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    <abstract language="eng">Resistive Random Access Memory (RRAM) has gained considerable momentum due to its non-volatility and energy efficiency. Material and device scientists have been proposing novel material stacks that can mimic the “ideal memristor” which can deliver performance, energy efficiency, reliability and accuracy. However, designing RRAM-based systems is challenging. Engineering a new material stack, designing a device, and experimenting takes significant time for material and device researchers. Furthermore, the acceptability of the device is ultimately decided at the system level. We see a gap here where there is a need for facilitating material and device researchers with a “push button” modeling framework that allows to evaluate the efficacy of the device at system level during early device design stages. Speed, accuracy, and adaptability are the fundamental requirements of this modelling framework. In this paper, we propose a digital twin (DT)-like modeling framework that automatically creates RRAM device models from device measurement data. Furthermore, the model incorporates the peripheral circuit to ensure accurate energy and performance evaluations. We demonstrate the DT generation and DT usage for multiple RRAM technologies and applications and illustrate the achieved performance of our GPU implementation. We conclude with the application of our modeling approach to measurement data from two distinct fabricated devices, validating its effectiveness in a neural network processing an Electrocardiogram (ECG) dataset and incorporating Fault Aware Training (FAT).</abstract>
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      <firstName>Maen</firstName>
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    <author>
      <firstName>Ankit</firstName>
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    <author>
      <firstName>Tim</firstName>
      <lastName>Kempen</lastName>
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    <author>
      <firstName>Max</firstName>
      <lastName>Uhlmann</lastName>
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    <author>
      <firstName>Gerhard</firstName>
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      <firstName>Farhad</firstName>
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      <firstName>Christian</firstName>
      <lastName>Wenger</lastName>
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    <title language="eng">Area-efficient digital design using RRAM-CMOS standard cells</title>
    <abstract language="eng">Extending the scalability of digital integrated circuits through novel device concepts is an attractive option. Among these concepts, resistive random access memory (RRAM) devices allow fast and nonvolatile operation. However, building large memristive systems is still challenging since large analog circuits have to be designed and integrated. In this paper, we propose a novel solution - the implementation of digital standard cells by the means of RRAM devices. While this methodology is universal, with applications ranging from few-device-circuits to large macroblocks, we demonstrate it for a 2T2R-cell. The benefits of using RRAM devices are demonstrated by implementing a NAND standard cell merely consuming the area of two transistors. This cell is about 25 % smaller than the equivalent CMOS NAND in the same technology. We use these cells to implement a half adder, beating the area of the equivalent CMOS implementation using more sophisticates gates by 15 %. Lastly, we fully integrate this novel standard cell into a digital standard cell library and perform a synthesis and layout of a RISC-V CPU core.</abstract>
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    <title language="eng">LUT-based RRAM model for neural accelerator circuit simulation</title>
    <abstract language="eng">Neural hardware accelerators have been proven to be energy-efficient when used to solve tasks which can be mapped into an artificial neural network (ANN) structure. Resistive random-access memories (RRAMs) are currently under investigation together with several different memristive devices as promising technologies to build such accelerators combined together with complementary metal-oxide semiconductor (CMOS)-technologies in integrated circuits (ICs). While many research groups are actively developing sophisticated physical-based representations to better understand the underlying phenomena characterizing these devices, not much work has been dedicated to exploit the trade-off between simulation time and accuracy in the definition of low computational demanding models suitable to be used at many abstraction layers. Indeed, the design of complex mixed-signal systems as a neural hardware accelerators requires frequent interaction between the application- and the circuit-level that can be enabled only with the support of accurate and fast-simulating devices’ models. In this work, we propose a solution to fill the aforementioned gap with a lookup table (LUT)-based Verilog-A model of IHP’s 1-transistor-1-RRAM (1T1R) cell. In addition, the implementation challenges of conveying the communication between the abstract ANN simulation and the circuital analysis are tackled with a design flow for resistive neural hardware accelerators that features a custom Python wrapper. As a demonstration of the proposed design flow and 1T1R model, an ANN for the MNIST handwritten digit recognition task is assessed with the last layer verified in circuit simulation. The obtained recognition confidence intervals show a considerable discrepancy between the purely application-level PyTorch simulation and the proposed design flow which spans across the abstraction layers down to the circuital analysis.</abstract>
