@misc{SchachtRzepka, author = {Schacht, Ralph and Rzepka, Sven}, title = {Parametric Transient Thermo - Electrical PSPICE Model F or A Single And Dual Conductor Power Cable}, series = {International Journal of Engineering Research and Development}, volume = {13}, journal = {International Journal of Engineering Research and Development}, number = {2}, issn = {2278-067X}, pages = {44 -- 54}, abstract = {A parametric macro model for a single and dual conductor power cable for transient thermo-electrical coupled simulation in PSPICE will be derived. The article depicts the modelling of a simplified, single- and dual conductor cable and its use during simulation. Its verification against experiment and finite element simulation shows a good agreement. The derived single- and dual conductor PSPICE cable macro model enables a quick modelling at system level. It offers a time saving transient thermo-electrical simulation under various thermal conditions and cable geometries and to optimize e.g. size, weight. The approach support the engineer to overlook the thermal influences and temperatures along the power cable under real 'thermal' assembling conditions in an e.g. car engine room or aircraft.}, language = {en} } @misc{SchachtRzepka, author = {Schacht, Ralph and Rzepka, Sven}, title = {Transient Electro-Thermal Coupled System Simulation - Modeling Approach and Experimental Validation}, series = {17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)}, journal = {17th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)}, isbn = {978-1-5386-1272-9}, doi = {10.1109/ITHERM.2018.8419490}, pages = {8}, abstract = {This contribution describes an approach for modeling a coupled electro-thermal design problem for the transient system simulation based on the analog circuit simulator SPICE - means: the time-varying electrical functional behavior of several neighboring components influence the time-varying thermal behavior of the setup and interconnection environment, which in turn affects the time-varying electrical behavior of these components. Due to the SPICE model description this is currently not possible. For this purpose, both electrical and thermal modeling methods as well as the coupling of these models are presented. The electrical model is based on the fundamental equations of semiconductor physics. With the help of the respective physical parameters, the electrical model can easily be extended to an existing library component or that of a manufacturer component SPICE description. The thermal model is based on a modified Foster model extracted from transient FEM simulation results, using the thermal step response. Thus, during the coupled transient simulation, both, the electrical behavior of the component, due to its self-heating, and the coupling heating of adjacent components, can be taken into account. The method is shown and experimentally verified by the example of two interacting MOSFETs with D2PAK packages, using a specially developed test board}, language = {en} }