@inproceedings{TsujiKupnikKhuriYakub, author = {Tsuji, Yukihide and Kupnik, Mario and Khuri-Yakub, Butrus T.}, title = {Low temperature process for CMUT fabrication with wafer bonding technique}, series = {2010 IEEE International Ultrasonics Symposium (IUS 2010), San Diego, California, USA, 11 - 14 October 2010}, booktitle = {2010 IEEE International Ultrasonics Symposium (IUS 2010), San Diego, California, USA, 11 - 14 October 2010}, publisher = {IEEE}, address = {Piscataway, NJ}, isbn = {978-1-4577-0381-2}, pages = {551 -- 554}, language = {en} }