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    <author>
      <firstName>Max</firstName>
      <lastName>Uhlmann</lastName>
    </author>
    <submitter>
      <firstName>Christian</firstName>
      <lastName>Wenger</lastName>
    </submitter>
    <author>
      <firstName>Tommaso</firstName>
      <lastName>Rizzi</lastName>
    </author>
    <author>
      <firstName>Jianan</firstName>
      <lastName>Wen</lastName>
    </author>
    <author>
      <firstName>Emilio</firstName>
      <lastName>Pérez-Bosch Quesada</lastName>
    </author>
    <author>
      <firstName>Bakr</firstName>
      <lastName>Al Beattie</lastName>
    </author>
    <author>
      <firstName>Karlheinz</firstName>
      <lastName>Ochs</lastName>
    </author>
    <author>
      <firstName>Eduardo</firstName>
      <lastName>Pérez</lastName>
    </author>
    <author>
      <firstName>Philip</firstName>
      <lastName>Ostrovskyy</lastName>
    </author>
    <author>
      <firstName>Corrado</firstName>
      <lastName>Carta</lastName>
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    <author>
      <firstName>Christian</firstName>
      <lastName>Wenger</lastName>
    </author>
    <author>
      <firstName>Gerhard</firstName>
      <lastName>Kahmen</lastName>
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    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>RRAM</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Neural network</value>
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  <doc>
    <id>30803</id>
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    <publishedYear>2022</publishedYear>
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    <completedDate>2023-05-04</completedDate>
    <publishedDate>--</publishedDate>
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    <title language="eng">SiGe BiCMOS as Enabling Technology for Next Generation RF &amp; THz Systems</title>
    <parentTitle language="eng">EuMIC 2021 Abstract Cards, 16th European Microwave Integrated Circuits Conference (EuMIC), London, United Kingdom, 2022</parentTitle>
    <identifier type="doi">10.23919/EuMIC50153.2022.9783893</identifier>
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    <author>
      <firstName>Gerhard</firstName>
      <lastName>Kahmen</lastName>
    </author>
    <submitter>
      <firstName>Gerhard</firstName>
      <lastName>Kahmen</lastName>
    </submitter>
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  </doc>
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    <publishedYear>2022</publishedYear>
    <thesisYearAccepted/>
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    <completedDate>2023-05-04</completedDate>
    <publishedDate>--</publishedDate>
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    <title language="eng">A V-band Low-Power and Compact Down-Conversion Mixer with Low LO Power in 130-nm SiGe BiCMOS Technology</title>
    <parentTitle language="eng">16th European Microwave Integrated Circuits Conference (EuMIC), 03-04 April 2022, London, United Kingdom</parentTitle>
    <identifier type="doi">10.23919/EuMIC50153.2022.9783953</identifier>
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    <enrichment key="Fprofil">4 Künstliche Intelligenz und Sensorik / Artificial Intelligence and Sensor Technology</enrichment>
    <author>
      <firstName>Batuhan</firstName>
      <lastName>Sütbas</lastName>
    </author>
    <submitter>
      <firstName>Gerhard</firstName>
      <lastName>Kahmen</lastName>
    </submitter>
    <author>
      <firstName>Herman Jalli</firstName>
      <lastName>Ng</lastName>
    </author>
    <author>
      <firstName>Jan</firstName>
      <lastName>Wessel</lastName>
    </author>
    <author>
      <firstName>Alexander</firstName>
      <lastName>Kölpin</lastName>
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    <author>
      <firstName>Gerhard</firstName>
      <lastName>Kahmen</lastName>
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  </doc>
  <doc>
    <id>30805</id>
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    <publishedYear>2022</publishedYear>
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    <completedDate>2023-05-04</completedDate>
    <publishedDate>--</publishedDate>
