@misc{SchenkNarimaniSchollesetal., author = {Schenk, Harald and Narimani, Keyvan and Scholles, Michael and Shashank, Shashank and Langa, Sergiu and Pineda Gomez, Roberto and Ruffert, Christine}, title = {Highly Modular Microsystem Inchworm Motor Based on a Nanoscopic Electrostatic Drive}, series = {MikroSystemTechnik Kongress 2021 : Mikroelektronik / Mikrosystemtechnik und ihre Anwendungen Innovative Produkte f{\"u}r zukunftsf{\"a}hige M{\"a}rkte 08. - 10. November 2021, Stuttgart-Ludwigsburg}, journal = {MikroSystemTechnik Kongress 2021 : Mikroelektronik / Mikrosystemtechnik und ihre Anwendungen Innovative Produkte f{\"u}r zukunftsf{\"a}hige M{\"a}rkte 08. - 10. November 2021, Stuttgart-Ludwigsburg}, publisher = {VDE e.V.}, isbn = {978-3-8007-5656-8}, pages = {4}, abstract = {We present results for a microsystem inchworm motor based on Nanoscopic Electrostatic Drive (NED) actuators, fabricated by single crystalline silicon bulk micro-machining on a silicon-on-insulator (SOI) wafer. Actuator elements can easily be added to or removed from the inchworm drive allowing a high adaptability of force and contact area with the movable surface as well as an efficient use of the system's footprint. In principle, travel ranges of several mm can be easily obtained due to very modular design of the system. The presented inchworm drive is capable of controllable motion up to 1 mm and can generate a force of 1.4 mN at 130V corresponding to a force density of 0.8 mN/mm2 with an average maximum DC power consumption of 11.8 muW in each cycle. Furthermore, the voltage-displacement characteristics of the actuator element was validated by finite element method (FEM).}, language = {en} } @misc{SchenkVillasmuntaSteglichetal., author = {Schenk, Harald and Villasmunta, Francesco and Steglich, Patrick and Schrader, Sigurd and Mai, Andreas}, title = {Numerical Simulation of Optical Through-Silicon Waveguide for 3D Photonic Interconnections}, series = {2021 International Conference on Numerical Simulation of Optoelectronic Devices (NUSOD)}, journal = {2021 International Conference on Numerical Simulation of Optoelectronic Devices (NUSOD)}, publisher = {IEEE}, isbn = {978-1-6654-1276-6}, issn = {2158-3242}, doi = {10.1109/NUSOD52207.2021.9541464}, pages = {2}, abstract = {Optical interconnections are a promising step for-ward to overcome the intrinsic limitations of electrical inter-connections in integrated circuits. In this work, we present a finite element method (FEM) simulation study of a dielectric waveguide etched through the full thickness of a silicon substrate. In particular, it is investigated the effect of the bridge-to-core size ratio on the first two supported modes. Then, the influence of the waveguide sidewalls tapering angle on the three-dimensional beam propagation is studied. Such optical through-silicon waveguide (OTSW), if nonadiabatically tapered can provide effective mode size conversion and favour the coupling of external light sources to photonic integrated circuits.}, language = {en} } @misc{SchenkSchweigerKoch, author = {Schenk, Harald and Schweiger, Severin and Koch, Sandro G.}, title = {Two-Photon-Lithography Substrate Reflection and Absorption Compensation for Additive Manufacturing of Metamaterials on MEMS}, series = {2021 44th International Spring Seminar on Electronics Technology (ISSE)}, journal = {2021 44th International Spring Seminar on Electronics Technology (ISSE)}, isbn = {978-1-6654-1477-7}, issn = {2161-2536}, doi = {10.1109/ISSE51996.2021.9467575}, pages = {7}, abstract = {Structuring polymers on micro-electro-mechanical-systems (MEMS) for the manufacturing of acoustical and optical metamaterials using the two-photon polymerization process depends on reliable and controllable regulation of the intensity. Reflecting surfaces, diffracting elements and structures with poor heat dissipation can be problematic obstacles for the incident focused and pulsed laser beam. Thermal and optical simulations were performed and compared to test structures. A compensated fabrication approach was successfully applied to create optimized conditions in the polymerized volume.}, language = {en} } @misc{SchweigerSchulzeSchlipfetal., author = {Schweiger, Severin and Schulze, Tim F. and Schlipf, Simon and Reinig, Peter and Schenk, Harald}, title = {Characterization of two-photon-polymerization lithography structures via Raman spectroscopy and nanoindentation}, series = {Journal of Optical Microsystems}, volume = {Vol. 2}, journal = {Journal of Optical Microsystems}, number = {3}, issn = {2708-5260}, doi = {10.1117/1.jom.2.3.033501}, abstract = {Additive manufacturing using two-photon polymerization (TPP) lithography is increasingly used in industry and research. Parameter sweeps of cuboid structures fabricated using TPP lithography were investigated across the parameters of the laser power and scan speed to find dependent mechanical material properties. The employed photoresists were examined using Raman spectroscopy to find the degree of conversion (DC) of monomer to polymer, and subsequently, micro- or nanoindentation was used to find Young's modulus (E). For the photoresist IP-Dip, the attained DC and E ranged from 20\% to 45\% and 1 to 2.1 GPa, respectively. The results were compared with reports found in the literature. For IP-Q, the attained DC and E ranged from 53\% to 80\% and 0.5 to 1.3 GPa, respectively. The characterized properties of IP-Q manifest as the current state of knowledge of the material.