@misc{WenAugelWangetal., author = {Wen, Hanying and Augel, Lion and Wang, Wenjuan and Knobbe, Jens}, title = {Characterization of AlSiCu/TiN/p-Si Schottky Contacts with Nanophotonic Structures for Near-infrared Photodetectors}, series = {2023 46th International Spring Seminar on Electronics Technology (ISSE) : 10-14 May 2023 : conference location: Timișoara, Romania}, journal = {2023 46th International Spring Seminar on Electronics Technology (ISSE) : 10-14 May 2023 : conference location: Timișoara, Romania}, publisher = {IEEE}, address = {Piscataway, NJ}, isbn = {979-8-3503-3485-2}, doi = {10.1109/ISSE57496.2023.10168510}, pages = {1 -- 5}, abstract = {Schottky photodetectors based on internal photoemission have the potential of an adjustable detection range in the near-infrared range and Si compatible technology integration. The external quantum efficiency of Schottky photodetectors can be improved using nanophotonic structures, which enhance the absorption of the device. However, the electrical properties of Schottky photodetectors deviate under an altered metal-semiconductor interface topography. We characterize a common layer system for metal contacts consisting of a TiN interstitial layer between the p-Si wafer and the AlSiCu metallization. By varying the thickness of the TiN we discuss how homogeneity of the sputtered layers influence device properties with different interface topographies. Through electrical wafer-level characterization, the characteristics of the Schottky contact are evaluated and compared to the ideal physical modelling.}, language = {en} } @misc{AugelWenKnobbe, author = {Augel, Lion and Wen, Hanying and Knobbe, Jens}, title = {TiN-Si Schottky Diodes for SWIR Detection}, series = {Tagungsband MikroSystemTechnik Kongress 2023, Dresden, 23. - 25. Oktober 2023}, journal = {Tagungsband MikroSystemTechnik Kongress 2023, Dresden, 23. - 25. Oktober 2023}, publisher = {VDE Verlag}, address = {Berlin}, isbn = {978-3-8007-6204-0}, pages = {30 -- 34}, language = {en} }