@inproceedings{SchaeferBergerSchoettkeetal., author = {Sch{\"a}fer, Stephan and Berger, Ulrich and Sch{\"o}ttke, Dirk and K{\"a}mpfe, Thomas}, title = {Wireless communication in rough industrial environments}, series = {Wireless Congress 2012, systems \& applications, 14 - 15 November 2012, Munich, Germany}, booktitle = {Wireless Congress 2012, systems \& applications, 14 - 15 November 2012, Munich, Germany}, publisher = {WEKA-Fachmedien}, address = {Haar}, isbn = {978-3-645-50110-1}, language = {en} } @inproceedings{SchaeferBergerSchoettkeetal., author = {Sch{\"a}fer, Stephan and Berger, Ulrich and Sch{\"o}ttke, Dirk and K{\"a}mpfe, Thomas}, title = {Technical conditions for the use of autonomous systems: A general approach for holistic engineering}, series = {2013 IEEE 18th Conference on Emerging Technologies \& Factory Automation (ETFA), 10-13 September 2013, Cagliari, Italy}, booktitle = {2013 IEEE 18th Conference on Emerging Technologies \& Factory Automation (ETFA), 10-13 September 2013, Cagliari, Italy}, publisher = {IEEE}, address = {Piscataway, NJ}, isbn = {978-1-4799-0862-2}, pages = {9}, language = {en} } @inproceedings{SchaeferSchoettkeKaempfeetal., author = {Sch{\"a}fer, Stephan and Sch{\"o}ttke, Dirk and K{\"a}mpfe, Thomas and Kulasekara, Shalika and Berger, Ulrich and Dayarathna, H. A. N. D.}, title = {Strategies for Energy-oriented Process-Control: Requirements on Use Case of Container Handling.}, series = {Proceeding of the 7th International Conference on Information and Automatisation for Substainability (ICIAfS 2014), Colombo, Sri Lanka, 22-24.12.2014}, booktitle = {Proceeding of the 7th International Conference on Information and Automatisation for Substainability (ICIAfS 2014), Colombo, Sri Lanka, 22-24.12.2014}, publisher = {IEEE}, address = {Piscataway, NJ}, isbn = {978-1-4799-4598-6}, pages = {1 -- 6}, language = {en} } @inproceedings{BergerSchaeferSchottkeetal., author = {Berger, Ulrich and Sch{\"a}fer, Stephan and Schottke, Dirk and Kampfe, Thomas and Tauber, Bernd and Kr{\"o}nke, Dietrich}, title = {Increasing the flexibility of manufacturing: A service-oriented approach in automation}, series = {21st International Conference on Emerging Technologies and Factory Automation (ETFA), 6-9 Sept. 2016, Berlin}, booktitle = {21st International Conference on Emerging Technologies and Factory Automation (ETFA), 6-9 Sept. 2016, Berlin}, publisher = {IEEE}, address = {Piscataway, NJ}, isbn = {978-1-5090-1314-2}, doi = {10.1109/ETFA.2016.7733673}, pages = {4}, abstract = {In addition to the already required functionality, future production systems should consider the requirements of flexible and demand-oriented resource utilization. Those are not only related on fields of energy, but also material-efficient and time-efficient use of available means of production. Modular system architectures and modular solutions facilitate the planning and implementation of these requirements. Using service-oriented architectures in automation allow an approach for new or modified system components that can be integrated in the available plant environment without a high additional investment of project engineering. This aspect is interesting for companies with manageable machinery, which are able to react immediately and flexible to changes. Service-oriented solutions include among other things the identification, classification and synchronization of possible services. The paper will show general prerequisites for an implementation of a service-oriented architecture in a module-based test field.}, language = {en} } @inproceedings{BergerSchaeferSchoettkeetal., author = {Berger, Ulrich and Sch{\"a}fer, Stephan and Sch{\"o}ttke, Dirk and K{\"a}mpfe, Thomas and Matura, Dominik}, title = {Collaborating Robots in a Museum Environment - Modular Systems for 3D Documentation}, series = {20th Conference on Emerging Technologies \& Factory Automation (ETFA), 8-11 Sept. 2015 Luxembourg}, booktitle = {20th Conference on Emerging Technologies \& Factory Automation (ETFA), 8-11 Sept. 2015 Luxembourg}, publisher = {IEEE}, address = {Piscataway, NJ}, isbn = {978-1-4673-7929-8}, doi = {10.1109/ETFA.2015.7301610}, pages = {5}, language = {en} } @misc{LeHuynhWangetal., author = {Le, Quang Huy and Huynh, Dang Khoa and Wang, Defu and K{\"a}mpfe, Thomas and Rudolph, Matthias}, title = {Small-Signal Modelling of mm-Wave MOSFET up to 110 GHz in 22nm FDSOI Technology}, series = {Proceedings of the 2019 IEEE Asia-Pacific Microwave Conference (APMC) : 10-13 December 2019, Marina Bay Sands, Singapore}, journal = {Proceedings of the 2019 IEEE Asia-Pacific Microwave Conference (APMC) : 10-13 December 2019, Marina Bay Sands, Singapore}, publisher = {IEEE}, address = {Piscataway, NJ}, isbn = {978-1-7281-3517-5}, doi = {10.1109/APMC46564.2019.9038620}, pages = {222 -- 224}, language = {en} } @misc{LeHuynhWangetal., author = {Le, Quang Huy and Huynh, Dang Khoa and Wang, D. and Zhao, Zhixing and Lehmann, Steffen and K{\"a}mpfe, Thomas and Rudolph, Matthias}, title = {W-Band Noise Characterization with Back-Gate Effects for Advanced 22nm FDSOI mm-Wave MOSFETs}, series = {2020 IEEE Radio Frequency Integrated Circuits Symposium (RFIC). 