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    <title language="eng">Low-Power Ka- and V-Band Miller Compensated Amplifiers in 130-nm SiGe BiCMOS Technology</title>
    <parentTitle language="eng">16th European Microwave Integrated Circuits Conference (EuMIC), 03-04 April 2022, London, United Kingdom</parentTitle>
    <identifier type="doi">10.23919/EuMIC50153.2022.9783785</identifier>
    <identifier type="isbn">978-2-87487-064-4</identifier>
    <identifier type="isbn">978-1-6654-4722-5</identifier>
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    <author>
      <firstName>Batuhan</firstName>
      <lastName>Sütbas</lastName>
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    <submitter>
      <firstName>Gerhard</firstName>
      <lastName>Kahmen</lastName>
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    <author>
      <firstName>Herman Jalli</firstName>
      <lastName>Ngy</lastName>
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    <author>
      <firstName>Jan</firstName>
      <lastName>Wessel</lastName>
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    <author>
      <firstName>Alexander</firstName>
      <lastName>Kölpin</lastName>
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    <author>
      <firstName>Gerhard</firstName>
      <lastName>Kahmen</lastName>
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  </doc>
  <doc>
    <id>30806</id>
    <completedYear/>
    <publishedYear>2022</publishedYear>
    <thesisYearAccepted/>
    <language>eng</language>
    <pageFirst>579</pageFirst>
    <pageLast>582</pageLast>
    <pageNumber/>
    <edition/>
    <issue>6</issue>
    <volume>32</volume>
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    <belongsToBibliography>0</belongsToBibliography>
    <completedDate>2023-05-04</completedDate>
    <publishedDate>--</publishedDate>
    <thesisDateAccepted>--</thesisDateAccepted>
    <title language="eng">A 7.2-mW V-Band Frequency Doubler with 14% Total Efficiency in 130-nm SiGe BiCMOS</title>
    <parentTitle language="eng">IEEE Microwave and Wireless Components Letters</parentTitle>
    <identifier type="doi">10.1109/LMWC.2022.3141557</identifier>
    <identifier type="issn">1531-1309</identifier>
    <identifier type="issn">1558-1764</identifier>
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    <author>
      <firstName>Batuhan</firstName>
      <lastName>Sütbas</lastName>
    </author>
    <submitter>
      <firstName>Gerhard</firstName>
      <lastName>Kahmen</lastName>
    </submitter>
    <author>
      <firstName>Gerhard</firstName>
      <lastName>Kahmen</lastName>
    </author>
    <collection role="institutes" number="1521">FG Halbleitermaterialien</collection>
  </doc>
  <doc>
    <id>30797</id>
    <completedYear/>
    <publishedYear>2022</publishedYear>
    <thesisYearAccepted/>
    <language>eng</language>
    <pageFirst/>
    <pageLast/>
    <pageNumber>10</pageNumber>
    <edition/>
    <issue>1</issue>
    <volume>70</volume>
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    <completedDate>2023-05-04</completedDate>
    <publishedDate>--</publishedDate>
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    <title language="eng">A 56-Gb/s Optical Receiver with 2.08-µA Noise Monolithically Integrated into a 250-nm SiGe BiCMOS Technology</title>
    <parentTitle language="eng">IEEE Transactions on Microwave Theory and Techniques</parentTitle>
    <identifier type="doi">10.1109/TMTT.2021.3104838</identifier>
    <identifier type="issn">0018-9480</identifier>
    <identifier type="issn">1557-9670</identifier>
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    <author>
      <firstName>Giannino</firstName>
      <lastName>Dziallas</lastName>
    </author>
    <submitter>
      <firstName>Gerhard</firstName>
      <lastName>Kahmen</lastName>
    </submitter>
    <author>
      <firstName>Adel</firstName>
      <lastName>Fatemi</lastName>
    </author>
    <author>
      <firstName>Anna</firstName>
      <lastName>Peczek</lastName>
    </author>
    <author>
      <firstName>Lars</firstName>
      <lastName>Zimmermann</lastName>
    </author>
    <author>
      <firstName>Andrea</firstName>
      <lastName>Malignaggi</lastName>
    </author>
    <author>
      <firstName>Gerhard</firstName>
      <lastName>Kahmen</lastName>
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    <collection role="institutes" number="1521">FG Halbleitermaterialien</collection>
  </doc>
  <doc>
    <id>30798</id>
    <completedYear/>
    <publishedYear>2022</publishedYear>
    <thesisYearAccepted/>
    <language>eng</language>
    <pageFirst>1335</pageFirst>
    <pageLast>1338</pageLast>
    <pageNumber/>
    <edition/>
    <issue>11</issue>
    <volume>32</volume>
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    <contributingCorporation/>
    <belongsToBibliography>0</belongsToBibliography>
    <completedDate>2023-05-04</completedDate>
    <publishedDate>--</publishedDate>
    <thesisDateAccepted>--</thesisDateAccepted>
    <title language="eng">220-320-GHz J-Band 4-Way Power Amplifier in Advanced 130-nm BiCMOS Technology</title>
