@misc{ConradGaudetSchenketal., author = {Conrad, Holger and Gaudet, Matthieu and Schenk, Harald and Uhlig, Sebastian}, title = {Micromechanical devices with mechanical actuators}, language = {en} } @misc{SchenkConrad, author = {Schenk, Harald and Conrad, Holger}, title = {MEMS transducer for interacting with a volume flow of a fluid, and method for producing the same}, language = {en} } @misc{MonsalveGuaracaoKaiserSchenk, author = {Monsalve Guaracao, Jorge Mario and Kaiser, Bert and Schenk, Harald}, title = {Design of Micromachined Ultrasonic Transducers for Variability with the Sample-Average Approximation Method}, series = {Tagungsband MikroSystemTechnik Kongress 2023, Dresden, 23. - 25. Oktober 2023}, journal = {Tagungsband MikroSystemTechnik Kongress 2023, Dresden, 23. - 25. Oktober 2023}, publisher = {VDE Verlag}, address = {Berlin}, isbn = {978-3-8007-6204-0}, pages = {S. 639}, language = {en} } @misc{VillasmuntaSteglichHeinrichetal., author = {Villasmunta, Francesco and Steglich, Patrick and Heinrich, Friedhelm and Villringer, Claus and Mai, Andreas and Schrader, Sigurd and Schenk, Harald}, title = {Optical Through-Silicon Waveguides for 3D-Chip-Interconnections}, abstract = {Integrated optical interconnections in silicon chips have the potential to replace electrical interconnects between integrated circuits thanks to their high bandwidth and low energy communication promises. A silicon dielectric waveguide can be etched through the full thickness of a silicon substrate providing a monolithically integrated solution for 2.5D and 3D photonic architectures. The optical through-silicon waveguide design presented here is based on Finite Difference Time Domain simulations, while the fabrication takes advantage of the innovative plasma cryo-etching process that provides smooth sidewalls and tapering angle tunability. Such structures can provide effective mode size conversion, therefore favoring the coupling of external light sources to photonic integrated circuits and the stacking of multiple optically interconnected dies.}, language = {en} } @misc{UhligGaudetLangaetal., author = {Uhlig, Sebastian and Gaudet, Matthieu and Langa, Sergiu and Ruffert, Christine and Jongmanns, Marcel and Schenk, Harald}, title = {Highly integrable silicon micropumps using lateral electrostatic bending actuators}, series = {Microsystem Technologies}, volume = {30}, journal = {Microsystem Technologies}, number = {8}, publisher = {Springer Science and Business Media LLC}, issn = {0946-7076}, doi = {10.1007/s00542-024-05635-w}, pages = {949 -- 960}, abstract = {We present the design, fabrication, and characterization of an innovative silicon-based micropump with high potential for portable lab-on-chip (LoC) as well as point-of-care (PoC) applications. The actuators of the pump are electrostatic driven in-plane bending devices, which were presented earlier (Borcia et al. in Phys Rev Fluids 3(8): 084202, 2018. 10.1103/PhysRevFluids.3.084202; Uhlig et al. in Micromachines, 9(4), 2018. 10.3390/mi9040190). This paper presents the characterization results achieved with the micropump. The dielectric non-polar liquid Novec7100™ was used as a test liquid due to its adequate physical properties. When applying a periodic voltage of 130 V, a flow rate of up to 80 µL/min was detected. The counter pressure amounts up to 30 kPa and the correspondent fluidic power (volumetric flow rate times the counter pressure) was calculated to 10 µW. The pump contains passive flap valves at the inlet and outlet, which are based on a bending cantilever design. Depending on the application requirements, the micropump can be designed modularly to adjust the specific parameters by an adequate arrangement of pump base units. In this paper, the proof of principle is shown using a single base unit with different number of stacked NED-actuator beams, as well as the serial arrangement of base units. Both modular concepts target the increase of backpressure of the NED-micropump in an inherently different way compared to conventional membrane micropumps.