4-6 Aug. 2020, Los Angeles, CA, USA}, journal = {2020 IEEE Radio Frequency Integrated Circuits Symposium (RFIC). 4-6 Aug. 2020, Los Angeles, CA, USA}, isbn = {978-1-7281-6809-8}, issn = {2375-0995}, doi = {10.1109/RFIC49505.2020.9218369}, pages = {131 -- 134}, language = {en} } @misc{HuynhLeDuhanetal., author = {Huynh, Dang Khoa and Le, Quang Huy and Duhan, Pardeep and Wang, Defu and K{\"a}mpfe, Thomas and Rudolph, Matthias}, title = {Analysis of Hot-Carrier Degradation in 22nm FDSOI Transistors Using RF Small-Signal Characteristics}, series = {2020 German Microwave Conference (GeMiC), 09-11 March 2020, Cottbus, Germany}, journal = {2020 German Microwave Conference (GeMiC), 09-11 March 2020, Cottbus, Germany}, publisher = {IEEE}, address = {Piscataway}, isbn = {978-3-9820-3971-8}, issn = {2167-8022}, pages = {244 -- 247}, language = {en} } @misc{LeHuynhLehmannetal., author = {Le, Quang Huy and Huynh, Dang Khoa and Lehmann, Steffen and Zhao, Zhixing and K{\"a}mpfe, Thomas and Rudolph, Matthias}, title = {Empirical Large-Signal Medoling of mm-Wave FDSOI CMOS Based on Angelov Model}, series = {IEEE Transactions on Electron Devices}, volume = {68}, journal = {IEEE Transactions on Electron Devices}, number = {4}, issn = {1557-9646}, doi = {10.1109/TED.2021.3061318}, pages = {1446 -- 1453}, language = {en} } @misc{LeHuynhLehmannetal., author = {Le, Quang Huy and Huynh, Dang Khoa and Lehmann, Steffen and Zhao, Zhixing and K{\"a}mpfe, Thomas and Rudolph, Matthias}, title = {Analysis of the Relaxed Contacted-Poly-Pitch Effect on the RF Performance of Strained-SiGe-Channel p-FETs in 22 nm FDSOI Technology}, series = {16th European Microwave Integrated Circuits Conference (EuMIC), 03-04 April 2022, London, United Kingdom}, journal = {16th European Microwave Integrated Circuits Conference (EuMIC), 03-04 April 2022, London, United Kingdom}, publisher = {IEEE}, isbn = {978-2-87487-064-4}, doi = {10.23919/EuMIC50153.2022.9783713}, pages = {22 -- 25}, language = {en} } @misc{HuynhLeLehmannetal., author = {Huynh, Dang Khoa and Le, Quang Huy and Lehmann, Steffen and Zhao, Zhixing and Bossu, Germain and Arfaoui, Wafa and Wang, Defu and K{\"a}mpfe, Thomas and Rudolph, Matthias}, title = {Analysis of RF Stress Influence on Large-Signal Performance of 22nm FDSOI CMOS Transistors utilizing Waveform Measurement}, series = {16th European Microwave Integrated Circuits Conference (EuMIC), 03-04 April 2022, London, United Kingdom}, journal = {16th European Microwave Integrated Circuits Conference (EuMIC), 03-04 April 2022, London, United Kingdom}, isbn = {978-2-87487-064-4}, doi = {10.23919/EuMIC50153.2022.9783930}, pages = {382 -- 385}, language = {en} } @misc{LeHuynhNayaketal., author = {Le, Quang Huy and Huynh, Dang Khoa and Nayak, Anurag and Lehmann, Steffen and Zhao, Zhixing and K{\"a}mpfe, Thomas and Rudolph, Matthias}, title = {Large-Signal Medeling for Nonlinear Analysis of Experimental Devices in 22nm FDSOI Technology}, series = {16th European Microwave Integrated Circuits Conference (EuMIC), 03-04 April 2022, London, UK}, journal = {16th European Microwave Integrated Circuits Conference (EuMIC), 03-04 April 2022, London, UK}, isbn = {978-2-87487-064-4}, doi = {10.23919/EuMIC50153.2022.9784055}, pages = {17 -- 20}, language = {en} } @misc{HuynhLeLehmannetal., author = {Huynh, Dang Khoa and Le, Quang Huy and Lehmann, Steffen and Zhao, Zhixing and Bossu, Germain and Arfaoui, Wafa and K{\"a}mpfe, Thomas and Rudolph, Matthias}, title = {Impact of Off-State Stress on SiGe-channel p-FETs in 22nm FDSOI under Large-Signal Operation}, series = {18th European Microwave Integrated Circuits Conference (EuMIC), 18-19 September 2023, Berlin}, journal = {18th European Microwave Integrated Circuits Conference (EuMIC), 18-19 September 2023, Berlin}, isbn = {978-2-87487-073-6}, doi = {10.23919/EuMIC58042.2023.10288886}, pages = {173 -- 176}, language = {en} } @misc{LeHuynhLehmannetal., author = {Le, Quang Huy and Huynh, Dang Khoa and Lehmann, Steffen and Zhao, Zhixing and Schwan, Christoph T. and K{\"a}mpfe, Thomas and Rudolph, Matthias}, title = {22-nm FDSOI CMOS Noise Modeling and Anlaysis in mm-Wave Frequency Range}, series = {23rd Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems, 22 February 2023, Las Vegas, NV, USA}, journal = {23rd Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems, 22 February 2023, Las Vegas, NV, USA}, isbn = {978-1-6654-9319-2}, issn = {2474-9761}, doi = {10.1109/SiRF56960.2023.10046210}, pages = {31 -- 33}, language = {en} }