@misc{VillasmuntaSteglichHeinrichetal., author = {Villasmunta, Francesco and Steglich, Patrick and Heinrich, Friedhelm and Villringer, Claus and Mai, Andreas and Schrader, Sigurd and Schenk, Harald}, title = {Optical Through-Silicon Waveguides for 3D-Chip-Interconnections}, abstract = {Integrated optical interconnections in silicon chips have the potential to replace electrical interconnects between integrated circuits thanks to their high bandwidth and low energy communication promises. A silicon dielectric waveguide can be etched through the full thickness of a silicon substrate providing a monolithically integrated solution for 2.5D and 3D photonic architectures. The optical through-silicon waveguide design presented here is based on Finite Difference Time Domain simulations, while the fabrication takes advantage of the innovative plasma cryo-etching process that provides smooth sidewalls and tapering angle tunability. Such structures can provide effective mode size conversion, therefore favoring the coupling of external light sources to photonic integrated circuits and the stacking of multiple optically interconnected dies.}, language = {en} } @misc{VillasmuntaSteglichVillringeretal., author = {Villasmunta, Francesco and Steglich, Patrick and Villringer, Claus and Schrader, Sigurd and Schenk, Harald and Mai, Andreas and Regehly, Martin}, title = {Design, fabrication, and characterization of integrated optical through-silicon waveguides for 3D photonic interconnections}, series = {Optical Interconnects XXIV}, journal = {Optical Interconnects XXIV}, editor = {Schr{\"o}der, Henning and Chen, Ray T.}, publisher = {SPIE}, doi = {10.1117/12.3003146}, pages = {12}, language = {en} }