@misc{MaldonadoCantudoSwamyReddyetal., author = {Maldonado, David and Cantudo, Antonio and Swamy Reddy, Keerthi Dorai and Pechmann, Stefan and Uhlmann, Max and Wenger, Christian and Roldan, Juan Bautista and P{\´e}rez, Eduardo}, title = {Influence of stop and gate voltage on resistive switching of 1T1R HfO2-based memristors, a modeling and variability analysis}, series = {Materials Science in Semiconductor Processing}, volume = {182}, journal = {Materials Science in Semiconductor Processing}, issn = {1873-4081}, doi = {10.1016/j.mssp.2024.108726}, pages = {9}, language = {en} } @misc{FritscherSinghRizzietal., author = {Fritscher, Markus and Singh, Simranjeet and Rizzi, Tommaso and Baroni, Andrea and Reiser, Daniel and Mallah, Maen and Hartmann, David and Bende, Ankit and Kempen, Tim and Uhlmann, Max and Kahmen, Gerhard and Fey, Dietmar and Rana, Vikas and Menzel, Stephan and Reichenbach, Marc and Krstic, Milos and Merchant, Farhad and Wenger, Christian}, title = {A flexible and fast digital twin for RRAM systems applied for training resilient neural networks}, series = {Scientific Reports}, volume = {14}, journal = {Scientific Reports}, number = {1}, publisher = {Springer Science and Business Media LLC}, issn = {2045-2322}, doi = {10.1038/s41598-024-73439-z}, pages = {13}, abstract = {Resistive Random Access Memory (RRAM) has gained considerable momentum due to its non-volatility and energy efficiency. Material and device scientists have been proposing novel material stacks that can mimic the "ideal memristor" which can deliver performance, energy efficiency, reliability and accuracy. However, designing RRAM-based systems is challenging. Engineering a new material stack, designing a device, and experimenting takes significant time for material and device researchers. Furthermore, the acceptability of the device is ultimately decided at the system level. We see a gap here where there is a need for facilitating material and device researchers with a "push button" modeling framework that allows to evaluate the efficacy of the device at system level during early device design stages. Speed, accuracy, and adaptability are the fundamental requirements of this modelling framework. In this paper, we propose a digital twin (DT)-like modeling framework that automatically creates RRAM device models from device measurement data. Furthermore, the model incorporates the peripheral circuit to ensure accurate energy and performance evaluations. We demonstrate the DT generation and DT usage for multiple RRAM technologies and applications and illustrate the achieved performance of our GPU implementation. We conclude with the application of our modeling approach to measurement data from two distinct fabricated devices, validating its effectiveness in a neural network processing an Electrocardiogram (ECG) dataset and incorporating Fault Aware Training (FAT).}, language = {en} } @misc{FritscherUhlmannOstrovskyyetal., author = {Fritscher, Markus and Uhlmann, Max and Ostrovskyy, Philip and Reiser, Daniel and Chen, Junchao and Schubert, Andreas and Schulze, Carsten and Kahmen, Gerhard and Fey, Dietmar and Reichenbach, Marc and Krstic, Milos and Wenger, Christian}, title = {Area-efficient digital design using RRAM-CMOS standard cells}, series = {2024 IEEE Computer Society Annual Symposium on VLSI (ISVLSI)}, volume = {18}, journal = {2024 IEEE Computer Society Annual Symposium on VLSI (ISVLSI)}, publisher = {IEEE}, isbn = {979-8-3503-5411-9}, issn = {2159-3477}, doi = {10.1109/ISVLSI61997.2024.00026}, pages = {81 -- 87}, abstract = {Extending the scalability of digital integrated circuits through novel device concepts is an attractive option. Among these concepts, resistive random access memory (RRAM) devices allow fast and nonvolatile operation. However, building large memristive systems is still challenging since large analog circuits have to be designed and integrated. In this paper, we propose a novel solution - the implementation of digital standard cells by the means of RRAM devices. While this methodology is universal, with applications ranging from few-device-circuits to large macroblocks, we demonstrate it for a 2T2R-cell. The benefits of using RRAM devices are demonstrated by implementing a NAND standard cell merely consuming the area of two transistors. This cell is about 25 \% smaller than the equivalent CMOS NAND in the same technology. We use these cells to implement a half adder, beating the area of the equivalent CMOS implementation using more sophisticates gates by 15 \%. Lastly, we fully integrate this novel standard cell into a digital standard cell library and perform a synthesis and layout of a RISC-V CPU core.