    <parentTitle language="eng">IEEE Microwave and Wireless Components Letters</parentTitle>
    <identifier type="doi">10.1109/LMWC.2022.3181407</identifier>
    <identifier type="issn">1531-1309</identifier>
    <identifier type="issn">1558-1764</identifier>
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    <enrichment key="Fprofil">4 Künstliche Intelligenz und Sensorik / Artificial Intelligence and Sensor Technology</enrichment>
    <author>
      <firstName>Mohamed Hussein</firstName>
      <lastName>Eissa</lastName>
    </author>
    <submitter>
      <firstName>Gerhard</firstName>
      <lastName>Kahmen</lastName>
    </submitter>
    <author>
      <firstName>Gunter</firstName>
      <lastName>Fischer</lastName>
    </author>
    <author>
      <firstName>Thomas</firstName>
      <lastName>Mausolf</lastName>
    </author>
    <author>
      <firstName>Holger</firstName>
      <lastName>Rücker</lastName>
    </author>
    <author>
      <firstName>Andrea</firstName>
      <lastName>Malignaggi</lastName>
    </author>
    <author>
      <firstName>Gerhard</firstName>
      <lastName>Kahmen</lastName>
    </author>
    <collection role="institutes" number="1521">FG Halbleitermaterialien</collection>
  </doc>
  <doc>
    <id>30800</id>
    <completedYear/>
    <publishedYear>2022</publishedYear>
    <thesisYearAccepted/>
    <language>eng</language>
    <pageFirst/>
    <pageLast/>
    <pageNumber>4</pageNumber>
    <edition/>
    <issue/>
    <volume/>
    <type>conferenceobject_ref</type>
    <publisherName/>
    <publisherPlace/>
    <creatingCorporation/>
    <contributingCorporation/>
    <belongsToBibliography>0</belongsToBibliography>
    <completedDate>2023-05-04</completedDate>
    <publishedDate>--</publishedDate>
    <thesisDateAccepted>--</thesisDateAccepted>
    <title language="eng">Lumped Ultra-Broadband Linear Driver in 130 nm SiGe SG13G3 Technology</title>
    <parentTitle language="eng">IEEE BiCMOS and Compound Semiconductor Integrated Circuits and Technology Symposium (BCICTS)</parentTitle>
    <identifier type="doi">10.1109/BCICTS53451.2022.10051703</identifier>
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    <author>
      <firstName>Festim</firstName>
      <lastName>Iseini</lastName>
    </author>
    <submitter>
      <firstName>Gerhard</firstName>
      <lastName>Kahmen</lastName>
    </submitter>
    <author>
      <firstName>Andrea</firstName>
      <lastName>Malignaggi</lastName>
    </author>
    <author>
      <firstName>Falk</firstName>
      <lastName>Korndörfer</lastName>
    </author>
    <author>
      <firstName>Mesut</firstName>
      <lastName>Inac</lastName>
    </author>
    <author>
      <firstName>Gerhard</firstName>
      <lastName>Kahmen</lastName>
    </author>
    <collection role="institutes" number="1521">FG Halbleitermaterialien</collection>
  </doc>
  <doc>
    <id>31351</id>
    <completedYear/>
    <publishedYear>2023</publishedYear>
    <thesisYearAccepted/>
    <language>eng</language>
    <pageFirst/>
    <pageLast/>
    <pageNumber>5</pageNumber>
    <edition/>
    <issue/>
    <volume/>
    <type>conferenceobject_ref</type>
    <publisherName>Institute of Electrical and Electronics Engineers (IEEE)</publisherName>
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    <belongsToBibliography>0</belongsToBibliography>
    <completedDate>2023-09-21</completedDate>
    <publishedDate>--</publishedDate>
    <thesisDateAccepted>--</thesisDateAccepted>
    <title language="eng">One-Transistor-Multiple-RRAM Cells for Energy-Efficient In-Memory Computing</title>
    <abstract language="eng">The use of resistive random-access memory (RRAM) for in-memory computing (IMC) architectures has significantly improved the energy-efficiency of artificial neural networks (ANN) over the past years. Current RRAM-technologies are physically limited to a defined unambiguously distinguishable number of stable states and a maximum resistive value and are compatible with present complementary metal-oxide semiconductor (CMOS)-technologies. In this work, we improved the accuracy of current ANN models by using increased weight resolutions of memristive devices, combining two or more in-series RRAM cells, integrated in the back end of line (BEOL) of the CMOS process. Based on system level simulations, 1T2R devices were fabricated in IHP's 130nm SiGe:BiCMOS technology node, demonstrating an increased number of states. We achieved an increase in weight resolution from 3 bit in ITIR cells to 6.5 bit in our 1T2R cell. The experimental data of 1T2R devices gives indications for the performance and energy-efficiency improvement in ITNR arrays for ANN applications.</abstract>
    <parentTitle language="eng">21st IEEE Interregional NEWCAS Conference (NEWCAS)</parentTitle>
    <identifier type="doi">10.1109/NEWCAS57931.2023.10198073</identifier>
    <identifier type="isbn">979-8-3503-0024-6</identifier>
    <identifier type="isbn">979-8-3503-0025-3</identifier>
    <identifier type="issn">2474-9672</identifier>
    <identifier type="issn">2472-467X</identifier>
