@inproceedings{KraatzZhangSchmeisseretal., author = {Kraatz, Matthias and Zhang, Lijuan and Schmeißer, Dieter and Zschech, Ehrenfried and Ho, Paul S.}, title = {Statistical Analysis of Computer-simulated On-Chip Interconnect Electromigration Lifetimes under the Influence of Microstructure and Strengthened Top Interface}, series = {Verhandlungen der Deutschen Physikalischen Gesellschaft, Reihe 6, Bd. 46}, booktitle = {Verhandlungen der Deutschen Physikalischen Gesellschaft, Reihe 6, Bd. 46}, publisher = {Deutsche Physikalische Gesellschaft}, address = {Bad Honnef}, issn = {0420-0195}, pages = {S. 292}, abstract = {We are investigating the statistics of computer-simulated interconnect electromigration (EM) lifetimes with regard to the effects of microstructure and a strengthened top interface. The degradation process of EM once threatened the entire existence of integrated circuit industry in the 1960s and has remained a major reliability concern. Ongoing miniaturization and the introduction of new materials further complicate the task of EM-resistant chip manufacturing. We have developed a simple two-dimensional finite difference simulation that models the mass transport by electromigration along the grain boundaries and the top interface of interconnect segments that allows us to do calculations of void nucleation and growth. A parallel computer simulates hundreds of interconnects simultaneously and statistical analysis becomes feasible. A Monte Carlo grain growth algorithm (a modified Potts version) is applied to model the grain structure of the interconnect segments. We will show that the simulation can be used to compare simulation and experiment qualitatively. Four cases have been studied: interconnect segments with small/large grains and weak/strong top interface.}, language = {en} } @misc{HoZschechSchmeisseretal., author = {Ho, Paul S. and Zschech, Ehrenfried and Schmeißer, Dieter and Meyer, Moritz Andreas and Huebner, Rene and Hauschildt, Meike and Zhang, Lijuan and Gall, Martin and Kraatz, Matthias}, title = {Scaling effects on microstructure and reliability for cu interconnects}, language = {en} }