}, language = {en} } @misc{VinuesaGarciaDuenasetal., author = {Vinuesa, Guillermo and Garcia, Hector and Duenas, Salvador and Castan, Helena and I{\~n}iguez de la Torre, Ignacio and Gonzalez, Tomas and Dorai Swamy Reddy, Keerthi and Uhlmann, Max and Wenger, Christian and Perez, Eduardo}, title = {Effect of the temperature on the performance and dynamic behavior of HfO2-Based Rram Devices}, series = {ECS Meeting Abstracts}, volume = {MA2024-01}, journal = {ECS Meeting Abstracts}, number = {21}, publisher = {The Electrochemical Society}, issn = {2151-2043}, doi = {10.1149/MA2024-01211297mtgabs}, pages = {1297 -- 1297}, abstract = {Over the past decades, the demand for semiconductor memory devices has been steadily increasing, and is currently experiencing an unprecedented boost due to the development and expansion of artificial intelligence. Among emerging high-density non-volatile memories, resistive random-access memory (RRAM) is one of the best recourses for all kind of applications, such as neuromorphic computing or hardware security [1]. Although many materials have been evaluated for RRAM development, some of them with excellent results, HfO2 is one of the established materials in CMOS domain due to its compatibility with standard materials and processes [2]. The main goal of this work is to study the switching capability and stability of HfO2-based RRAMs, as well as to explore their ability in the field of analogue applications, by analyzing the evolution of the resistance states that allow multilevel control. Indeed, analogue operation is a key point for achieving electronic neural synapses in neuromorphic systems, with synaptic weight information encoded in the different resistance states. This research has been carried out over a wide temperature range, between 40 and 340 K, as we are interested in testing the extent to which performance is maintained or modified, with a view to designing neuromorphic circuits that are also suitable in the low-temperature realm. We aim to prove that these simple, fast, high integration density structures can also be used in circuits designed for specific applications, such as aerospace systems. The RRAM devices studied in this work are TiN/Ti/8 nm-HfO2/TiN metal-insulator-metal (MIM) capacitors. Dielectric layers were atomic layer deposited (ALD). It has been demonstrated that the Ti coat in the top electrode acts as a scavenger that absorbs oxygen atoms from the HfO2 layer, and facilitates the creation of conductive filaments of oxygen vacancies [3]. In fact, the oxygen reservoir capability of Ti is well known, as it is able to attract and release oxygen atoms from or to the HfO2 layer during the RRAM operation [4]. The clustering of vacancies extends through the entire thickness of the oxide and, after an electroformig step, it joins the upper and lower electrodes and the device reaches the low resistance state (LRS). By applying adequate electrical signals, the filaments can be partially dissolved, which brings the device into the high-resistance state (HRS), with lower current values. The set process brings the device to the LRS state, while the reset one brings it to the HRS. The dependence of electrical conductivity on external applied electrical excitation allows triggering the device between the both states in a non-volatile manner [5]. The experimental equipment used consisted of a Keithley 4200-SCS semiconductor parameter analyzer and a Lake Shore cryogenic probe station. Fig.1 shows current-voltage cycles measured at different temperatures; the averages values at each temperature, both in logarithmic and linear scale, are also shown. The functional window increases as temperature decreases. The evolutions of set and reset voltage values with temperature are depicted in Fig.2, whereas the current values (measured at 0.1 V) corresponding to the LRS and HRS can be seen in Fig.3. LRS resistance decreases as temperature increases, in agreement with semiconductor behaviour, probably due to a hopping conduction mechanism. Both set and reset voltages decrease as temperature increases; the reset process is smoother at high temperatures. The reduction in reset voltage variability as temperature increases is very notable. Finally, Fig. 4 shows a picture of the transient behaviour; in the right panel of the same figure, the amplitudes of the current transients in the reset state have been included in the external loop. To sum up, the resistive switching phenomena is studied in a wide temperature range. The LRS shows semiconducting behavior with temperature, most likely related to a hopping conduction mechanism. Switching voltages decrease as