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    <enrichment key="Artikelnummer">23547179</enrichment>
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    <author>
      <firstName>Max</firstName>
      <lastName>Uhlmann</lastName>
    </author>
    <submitter>
      <firstName>Christian</firstName>
      <lastName>Wenger</lastName>
    </submitter>
    <author>
      <firstName>Emilio</firstName>
      <lastName>Pérez-Bosch Quesada</lastName>
    </author>
    <author>
      <firstName>Markus</firstName>
      <lastName>Fritscher</lastName>
    </author>
    <author>
      <firstName>Eduardo</firstName>
      <lastName>Pérez</lastName>
    </author>
    <author>
      <firstName>Markus Andreas</firstName>
      <lastName>Schubert</lastName>
    </author>
    <author>
      <firstName>Marc</firstName>
      <lastName>Reichenbach</lastName>
    </author>
    <author>
      <firstName>Philip</firstName>
      <lastName>Ostrovskyy</lastName>
    </author>
    <author>
      <firstName>Christian</firstName>
      <lastName>Wenger</lastName>
    </author>
    <author>
      <firstName>Gerhard</firstName>
      <lastName>Kahmen</lastName>
    </author>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>RRAM</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>In-Memory Computing</value>
    </subject>
    <collection role="institutes" number="1521">FG Halbleitermaterialien</collection>
  </doc>
  <doc>
    <id>35438</id>
    <completedYear/>
    <publishedYear>2024</publishedYear>
    <thesisYearAccepted/>
    <language>eng</language>
    <pageFirst>1</pageFirst>
    <pageLast>3</pageLast>
    <pageNumber>3</pageNumber>
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    <publisherPlace>New York</publisherPlace>
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    <belongsToBibliography>0</belongsToBibliography>
    <completedDate>2025-01-28</completedDate>
    <publishedDate>--</publishedDate>
    <thesisDateAccepted>--</thesisDateAccepted>
    <title language="eng">A tunable inductor peaking technique for optical communication systems</title>
    <abstract language="eng">A tunable inductor peaking technique for loss compensation in optical communication systems is presented. The proposed technique is based on creating a tunable damped resonator with a fixed peaking inductor and a high-frequency transistor with low intrinsic capacitance. The tuning technique is first demonstrated with a generic equivalent circuit model and then implemented and evaluated using the high-speed bipolar transistor in 130 nm IHP SG13G2 BiCMOS technology, featuring ft/fmax of 350 / 450 GHz. Our proposed technique has been simulated in a real case scenario demonstrating the effectiveness of the tunable inductor peaking technique for loss compensation in optical communication systems.</abstract>
    <parentTitle language="eng">2024 IEEE 33rd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), Toronto, ON, Canada, 2024</parentTitle>
    <identifier type="doi">10.1109/EPEPS61853.2024.10753708</identifier>
    <identifier type="url">https://ieeexplore.ieee.org/document/10753708</identifier>
    <identifier type="isbn">979-8-3503-5123-1</identifier>
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    <author>
      <firstName>Festim</firstName>
      <lastName>Iseini</lastName>
    </author>
    <submitter>
      <firstName>Gerhard</firstName>
      <lastName>Kahmen</lastName>
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    <author>
      <firstName>Han-Ting</firstName>
      <lastName>Lin</lastName>
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      <firstName>Nicola</firstName>
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    <author>
      <firstName>Andrea</firstName>
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      <firstName>Corrado</firstName>
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      <firstName>Gerhard</firstName>
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    <author>
      <firstName>Andreas</firstName>
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  </doc>
  <doc>
    <id>35802</id>
    <completedYear/>
    <publishedYear>2025</publishedYear>
    <thesisYearAccepted/>
    <language>eng</language>
    <pageFirst>1</pageFirst>
    <pageLast>9</pageLast>
    <pageNumber>9</pageNumber>
    <edition/>
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    <volume/>
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    <completedDate>2025-04-29</completedDate>
    <publishedDate>--</publishedDate>
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    <title language="eng">RISC-V CPU design using RRAM-CMOS standard cells</title>
