Plasma enhanced atomic layer deposition (PE-ALD) of oxides T2 - Verhandlungen der Deutschen Physikalischen Gesellschaft N2 - Thermal Atomic layer deposition (T-ALD) of oxides is obtained by the pulsed alternation of a metal precursor and an oxygen source, typically H2O or O3, and the reactions leading to ALD are thermally activated. With plasma enhanced ALD (PE-ALD), instead, the oxygen source is represented by an oxygen-containing plasma. The higher reactivity of the plasma-generated species extend the capabilities of ALD: improved film quality and increased flexibility in process conditions, such as growth at low temperature, are typical advantages of PE-ALD over T-ALD. We report on results on the preparation of thin (<100 nm) aluminum oxide (Al2O3) films on silicon substrates using T-ALD and PE-ALD in the SENTECH SI ALD LL system. Films were deposited in the temperature range between room temperature (RT) and 200∘C. We characterized the films with spectroscopic ellipsometry (thickness, refractive index, growth rate) over 4" wafers and with X-ray photoelectron spectroscopy. All films resulted in a high degree of homogeneity, independent of the deposition temperature. Investigations with capacitance-voltage and conductance-voltage measurements showed a very low interface states density for the PE-ALD films. KW - Atomic layer deposition KW - Plasma enhanced atomic layer deposition KW - X-ray photoelectron spectroscopy KW - spectroscopic ellipsometry KW - dielectric properties KW - Al2O3 Y1 - 2014 UR - http://www.dpg-verhandlungen.de/year/2014/conference/dresden/part/ds/session/49/contribution/3?lang=en SN - 0420-0195 PB - Deutsche Physikalische Gesellschaft CY - Bad Honnef ER - TY - GEN A1 - Haeberle, Jörg A1 - Henkel, Karsten A1 - Gargouri, Hassan A1 - Naumann, Franziska A1 - Gruska, Bernd A1 - Arens, Michael A1 - Tallarida, Massimo A1 - Schmeißer, Dieter T1 - Ellipsometry and XPS comparative studies of thermal and plasma enhanced atomic layer deposited Al2O3-films T2 - Beilstein Journal of Nanotechnology N2 - We report on results on the preparation of thin (<100 nm) aluminum oxide (Al2O3) films on silicon substrates using thermal atomic layer deposition (T-ALD) and plasma enhanced atomic layer deposition (PE-ALD) in the SENTECH SI ALD LL system. The T-ALD Al2O3layers were deposited at 200 °C, for the PE-ALD films we varied the substrate temperature range between room temperature (rt) and 200 °C. We show data from spectroscopic ellipsometry (thickness, refractive index, growth rate) over 4” wafers and correlatethem to X-ray photoelectron spectroscopy (XPS) results. The 200°C T-ALD and PE-ALD processes yield films with similar refractive indices and with oxygen to aluminum elemental ratios very close to the stoichiometric value of 1.5. However, in both also fragments of the precursor are integrated into the film. The PE-ALD films show an increased growth rate and lower carbon contaminations. Reducing the deposition temperature down to rt leads to a higher content of carbon and CH-species. We also find a decrease of the refractive index and of the oxygen to aluminum elemental ratio as well as an increase of the growth rate whereas the homogeneity of the film growth is not influenced significantly. Initial state energy shifts in all PE-ALD samples are observed which we attribute to a net negative charge within the films. KW - Al2O3 KW - ALD KW - ellipsometry KW - PE-ALD KW - XPS Y1 - 2013 U6 - https://doi.org/10.3762/bjnano.4.83 SN - 2190-4286 VL - 2013 IS - 4 SP - 732 EP - 742 ER -