}, language = {en} } @misc{KurthKunathSchenk, author = {Kurth, Eberhard and Kunath, Christian and Schenk, Harald}, title = {Ion-sensitive structure and method for producing the same}, language = {en} } @misc{ConradGaudetSchenketal., author = {Conrad, Holger and Gaudet, Matthieu and Schenk, Harald and Uhlig, Sebastian}, title = {Micromechanical devices with mechanical actuators}, language = {en} } @misc{SchenkConrad, author = {Schenk, Harald and Conrad, Holger}, title = {MEMS transducer for interacting with a volume flow of a fluid, and method for producing the same}, language = {en} } @misc{MonsalveGuaracaoKaiserSchenk, author = {Monsalve Guaracao, Jorge Mario and Kaiser, Bert and Schenk, Harald}, title = {Design of Micromachined Ultrasonic Transducers for Variability with the Sample-Average Approximation Method}, series = {Tagungsband MikroSystemTechnik Kongress 2023, Dresden, 23. - 25. Oktober 2023}, journal = {Tagungsband MikroSystemTechnik Kongress 2023, Dresden, 23. - 25. Oktober 2023}, publisher = {VDE Verlag}, address = {Berlin}, isbn = {978-3-8007-6204-0}, pages = {S. 639}, language = {en} } @misc{VillasmuntaSteglichHeinrichetal., author = {Villasmunta, Francesco and Steglich, Patrick and Heinrich, Friedhelm and Villringer, Claus and Mai, Andreas and Schrader, Sigurd and Schenk, Harald}, title = {Optical Through-Silicon Waveguides for 3D-Chip-Interconnections}, abstract = {Integrated optical interconnections in silicon chips have the potential to replace electrical interconnects between integrated circuits thanks to their high bandwidth and low energy communication promises. A silicon dielectric waveguide can be etched through the full thickness of a silicon substrate providing a monolithically integrated solution for 2.5D and 3D photonic architectures. The optical through-silicon waveguide design presented here is based on Finite Difference Time Domain simulations, while the fabrication takes advantage of the innovative plasma cryo-etching process that provides smooth sidewalls and tapering angle tunability. Such structures can provide effective mode size conversion, therefore favoring the coupling of external light sources to photonic integrated circuits and the stacking of multiple optically interconnected dies.}, language = {en} } @misc{UhligGaudetLangaetal., author = {Uhlig, Sebastian and Gaudet, Matthieu and Langa, Sergiu and Ruffert, Christine and Jongmanns, Marcel and Schenk, Harald}, title = {Highly integrable silicon micropumps using lateral electrostatic bending actuators}, series = {Microsystem Technologies}, volume = {30}, journal = {Microsystem Technologies}, number = {8}, publisher = {Springer Science and Business Media LLC}, issn = {0946-7076}, doi = {10.1007/s00542-024-05635-w}, pages = {949 -- 960}, abstract = {We present the design, fabrication, and characterization of an innovative silicon-based micropump with high potential for portable lab-on-chip (LoC) as well as point-of-care (PoC) applications. The actuators of the pump are electrostatic driven in-plane bending devices, which were presented earlier (Borcia et al. in Phys Rev Fluids 3(8): 084202, 2018. 10.1103/PhysRevFluids.3.084202; Uhlig et al. in Micromachines, 9(4), 2018. 10.3390/mi9040190). This paper presents the characterization results achieved with the micropump. The dielectric non-polar liquid Novec7100™ was used as a test liquid due to its adequate physical properties. When applying a periodic voltage of 130 V, a flow rate of up to 80 µL/min was detected. The counter pressure amounts up to 30 kPa and the correspondent fluidic power (volumetric flow rate times the counter pressure) was calculated to 10 µW. The pump contains passive flap valves at the inlet and outlet, which are based on a bending cantilever design. Depending on the application requirements, the micropump can be designed modularly to adjust the specific parameters by an adequate arrangement of pump base units. In this paper, the proof of principle is shown using a single base unit with different number of stacked NED-actuator beams, as well as the serial arrangement of base units. Both modular concepts target the increase of backpressure of the NED-micropump in an inherently different way compared to conventional membrane micropumps.}, language = {en} }