temperature increases, with a notable reduction in reset voltage variability. An excellent control of intermediate resistance state is shown through current transients at several voltages in the reset process. REFERENCES [1] M. Asif et al., Materials Today Electronics 1, 100004 (2022). [2] S. Slesazeck et al., Nanotechnology 30, 352003 (2019). [3] Z. Fang et al., IEEE Electron Device Letters 35, 9, 912-914 (2014). [4] H. Y. Lee et al., IEEE Electron Device Letters 31, 1, 44-46 (2010). [5] D. J. Wouters et al., Proceedings of the IEEE 103, 8, 1274-1288 (2015). Figure 1}, language = {en} } @misc{WenBaroniPerezetal., author = {Wen, Jianan and Baroni, Andrea and Perez, Eduardo and Uhlmann, Max and Fritscher, Markus and KrishneGowda, Karthik and Ulbricht, Markus and Wenger, Christian and Krstic, Milos}, title = {Towards reliable and energy-efficient RRAM based discrete fourier transform accelerator}, series = {2024 Design, Automation \& Test in Europe Conference \& Exhibition (DATE)}, journal = {2024 Design, Automation \& Test in Europe Conference \& Exhibition (DATE)}, publisher = {IEEE}, isbn = {978-3-9819263-8-5}, issn = {1558-1101}, doi = {10.23919/DATE58400.2024.10546709}, pages = {1 -- 6}, abstract = {The Discrete Fourier Transform (DFT) holds a prominent place in the field of signal processing. The development of DFT accelerators in edge devices requires high energy efficiency due to the limited battery capacity. In this context, emerging devices such as resistive RAM (RRAM) provide a promising solution. They enable the design of high-density crossbar arrays and facilitate massively parallel and in situ computations within memory. However, the reliability and performance of the RRAM-based systems are compromised by the device non-idealities, especially when executing DFT computations that demand high precision. In this paper, we propose a novel adaptive variability-aware crossbar mapping scheme to address the computational errors caused by the device variability. To quantitatively assess the impact of variability in a communication scenario, we implemented an end-to-end simulation framework integrating the modulation and demodulation schemes. When combining the presented mapping scheme with an optimized architecture to compute DFT and inverse DFT(IDFT), compared to the state-of-the-art architecture, our simulation results demonstrate energy and area savings of up to 57 \% and 18 \%, respectively. Meanwhile, the DFT matrix mapping error is reduced by 83\% compared to conventional mapping. In a case study involving 16-quadrature amplitude modulation (QAM), with the optimized architecture prioritizing energy efficiency, we observed a bit error rate (BER) reduction from 1.6e-2 to 7.3e-5. As for the conventional architecture, the BER is optimized from 2.9e-3 to zero.}, language = {en} } @misc{UhlmannRizziWenetal., author = {Uhlmann, Max and Rizzi, Tommaso and Wen, Jianan and P{\´e}rez-Bosch Quesada, Emilio and Al Beattie, Bakr and Ochs, Karlheinz and P{\´e}rez, Eduardo and Ostrovskyy, Philip and Carta, Corrado and Wenger, Christian and Kahmen, Gerhard}, title = {LUT-based RRAM model for neural accelerator circuit simulation}, series = {Proceedings of the 18th ACM International Symposium on Nanoscale Architectures}, journal = {Proceedings of the 18th ACM International Symposium on Nanoscale Architectures}, publisher = {ACM}, address = {New York, NY, USA}, doi = {10.1145/3611315.3633273}, pages = {1 -- 6}, abstract = {Neural hardware accelerators have been proven to be energy-efficient when used to solve tasks which can be mapped into an artificial neural network (ANN) structure. Resistive random-access memories (RRAMs) are currently under investigation together with several different memristive devices as promising technologies to build such accelerators combined together with complementary metal-oxide semiconductor (CMOS)-technologies in integrated circuits (ICs). While many research groups are actively developing sophisticated physical-based representations to better understand the underlying phenomena characterizing these devices, not much work has been dedicated to exploit the trade-off between simulation time and accuracy in the definition of low computational demanding models suitable to be used at many abstraction layers. Indeed, the design of complex mixed-signal systems as a neural hardware accelerators requires frequent interaction between the application- and the circuit-level that can be enabled only with the support of accurate and fast-simulating devices' models. In this work, we propose a solution to fill the aforementioned gap with a lookup table (LUT)-based Verilog-A model of IHP's 1-transistor-1-RRAM (1T1R) cell. In addition, the implementation challenges of conveying the communication between the abstract ANN simulation and the circuital analysis are tackled with a design flow for resistive neural hardware accelerators that features a custom Python wrapper. As a demonstration of the proposed design flow and 1T1R model, an ANN for the MNIST handwritten digit recognition task is assessed with the last layer verified in circuit simulation. The obtained recognition confidence intervals show a considerable discrepancy between the purely application-level PyTorch simulation and the proposed design flow which spans across the abstraction layers down to the circuital analysis.