}, language = {en} } @misc{Schenk, author = {Schenk, Harald}, title = {Silicon integrated electrostatic drives}, series = {International Conference and Exhibition on New Actuator Systems and Applications 2024}, journal = {International Conference and Exhibition on New Actuator Systems and Applications 2024}, doi = {10.24406/publica-3964}, pages = {36}, abstract = {Presentation held at ACTUATOR 2024, International Conference and Exhibition on New Actuator Systems and Applications, June 13 - 14, 2024, Wiesbaden, Germany}, language = {en} } @misc{Schenk, author = {Schenk, Harald}, title = {Digitalisierung und KI f{\"u}r Gesellschaft, Wirtschaft und Forschung}, series = {Digitalisierung und KI f{\"u}r Gesellschaft, Wirtschaft und Forschung}, journal = {Digitalisierung und KI f{\"u}r Gesellschaft, Wirtschaft und Forschung}, editor = {Schenk, Harald}, doi = {10.24406/publica-3965}, pages = {19}, abstract = {Leben mit Krebs - Digitalisierung, K{\"u}nstliche Intelligenz in Medizin und Tumormedizin}, language = {de} } @misc{Schenk, author = {Schenk, Harald}, title = {Highly integrated active Spatial Light Modulators - from imaging to holography}, series = {International Conference on Machine Vision 2024}, journal = {International Conference on Machine Vision 2024}, doi = {10.24406/publica-3963}, pages = {37}, language = {en} } @misc{GuaracoLangaStolzetal., author = {Guaraco, Jorge Mario Monsalve and Langa, Sergiu and Stolz, Michael and Mrosk, Andreas and Kaiser, Bert and Schenk, Harald}, title = {Design of micromachines under uncertainty with the sample-average approximation method}, series = {Journal of Advanced Mechanical Design, Systems, and Manufacturing}, volume = {18 (2024)}, journal = {Journal of Advanced Mechanical Design, Systems, and Manufacturing}, number = {2}, publisher = {Japan Society of Mechanical Engineers}, issn = {1881-3054}, doi = {10.1299/jamdsm.2024jamdsm0018}, language = {en} } @misc{VillasmuntaSteglichVillringeretal., author = {Villasmunta, Francesco and Steglich, Patrick and Villringer, Claus and Schrader, Sigurd and Schenk, Harald and Mai, Andreas and Regehly, Martin}, title = {Design, fabrication, and characterization of integrated optical through-silicon waveguides for 3D photonic interconnections}, series = {Optical Interconnects XXIV}, journal = {Optical Interconnects XXIV}, editor = {Schr{\"o}der, Henning and Chen, Ray T.}, publisher = {SPIE}, doi = {10.1117/12.3003146}, pages = {12}, language = {en} } @incollection{SchenkSchulze, author = {Schenk, Harald and Schulze, Matthias}, title = {Micro mirrors}, series = {Handbook of Silicon Based MEMS Materials and Technologies}, booktitle = {Handbook of Silicon Based MEMS Materials and Technologies}, edition = {Third Edition}, publisher = {Elsevier}, isbn = {978-0-12-817786-0}, doi = {10.1016/B978-0-12-817786-0.00049-9}, pages = {949 -- 968}, language = {en} } @incollection{Schenk, author = {Schenk, Harald}, title = {Optische Mikrosysteme}, series = {Lehrbuch Mikrotechnologie}, booktitle = {Lehrbuch Mikrotechnologie}, publisher = {Carl Hanser Verlag GmbH \& Co. KG}, address = {M{\"u}nchen}, isbn = {9783446425606}, doi = {10.3139/9783446429741.017}, pages = {539 -- 592}, language = {de} } @misc{SchenkShashankGaudet, author = {Schenk, Harald and Shashank, S. and Gaudet, M.}, title = {MEMS actuator and method for controlling a MEMS actuator}, abstract = {The invention provides a MEMS actuator comprising at least one actuator cell. The actuator cell comprises a first connecting piece and a second connecting piece. A mechanical connection between the first connecting piece and the second connecting piece comprises at least one connector unit. The connector unit comprises a first beam and a second beam being serially connected with the first beam so as to provide for a meandered shape. At least the first beam comprises a serial arrangement of a plurality of actuator elements configured to change a bending of the first beam upon actuation.}, language = {en} } @misc{SchenkSanderSchmidtetal., author = {Schenk, Harald and Sander, T. and Schmidt, J.-U. and Gatto, A. and Yang, M. and Heber, J. and Kaiser, N.}, title = {Micromechanical mirrors with a high-reflection coating, method for production thereof and use thereof}, language = {en} } @misc{SchenkSanderSchollesetal., author = {Schenk, Harald and Sander, T. and Scholles, M. and Schwarzenberg, M. and Wolter, A.}, title = {Projection apparatus for scanningly projection}, language = {en} } @misc{Schenk, author = {Schenk, Harald}, title = {Micromechanical device}, language = {en} } @misc{SchenkWolterSchwarzenberg, author = {Schenk, Harald and Wolter, A. and Schwarzenberg, M.}, title = {Projection apparatus}, language = {de} } @misc{SchenkSanderPufe, author = {Schenk, Harald and Sander, T. and Pufe, W.