    <abstract language="eng">The breakdown of Dennard scaling has been the driver for many innovations such as multicore CPUs and has fueled the research into novel devices such as resistive random access memory (RRAM). These devices might be a means to extend the scalability of integrated circuits since they allow for fast and nonvolatile operation. Unfortunately, large analog circuits need to be designed and integrated in order to benefit from these cells, hindering the implementation of large systems. This work elaborates on a novel solution, namely, creating digital standard cells utilizing RRAM devices. Albeit this approach can be used both for small gates and large macroblocks, we illustrate it for a 2T2R-cell. Since RRAM devices can be vertically stacked with transistors, this enables us to construct a nand standard cell, which merely consumes the area of two transistors. This leads to a 25% area reduction compared to an equivalent CMOS nand gate. We illustrate achievable area savings with a half-adder circuit and integrate this novel cell into a digital standard cell library. A synthesized RISC-V core using RRAM-based cells results in a 10.7% smaller area than the equivalent design using standard CMOS gates.</abstract>
    <parentTitle language="eng">IEEE transactions on very large scale integration (VLSI) systems</parentTitle>
    <identifier type="doi">10.1109/TVLSI.2025.3554476</identifier>
    <identifier type="issn">1063-8210</identifier>
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    <author>
      <firstName>Markus</firstName>
      <lastName>Fritscher</lastName>
    </author>
    <editor>
      <firstName>Christian</firstName>
      <lastName>Wenger</lastName>
    </editor>
    <submitter>
      <firstName>Christian</firstName>
      <lastName>Wenger</lastName>
    </submitter>
    <author>
      <firstName>Max</firstName>
      <lastName>Uhlmann</lastName>
    </author>
    <author>
      <firstName>Philip</firstName>
      <lastName>Ostrovskyy</lastName>
    </author>
    <author>
      <firstName>Daniel</firstName>
      <lastName>Reiser</lastName>
    </author>
    <author>
      <firstName>Junchao</firstName>
      <lastName>Chen</lastName>
    </author>
    <author>
      <firstName>Jianan</firstName>
      <lastName>Wen</lastName>
    </author>
    <author>
      <firstName>Carsten</firstName>
      <lastName>Schulze</lastName>
    </author>
    <author>
      <firstName>Gerhard</firstName>
      <lastName>Kahmen</lastName>
    </author>
    <author>
      <firstName>Dietmar</firstName>
      <lastName>Fey</lastName>
    </author>
    <author>
      <firstName>Marc</firstName>
      <lastName>Reichenbach</lastName>
    </author>
    <author>
      <firstName>Milos</firstName>
      <lastName>Krstic</lastName>
    </author>
    <author>
      <firstName>Christian</firstName>
      <lastName>Wenger</lastName>
    </author>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>RRAM</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Logic gates</value>
    </subject>
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  </doc>
  <doc>
    <id>36231</id>
    <completedYear/>
    <publishedYear>2025</publishedYear>
    <thesisYearAccepted/>
    <language>eng</language>
    <pageFirst>1</pageFirst>
    <pageLast>12</pageLast>
    <pageNumber>12</pageNumber>
    <edition/>
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    <publisherPlace>New York</publisherPlace>
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    <belongsToBibliography>0</belongsToBibliography>
    <completedDate>2025-06-24</completedDate>
    <publishedDate>--</publishedDate>
    <thesisDateAccepted>--</thesisDateAccepted>
    <title language="eng">A compact one-transistor-multiple-RRAM characterization platform</title>
    <abstract language="eng">Emerging non-volatile memories (eNVMs) such as resistive random-access memory (RRAM) offer an alternative solution compared to standard CMOS technologies for implementation of in-memory computing (IMC) units used in artificial neural network (ANN) applications. Existing measurement equipment for device characterisation and programming of such eNVMs are usually bulky and expensive. In this work, we present a compact size characterization platform for RRAM devices, including a custom programming unit IC that occupies less than 1 mm2 of silicon area. Our platform is capable of testing one-transistor-one-RRAM (1T1R) as well as one-transistor-multiple-RRAM (1TNR) cells. Thus, to the best knowledge of the authors, this is the first demonstration of an integrated programming interface for 1TNR cells. The 1T2R IMC cells were fabricated in the IHP’s 130 nm BiCMOS technology and, in combination with other parts of the platform, are able to provide more synaptic weight resolution for ANN model applications while simultaneously decreasing the energy consumption by 50 %. The platform can generate programming voltage pulses with a 3.3 mV accuracy. Using the incremental step pulse with verify algorithm (ISPVA) we achieve 5 non-overlapping resistive states per 1T1R device. Based on those 1T1R base states we measure 15 resulting state combinations in the 1T2R cells.</abstract>
    <parentTitle language="eng">IEEE transactions on circuits and systems I : regular papers</parentTitle>
    <identifier type="doi">10.1109/TCSI.2025.3555234</identifier>
    <identifier type="issn">1549-8328</identifier>
