@inproceedings{ConradEhrigKaiseretal., author = {Conrad, Holger and Ehrig, Lutz and Kaiser, Bert and Schenk, Hermann and Schuffenhauer, David and Stolz, Michael and Gaudet, Matthieu and Schenk, Harald}, title = {CMOS-kompatibler MEMS-Lautsprecher f{\"u}r Im-Ohr-Anwendungen}, series = {Tagungsband, DAGA 2018, 44. Deutsche Jahrestagung f{\"u}r Akustik, 19.-22. M{\"a}rz 2018, M{\"u}nchen}, booktitle = {Tagungsband, DAGA 2018, 44. Deutsche Jahrestagung f{\"u}r Akustik, 19.-22. M{\"a}rz 2018, M{\"u}nchen}, publisher = {Deutsche Gesellschaft f{\"u}r Akustik e.V. (DEGA)}, address = {Berlin}, isbn = {978-3-939296-13-3}, pages = {892 -- 894}, language = {de} } @misc{EhrigKaiserConradetal., author = {Ehrig, Lutz and Kaiser, Bert and Conrad, Holger and Schenk, Hermann and Schuffenhauer, David and Stolz, Michael and Gaudet, Matthieu and Schenk, Harald and Kolkovsky, Vladimir}, title = {MEMS-Loudspeaker - A Novel Class of Electroacoustic Transducers for Mobile Audio Applications}, series = {Tonmeistertagung - VDT International Convention, Cologne, Germany, 2018, Proc. TMT 30}, volume = {TMT 30}, journal = {Tonmeistertagung - VDT International Convention, Cologne, Germany, 2018, Proc. TMT 30}, pages = {189 -- 192}, abstract = {Wireless earphones require a tremendous degree of integration: In addition to the electroacoustic transducer at least the power supply and a radio module have to be accommodated, supplemented by several microphones for hands-free applications or for noise reduction, as well as position and bio sensors, memory and CPU. With increasing integration, the pressure on the individual components increases in terms of size, energy efficiency and costs. In the field of microphones, MEMS technology has enjoyed great popularity for almost 10 years, and due to their benefits (size, cost, integration) MEMS microphones have almost completely supersede other microphone technologies in mobile audio devices and opened up new fields of applications.}, language = {en} }