}, title = {Microoptic reflecting component}, abstract = {The invention relates to active microoptic reflecting components for adapting or changing the focal length or focal position in optical systems. It is the object of the invention to make available a miniaturised reflecting microoptic component for focusing or defocusing incident electromagnetic radiation, with which a variation in the focal distance can be achieved simply and at low cost. On the component according to the invention there is an elastically deformably membrane which is formed at least with one reflecting layer comprising a first material or material mixture and at least with one further layer or substrate which is formed from a second material or material mixture. First and second materials or material mixtures have thermal coefficients of expansion which deviate from each other. In addition a heating or temperature control mechanism is present.}, language = {en} } @misc{SchenkWolterSanderetal., author = {Schenk, Harald and Wolter, A. and Sander, T. and Drabe, C. and Klose, T.}, title = {Oscillating, deflectable micromechanical element and method for use thereof}, language = {de} } @misc{SchenkDrabe, author = {Schenk, Harald and Drabe, C.}, title = {Micro-optical arrangement}, language = {en} } @misc{Schenk, author = {Schenk, Harald}, title = {Apparatus and method for controlling or regulating an oscillating deflectable micromechanical element}, language = {de} } @misc{SchenkSanderHeberetal., author = {Schenk, Harald and Sander, T. and Heber, J. and Klose, T. and Bergmann, A. and Gerwig, C. and Knieling, T.}, title = {Micromechanical device with temperature stabilization and method for adjusting a defined temperature or a defined temperature course on a micromechanical device}, language = {en} } @misc{SchenkZimmerWolter, author = {Schenk, Harald and Zimmer, F. and Wolter, A.}, title = {Mikrooptisches Beugungsgitter sowie Verfahren zur Herstellung}, language = {de} } @misc{SchenkDuerrKueck, author = {Schenk, Harald and D{\"u}rr, P. and K{\"u}ck, H.}, title = {Micromechanical component comprising an oscillating body}, language = {en} } @misc{CostacheSchenkBornhorstetal., author = {Costache, Florenta Adriana and Schenk, Harald and Bornhorst, Kirstin and Schirrmann, Christian}, title = {Fluidic variable focal length optical lens and method of manufacturing the same}, language = {en} } @misc{SchenkKendaScherfetal., author = {Schenk, Harald and Kenda, A. and Scherf, W. and Kraft, M.}, title = {Miniaturized fourier transform spectrometer}, language = {en} } @misc{MonsalveJongmannsKochetal., author = {Monsalve, Jorge M. and Jongmanns, Marcel and Koch, Sandro G. and Schenk, Harald}, title = {Flow measurement by means of wideband acoustic signals in single-mode waveguides}, series = {Journal of sensors and sensor systems}, volume = {14}, journal = {Journal of sensors and sensor systems}, number = {2}, publisher = {Copernicus Publications}, address = {G{\"o}ttingen, Germany}, issn = {2194-878X}, doi = {10.5194/jsss-14-275-2025}, pages = {275 -- 284}, abstract = {A novel concept of an acoustic flowmeter, based on single-mode waveguides, is proposed, implemented, and analysed in this work. Instead of transmitting a pulse diagonally across the duct's cross-section, this device operates with two ducts that operate simultaneously as pipes and as waveguides. Below the frequency threshold for single-mode propagation, acoustic waves are forced to traverse the waveguides with a plane front, precluding the possibility of beam drifting, inner reflections, and spreading losses. This enables the designer to flexibly increase the sound path and perform a highly sensitive measurement of the flow velocity and speed of sound, even if the excitation frequency is required to be kept below a relatively low value. A device based on this principle was constructed and tested for flow measurements in air. It consists of two waveguides of a circular cross-section (5 mmdiameter) coupled to electroacoustic transducers for the transmission of a wideband chirp (9.8-18.2 kHz). Usage of a wideband signal was possible due to the combined frequency response of a special kind of micromachined ultrasound transducer (MUT) and a commercial micro-electromechanical system (MEMS) microphone. The constructed flowmeter was capable of measuring flow velocities up until the transition to turbulent flow at 16 Lmin-1with a resolution of 0.3 Lmin-1, and it also detected changes of less than 0.2 ms-1in the speed of sound. This topology for flow measurement could prove advantageous for applications where gases of variable composition are conducted in ducts of diameters in the millimetre range.