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I"],"published-print":{"date-parts":[[2025]]},"DOI":"10.1109\/tcsi.2025.3555234","type":"journal-article","created":{"date-parts":[[2025,4,18]],"date-time":"2025-04-18T17:40:06Z","timestamp":1744998006000},"page":"1-12","source":"Crossref","is-referenced-by-count":0,"title":["A Compact One-Transistor-Multiple-RRAM Characterization Platform"],"prefix":"10.1109","author":[{"ORCID":"https:\/\/orcid.org\/0009-0002-8625-2040","authenticated-orcid":false,"given":"Max","family":"Uhlmann","sequence":"first","affiliation":[{"name":"IHP GmbH&amp;#x2013;Leibniz Institute for High Performance Microelectronics, Frankfurt (Oder), Germany"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-9879-386X","authenticated-orcid":false,"given":"Milosz","family":"Krysik","sequence":"additional","affiliation":[{"name":"Fraunhofer IEG, Cottbus, Germany"}]},{"ORCID":"https:\/\/orcid.org\/0009-0003-7733-8907","authenticated-orcid":false,"given":"Jianan","family":"Wen","sequence":"additional","affiliation":[{"name":"IHP GmbH&amp;#x2013;Leibniz Institute for High Performance Microelectronics, Frankfurt (Oder), Germany"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-9862-1419","authenticated-orcid":false,"given":"Max","family":"Frohberg","sequence":"additional","affiliation":[{"name":"IHP GmbH&amp;#x2013;Leibniz Institute for High Performance Microelectronics, Frankfurt (Oder), Germany"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-5205-0398","authenticated-orcid":false,"given":"Andrea","family":"Baroni","sequence":"additional","affiliation":[{"name":"IHP GmbH&amp;#x2013;Leibniz Institute for High Performance Microelectronics, Frankfurt (Oder), Germany"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-5260-7929","authenticated-orcid":false,"given":"Keerthi Dorai Swamy","family":"Reddy","sequence":"additional","affiliation":[{"name":"IHP GmbH&amp;#x2013;Leibniz Institute for High Performance Microelectronics, Frankfurt (Oder), Germany"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-7545-9420","authenticated-orcid":false,"given":"Eduardo","family":"P\u00e9rez","sequence":"additional","affiliation":[{"name":"IHP GmbH&amp;#x2013;Leibniz Institute for High Performance Microelectronics, Frankfurt (Oder), Germany"}]},{"ORCID":"https:\/\/orcid.org\/0009-0009-0393-2528","authenticated-orcid":false,"given":"Philip","family":"Ostrovskyy","sequence":"additional","affiliation":[{"name":"IHP GmbH&amp;#x2013;Leibniz Institute for High Performance Microelectronics, Frankfurt (Oder), Germany"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-7231-6704","authenticated-orcid":false,"given":"Krzysztof","family":"Piotrowski","sequence":"additional","affiliation":[{"name":"IHP GmbH&amp;#x2013;Leibniz Institute for High Performance Microelectronics, Frankfurt (Oder), Germany"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-9147-0160","authenticated-orcid":false,"given":"Corrado","family":"Carta","sequence":"additional","affiliation":[{"name":"IHP GmbH&amp;#x2013;Leibniz Institute for High Performance Microelectronics, Frankfurt (Oder), Germany"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-3698-2635","authenticated-orcid":false,"given":"Christian","family":"Wenger","sequence":"additional","affiliation":[{"name":"IHP GmbH&amp;#x2013;Leibniz Institute for High Performance Microelectronics, Frankfurt (Oder), Germany"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-2674-2240","authenticated-orcid":false,"given":"Gerhard","family":"Kahmen","sequence":"additional","affiliation":[{"name":"IHP GmbH&amp;#x2013;Leibniz Institute for High Performance Microelectronics, Frankfurt (Oder), Germany"}]}],"member":"263","container-title":["IEEE Transactions on Circuits and Systems I: Regular Papers"],"original-title":[],"link":[{"URL":"http:\/\/xplorestaging.ieee.org\/ielx8\/8919\/4358591\/10970101.pdf?arnumber=10970101","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,4,21]],"date-time":"2025-04-21T17:41:28Z","timestamp":1745257288000},"score":1,"resource":{"primary":{"URL":"https:\/\/ieeexplore.ieee.org\/document\/10970101\/"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2025]]},"references-count":0,"URL":"https:\/\/doi.org\/10.1109\/tcsi.2025.3555234","relation":{},"ISSN":["1549-8328","1558-0806"],"issn-type":[{"type":"print","value":"1549-8328"},{"type":"electronic","value":"1558-0806"}],"subject":[],"published":{"date-parts":[[2025]]}}}</enrichment>
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    <author>
      <firstName>Max</firstName>
      <lastName>Uhlmann</lastName>
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    <submitter>
      <firstName>Christian</firstName>
      <lastName>Wenger</lastName>
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    <author>
      <firstName>Milosz</firstName>
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      <firstName>Jianan</firstName>
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    <author>
      <firstName>Max</firstName>
      <lastName>Frohberg</lastName>
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    <author>
      <firstName>Andrea</firstName>
      <lastName>Baroni</lastName>