}, language = {en} } @misc{UhlmannPerezBoschQuesadaFritscheretal., author = {Uhlmann, Max and P{\´e}rez-Bosch Quesada, Emilio and Fritscher, Markus and P{\´e}rez, Eduardo and Schubert, Markus Andreas and Reichenbach, Marc and Ostrovskyy, Philip and Wenger, Christian and Kahmen, Gerhard}, title = {One-Transistor-Multiple-RRAM Cells for Energy-Efficient In-Memory Computing}, series = {21st IEEE Interregional NEWCAS Conference (NEWCAS)}, journal = {21st IEEE Interregional NEWCAS Conference (NEWCAS)}, publisher = {Institute of Electrical and Electronics Engineers (IEEE)}, isbn = {979-8-3503-0024-6}, issn = {2474-9672}, doi = {10.1109/NEWCAS57931.2023.10198073}, pages = {5}, abstract = {The use of resistive random-access memory (RRAM) for in-memory computing (IMC) architectures has significantly improved the energy-efficiency of artificial neural networks (ANN) over the past years. Current RRAM-technologies are physically limited to a defined unambiguously distinguishable number of stable states and a maximum resistive value and are compatible with present complementary metal-oxide semiconductor (CMOS)-technologies. In this work, we improved the accuracy of current ANN models by using increased weight resolutions of memristive devices, combining two or more in-series RRAM cells, integrated in the back end of line (BEOL) of the CMOS process. Based on system level simulations, 1T2R devices were fabricated in IHP's 130nm SiGe:BiCMOS technology node, demonstrating an increased number of states. We achieved an increase in weight resolution from 3 bit in ITIR cells to 6.5 bit in our 1T2R cell. The experimental data of 1T2R devices gives indications for the performance and energy-efficiency improvement in ITNR arrays for ANN applications.}, language = {en} } @misc{PerezBoschQuesadaRizziGuptaetal., author = {Perez-Bosch Quesada, Emilio and Rizzi, Tommaso and Gupta, Aditya and Mahadevaiah, Mamathamba Kalishettyhalli and Schubert, Andreas and Pechmann, Stefan and Jia, Ruolan and Uhlmann, Max and Hagelauer, Amelie and Wenger, Christian and P{\´e}rez, Eduardo}, title = {Multi-Level Programming on Radiation-Hard 1T1R Memristive Devices for In-Memory Computing}, series = {14th Spanish Conference on Electron Devices (CDE 2023), Valencia, Spain, 06-08 June 2023}, journal = {14th Spanish Conference on Electron Devices (CDE 2023), Valencia, Spain, 06-08 June 2023}, publisher = {Institute of Electrical and Electronics Engineers (IEEE)}, isbn = {979-8-3503-0240-0}, doi = {10.1109/CDE58627.2023.10339525}, pages = {4}, abstract = {This work presents a quasi-static electrical characterization of 1-transistor-1-resistor memristive structures designed following hardness-by-design techniques integrated in the CMOS fabrication process to assure multi-level capabilities in harsh radiation environments. Modulating the gate voltage of the enclosed layout transistor connected in series with the memristive device, it was possible to achieve excellent switching capabilities from a single high resistance state to a total of eight different low resistance states (more than 3 bits). Thus, the fabricated devices are suitable for their integration in larger in-memory computing systems and in multi-level memory applications. Index Terms—radiation-hard, hardness-by-design, memristive devices, Enclosed Layout Transistor, in-memory computing}, language = {en} } @misc{FritscherUhlmannOstrovskyyetal., author = {Fritscher, Markus and Uhlmann, Max and Ostrovskyy, Philip and Reiser, Daniel and Chen, Junchao and Wen, Jianan and Schulze, Carsten and Kahmen, Gerhard and Fey, Dietmar and Reichenbach, Marc and Krstic, Milos and Wenger, Christian}, title = {RISC-V CPU design using RRAM-CMOS standard cells}, series = {IEEE transactions on very large scale integration (VLSI) systems}, journal = {IEEE transactions on very large scale integration (VLSI) systems}, editor = {Wenger, Christian}, publisher = {Institute of Electrical and Electronics Engineers (IEEE)}, address = {New York}, issn = {1063-8210}, doi = {10.1109/TVLSI.2025.3554476}, pages = {1 -- 9}, abstract = {The breakdown of Dennard scaling has been the driver for many innovations such as multicore CPUs and has fueled the research into novel devices such as resistive random access memory (RRAM). These devices might be a means to extend the scalability of integrated circuits since they allow for fast and nonvolatile operation. Unfortunately, large analog circuits need to be designed and integrated in order to benefit from these cells, hindering the implementation of large systems. This work elaborates on a novel solution, namely, creating digital standard cells utilizing RRAM devices. Albeit this approach can be used both for small gates and large macroblocks, we illustrate it for a 2T2R-cell. Since RRAM devices can be vertically stacked with transistors, this enables us to construct a nand standard cell, which merely consumes the area of two transistors. This leads to a 25\% area reduction compared to an equivalent CMOS nand gate. We illustrate achievable area savings with a half-adder circuit and integrate this novel cell into a digital standard cell library. A synthesized RISC-V core using RRAM-based cells results in a 10.7\% smaller area than the equivalent design using standard CMOS gates.}, language = {en} } @misc{UhlmannKrysikWenetal., author = {Uhlmann, Max and Krysik, Milosz and Wen, Jianan and Frohberg, Max and Baroni, Andrea and Reddy, Keerthi Dorai Swamy and P{\´e}rez, Eduardo and Ostrovskyy, Philip and Piotrowski, Krzysztof and Carta, Corrado and Wenger, Christian and Kahmen, Gerhard}, title = {A compact one-transistor-multiple-RRAM characterization platform}, series = {IEEE transactions on circuits and systems I : regular papers}, journal = {IEEE transactions on circuits and systems I : regular papers}, publisher = {Institute of Electrical and Electronics Engineers (IEEE)}, address = {New York}, issn = {1549-8328}, doi = {10.1109/TCSI.2025.3555234}, pages = {1 -- 12}, abstract = {Emerging non-volatile memories (eNVMs) such as resistive random-access memory (RRAM) offer an alternative solution compared to standard CMOS technologies for implementation of in-memory computing (IMC) units used in artificial neural network (ANN) applications. Existing measurement equipment for device characterisation and programming of such eNVMs are usually bulky and expensive. In this work, we present a compact size characterization platform for RRAM devices, including a custom programming unit IC that occupies less than 1 mm2 of silicon area. Our platform is capable of testing one-transistor-one-RRAM (1T1R) as well as one-transistor-multiple-RRAM (1TNR) cells. Thus, to the best knowledge of the authors, this is the first demonstration of an integrated programming interface for 1TNR cells. The 1T2R IMC cells were fabricated in the IHP's 130 nm BiCMOS technology and, in combination with other parts of the platform, are able to provide more synaptic weight resolution for ANN model applications while simultaneously decreasing the energy consumption by 50 \%. The platform can generate programming voltage pulses with a 3.3 mV accuracy. Using the incremental step pulse with verify algorithm (ISPVA) we achieve 5 non-overlapping resistive states per 1T1R device. Based on those 1T1R base states we measure 15 resulting state combinations in the 1T2R cells.}, language = {en} } @misc{UhlmannRizziWenetal., author = {Uhlmann, Max and Rizzi, Tommaso and Wen, Jianan and Quesada, Emilio P{\´e}rez-Bosch and Beattie, Bakr Al and Ochs, Karlheinz and P{\´e}rez, Eduardo and Ostrovskyy, Philip and Carta, Corrado and Wenger, Christian and Kahmen, Gerhard}, title = {End-to-end design flow for resistive neural accelerators}, series = {IEEE transactions on computer-aided design of integrated circuits and systems}, journal = {IEEE transactions on computer-aided design of integrated circuits and systems}, publisher = {Institute of Electrical and Electronics Engineers (IEEE)}, address = {New York}, issn = {0278-0070}, doi = {10.1109/TCAD.2025.3597237}, pages = {1 -- 5}, abstract = {Neural hardware accelerators have demonstrated notable energy efficiency in tackling tasks, which can be adapted to artificial neural network (ANN) structures. Research is currently directed towards leveraging resistive random-access memories (RRAMs) among various memristive devices. In conjunction with complementary metal-oxide semiconductor (CMOS) technologies within integrated circuits (ICs), RRAM devices are used to build such neural accelerators. In this study, we present a neural accelerator hardware design and verification flow, which uses a lookup