}, language = {en} } @misc{VillasmuntaHeiseBreiteretal., author = {Villasmunta, Francesco and Heise, Patrick and Breiter, Manuela and Schrader, Sigurd and Schenk, Harald and Regehly, Martin and Mai, Andreas}, title = {Monolithically integrated optical through-silicon waveguides for 3D chip-to-chip photonic interconnects}, series = {IEEE journal of selected topics in quantum electronics}, volume = {32}, journal = {IEEE journal of selected topics in quantum electronics}, number = {2: 3-D Horizons in Photonics}, publisher = {Institute of Electrical and Electronics Engineers (IEEE)}, address = {New York, NY}, issn = {1077-260X}, doi = {10.1109/JSTQE.2025.3615001}, pages = {1 -- 15}, abstract = {The scaling limitations of electrical interconnects are driving the demand for efficient optical chip-to-chip links. We report the first monolithic integration of air-clad optical through-silicon waveguides in silicon, fabricated via Bosch and cryogenic deep reactive-ion etching. Rib, single-bridge, and double-bridge designs with 50 μm cores and up to 150 μm propagation lengths have been evaluated. Cryogenic-etched rib waveguides achieve the highest median transmission (66\%, -1.80 dB), compared to Bosch-etched ribs (62\%, -2.08 dB). Across all geometries, 3 dB alignment windows range from 9.3 μm to 49.2 μm, with Bosch-etched double-bridge waveguides providing the broadest tolerance. We show that geometric fidelity outweighs sidewall roughness for transmission and alignment in these large-core, multimode optical through-silicon waveguides. This technology provides a scalable, complementary metal-oxide semiconductor-compatible pathway toward 3D photonic interconnects.}, language = {en} } @misc{SchenkConrad, author = {Schenk, Harald and Conrad, Holger}, title = {MEMS-Wandler zum Interagieren mit einem Volumenstrom eines Fluids und Verfahren zum Herstellen desselben}, abstract = {Ein MEMS-Wandler zum Interagieren mit einem Volumenstrom eines Fluids umfasst ein Substrat, das einen Schichtstapel mit einer Mehrzahl von Schichten aufweist, die eine Mehrzahl von Substratebenen bilden, und das eine Kavit{\"a}t in dem Schichtstapel aufweist. Der MEMS-Wandler umfasst ein elektromechanischen Wandler, der mit dem Substrat in der Kavit{\"a}t verbunden ist und ein sich in zumindest einer Bewegungsebene der Mehrzahl von Substratebenen verformbares Element aufweist, wobei eine Verformung des verformbaren Elements in der Bewegungsebene und der Volumenstrom des Fluids kausal zusammenh{\"a}ngen. Der MEMS-Wandler umfasst ein elektronischen Schaltung, die in ei- ner Schicht des Schichtstapels angeordnet ist, wobei die elektronische Schaltung mit dem elektromechanischen Wandler verbunden ist, und die ausgebildet ist, um eine Konvertierung zwischen einer Verformung des verformbaren Elements und einem elektrischen Signal bereitzustellen.}, language = {de} } @misc{SchenkLanga, author = {Schenk, Harald and Langa, Sergiu}, title = {MEMS-Bauelement und Verfahren zum Herstellen eines MEMS-Bauelements}, abstract = {Ein Verfahren zum Herstellen eines MEMS-Bauelements umfasst ein Bereitstellen eines Halbleitersubstrats, ein Ausf{\"u}hren eines anisotropen nasschemischen {\"A}tzprozesses in dem Halbleitersubstrat, um zumindest ein bewegliches Element aus dem Halbleitersubstrat herauszubilden, und ein Erzeugen eines Schichtstapels, so dass das bewegliche Element in einer Kavit{\"a}t und in einer ersten MEMS-Schicht zwischen einer zweiten MEMS-Schicht und einer dritten MEMS-Schicht angeordnet ist, um mit einem in der Kavit{\"a}t angeordneten Fluid zu interagieren.}, language = {de} } @misc{SchenkConradGaudetetal., author = {Schenk, Harald and Conrad, Holger and Gaudet, Matthieu and Schimmanz, Klaus and Langa, Sergiu and Kaiser, Bert}, title = {MEMS transducer for interacting with a volume flow of a fluid and method for manufacturing the same}, abstract = {A MEMS transducer for interacting with a volume flow of a fluid includes a substrate including a cavity, and an electromechanical transducer connected to the substrate in the cavity and including an element deformable along a lateral movement direction, wherein a deformation of the deformable element along the lateral movement direction and the volume flow of the fluid are causally related.}, language = {en} } @misc{SchenkVerma, author = {Schenk, Harald and Verma, Satish}, title = {Micromachined sensor and method for sensing an analyte}, language = {en} }