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    <author>
      <firstName>Keerthi Dorai Swamy</firstName>
      <lastName>Reddy</lastName>
    </author>
    <author>
      <firstName>Eduardo</firstName>
      <lastName>Pérez</lastName>
    </author>
    <author>
      <firstName>Philip</firstName>
      <lastName>Ostrovskyy</lastName>
    </author>
    <author>
      <firstName>Krzysztof</firstName>
      <lastName>Piotrowski</lastName>
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    <author>
      <firstName>Corrado</firstName>
      <lastName>Carta</lastName>
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    <author>
      <firstName>Christian</firstName>
      <lastName>Wenger</lastName>
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    <author>
      <firstName>Gerhard</firstName>
      <lastName>Kahmen</lastName>
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    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>RRAM</value>
    </subject>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>Vector Matrix Multiplication</value>
    </subject>
    <collection role="institutes" number="1521">FG Halbleitermaterialien</collection>
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    <completedDate>2025-08-18</completedDate>
    <publishedDate>--</publishedDate>
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    <title language="eng">End-to-end design flow for resistive neural accelerators</title>
    <abstract language="eng">Neural hardware accelerators have demonstrated notable energy efficiency in tackling tasks, which can be adapted to artificial neural network (ANN) structures. Research is currently directed towards leveraging resistive random-access memories (RRAMs) among various memristive devices. In conjunction with complementary metal-oxide semiconductor (CMOS) technologies within integrated circuits (ICs), RRAM devices are used to build such neural accelerators. In this study, we present a neural accelerator hardware design and verification flow, which uses a lookup table (LUT)-based Verilog-A model of IHP’s one-transistor-one-RRAM (1T1R) cell. In particular, we address the challenges of interfacing between abstract ANN simulations and circuit analysis by including a tailored Python wrapper into the design process for resistive neural hardware accelerators. To demonstrate our concept, the efficacy of the proposed design flow, we evaluate an ANN for the MNIST handwritten digit recognition task, as well as for the CIFAR-10 image recognition task, with the last layer verified through circuit simulation. Additionally, we implement different versions of a 1T1R model, based on quasi-static measurement data, providing insights on the effect of conductance level spacing and device-to-device variability. The circuit simulations tackle both schematic and physical layout assessment. The resulting recognition accuracies exhibit significant differences between the purely application-level PyTorch simulation and our proposed design flow, highlighting the relevance of circuit-level validation for the design of neural hardware accelerators.</abstract>
    <parentTitle language="eng">IEEE transactions on computer-aided design of integrated circuits and systems</parentTitle>
    <identifier type="doi">10.1109/TCAD.2025.3597237</identifier>
    <identifier type="issn">0278-0070</identifier>
    <identifier type="issn">1937-4151</identifier>
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    <author>
      <firstName>Max</firstName>
      <lastName>Uhlmann</lastName>
    </author>
    <submitter>
      <firstName>Christian</firstName>
      <lastName>Wenger</lastName>
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      <firstName>Tommaso</firstName>
      <lastName>Rizzi</lastName>
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      <firstName>Jianan</firstName>
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      <firstName>Emilio Pérez-Bosch</firstName>
      <lastName>Quesada</lastName>
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      <firstName>Bakr Al</firstName>
      <lastName>Beattie</lastName>
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      <firstName>Karlheinz</firstName>
      <lastName>Ochs</lastName>
    </author>
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      <firstName>Eduardo</firstName>
      <lastName>Pérez</lastName>
    </author>
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      <firstName>Philip</firstName>
      <lastName>Ostrovskyy</lastName>
    </author>
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      <lastName>Wenger</lastName>
    </author>
    <author>
      <firstName>Gerhard</firstName>
      <lastName>Kahmen</lastName>
    </author>
    <subject>
      <language>eng</language>
      <type>uncontrolled</type>
      <value>RRAM</value>
    </subject>
    <collection role="institutes" number="1521">FG Halbleitermaterialien</collection>
    <collection role="institutes" number="1122">FG Halbleitertechnologie</collection>
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