table (LUT)-based Verilog-A model of IHP's one-transistor-one-RRAM (1T1R) cell. In particular, we address the challenges of interfacing between abstract ANN simulations and circuit analysis by including a tailored Python wrapper into the design process for resistive neural hardware accelerators. To demonstrate our concept, the efficacy of the proposed design flow, we evaluate an ANN for the MNIST handwritten digit recognition task, as well as for the CIFAR-10 image recognition task, with the last layer verified through circuit simulation. Additionally, we implement different versions of a 1T1R model, based on quasi-static measurement data, providing insights on the effect of conductance level spacing and device-to-device variability. The circuit simulations tackle both schematic and physical layout assessment. The resulting recognition accuracies exhibit significant differences between the purely application-level PyTorch simulation and our proposed design flow, highlighting the relevance of circuit-level validation for the design of neural hardware accelerators.}, language = {en} } @misc{WenBaroniUhlmannetal., author = {Wen, Jianan and Baroni, Andrea and Uhlmann, Max and Perez, Eduardo and Wenger, Christian and Krstic, Milos}, title = {ReFFT : an energy-efficient RRAM-based FFT accelerator}, series = {IEEE transactions on computer-aided design of integrated circuits and systems}, journal = {IEEE transactions on computer-aided design of integrated circuits and systems}, publisher = {IEEE}, address = {Piscataway, NJ}, issn = {0278-0070}, doi = {10.1109/TCAD.2025.3627146}, pages = {1 -- 14}, abstract = {The fast Fourier transform (FFT) is a highly efficient algorithm for computing the discrete Fourier transform (DFT). It is widely employed in various applications, including digital communication, image processing, and signal analysis. Recently, in-memory computing architectures based on emerging technologies, such as resistive RAM (RRAM), have demonstrated promising performance with low hardware cost for data-intensive applications. However, directly mapping FFT onto RRAM crossbars is challenging because the algorithm relies on many small, sequential butterfly operations, while cross-bars are optimized for large-scale, highly parallel vector-matrix multiplications (VMMs). In this paper, we introduce ReFFT, a system architecture that reformulates FFT computations for efficient execution on RRAM crossbars. ReFFT combines the reduced computational complexity of FFT with the parallel VMM capability of RRAM. We incorporate measured device data into our framework to analyze the effect of variability and develop an adaptive mapping scheme that improves twiddle-factor programming accuracy, leading to a 9.9 dB peak signal-to-noise ratio (PSNR) improvement for a 256-point FFT. Compared with prior RRAM-based DFT designs, ReFFT achieves up to 4.6× and 19.5× higher energy efficiency for 256- and 2048-point FFTs, respectively. The system is further validated in digital communication and satellite image compression tasks.}, language = {en} } @misc{PerezMaldonadoPechmannetal., author = {Perez, Eduardo and Maldonado, David and Pechmann, Stefan and Reddy, Keerthi Dorai Swamy and Uhlmann, Max and Hagelauer, Amelie and Roldan, Juan Bautista and Wenger, Christian}, title = {Impact of the series resistance on switching characteristics of 1T1R HfO₂-based RRAM devices}, series = {2025 15th Spanish Conference on Electron Devices (CDE)}, journal = {2025 15th Spanish Conference on Electron Devices (CDE)}, publisher = {Institute of Electrical and Electronics Engineers (IEEE)}, address = {Piscataway, NJ}, isbn = {979-8-3315-9618-7}, doi = {10.1109/CDE66381.2025.11038868}, pages = {1 -- 4}, abstract = {This study investigates the influence of the series resistance (RS) on the switching characteristics of 1-transistor-1-resistor (1T1R) RRAM devices based on HfO2 and Al:HfO₂ dielectrics. Intrinsic RS values were extracted from I-V characteristics measured over 50 Reset-Set cycles at various gate voltages (VG) by using a numerical transformation method. Results reveal the contribution of the transistor's resistance to the overall RS. A linear relationship between RS values and Set transition voltages (VTS) was found, with larger RS values amplifying the variability in switching parameters. Comparative analysis of cumulative distribution functions (CDFs) highlights differences between technologies, showing lower VTS values as well as lower sensitivity to RS for Al:HfO₂-based devices. These findings underscore the critical role of RS in modeling and optimizing the performance of RRAM devices for reliable operation.}, language = {en} }