@inproceedings{ConradGaudetKaiseretal., author = {Conrad, Holger and Gaudet, Matthieu and Kaiser, Bert and Langa, Sergiu and Stolz, Michael and Schenk, Harald}, title = {CMOS-kompatible elektrostatische Biegeaktoren (CMOS-compatible electrostatic actuators}, series = {MikroSystemTechnik Kongress 2017, M{\"u}nchen, Germany, 23.-25. Oktober 2017}, booktitle = {MikroSystemTechnik Kongress 2017, M{\"u}nchen, Germany, 23.-25. Oktober 2017}, publisher = {VDE-Verlag}, address = {Berlin [u.a.]}, isbn = {978-3-8007-4491-6}, pages = {219 -- 222}, language = {en} } @inproceedings{UhligGaudetLangaetal., author = {Uhlig, Sebastian and Gaudet, Matthieu and Langa, Sergiu and Schimmanz, Klaus and Conrad, Holger and Kaiser, Bert and Schenk, Harald}, title = {Electrostatically in-plane driven silicon micropump for modular configuration}, series = {Conference proceedings, The 3rd Conference on MicroFluidic Handling Systems (MFHS 2017), 4 - 6 October 2017, Enschede, The Netherlands}, booktitle = {Conference proceedings, The 3rd Conference on MicroFluidic Handling Systems (MFHS 2017), 4 - 6 October 2017, Enschede, The Netherlands}, publisher = {University of Twente}, address = {Enschede}, pages = {57 -- 60}, language = {en} } @misc{ConradGaudetSchenketal., author = {Conrad, Holger and Gaudet, Matthieu and Schenk, Harald and Uhlig, Sebastian}, title = {Mikromechanical devices with mechanical actuators}, language = {en} } @misc{SchenkConrad, author = {Schenk, Harald and Conrad, Holger}, title = {MEMS-Wandler zum Interagieren mit einem Volumenstrom eines Fluids und Verfahren zum Herstellen desselben}, language = {en} } @inproceedings{SchenkWagnerGrahmannetal., author = {Schenk, Harald and Wagner, Michael and Grahmann, Jan and Merten, Andr{\´e}}, title = {Advances in MOEMS technologies for high quality imaging systems}, series = {Optical Microlithography XXXI, 27 February-1 March 2018, San Jose, California, Unites States}, booktitle = {Optical Microlithography XXXI, 27 February-1 March 2018, San Jose, California, Unites States}, editor = {Kye, Jongwook and Owa, Soichi}, publisher = {SPIE}, address = {Bellingham, Washington}, isbn = {978-1-5106-1666-0}, doi = {10.1117/12.2297399}, abstract = {An overview of advances in MOEMS devices and technologies for high quality imaging systems is provided. A particular focus is laid on recent technological further developments possibly opening gateways to unprecedented device and system functionality by e. g.: increase of pixel count towards higher parallel operation, decrease of the mirror pitch in large arrays towards applications like high-performance holography, novel technologies for higher operation bandwidth, increase of aperture size for scanning applications like LIDAR, integration of high reflection coatings for processing of multi Watt laser radiation for marking and engraving, and phased arrays for high speed laser beam steering.}, language = {en} } @misc{StolzMroskKaiseretal., author = {Stolz, Michael and Mrosk, Andreas and Kaiser, Bert and Langa, Sergiu and Ehrig, Lutz and Conrad, Holger and Gaudet, Matthieu and Schenk, Harald}, title = {Optische Charakterisierungsmethoden von siliziumbasierten MEMS mit verdeckten Strukturen}, series = {MikroSystemTechnik-Kongress, Berlin, Germany, 2019}, journal = {MikroSystemTechnik-Kongress, Berlin, Germany, 2019}, publisher = {VDE-Verlag}, pages = {366 -- 369}, abstract = {In der Arbeitsgruppe integrierte Siliziumsysteme des Fraunhofer IPMS werden am Standort Cottbus innovative Anwen-dungen eines neuartigen nanoskopischen elektrostatischen Antriebs (nanoskopic electrostatic drive - NED) untersucht. Eine der vielversprechendsten Anwendungen sind Lautsprecher. Vollst{\"a}ndig aus Silizium gefertigte MEMS-Lautsprecher auf Basis von NED-Biegeaktoren werden vor den akustischen Messungen mechanisch und elektrisch cha-rakterisiert. Beidseitig eingespannte elektrostatisch betriebene in-plane NED-Aktoren werden dabei {\"u}ber einen Fre-quenzbereich von 20 Hz bis 20 kHz angeregt. Dabei sind die Strukturen oft verdeckt, was ihre Charakterisierung er-schwert. Es werden zerst{\"o}rungsfreie optische Methoden pr{\"a}sentiert, mit deren Hilfe die Bestimmung der mechanischen Schwingungseigenschaften einzelner Aktoren erm{\"o}glicht wird sowie die Beweglichkeit im verdeckten Zustand nach-gewiesen werden kann.}, language = {de} } @misc{DauderstaedtDuerrGehneretal., author = {Dauderst{\"a}dt, Ulrike and D{\"u}rr, Peter and Gehner, Andreas and Wagner, Michael and Schenk, Harald}, title = {Analog Spatial Light Modulators based on Micromirror Arrays}, series = {Micromachines, Special Issue "Beam Steering via Arrayed Micromachines"}, volume = {12}, journal = {Micromachines, Special Issue "Beam Steering via Arrayed Micromachines"}, number = {5}, issn = {2072-666X}, doi = {10.3390/mi12050483}, pages = {12}, language = {en} } @misc{SchweigerMelnikovKochetal., author = {Schweiger, Severin and Melnikov, Anton and Koch, Sandro G. and Schenk, Harald}, title = {Two-Photon Lithography Parameter Study for Manufacturing of Acoustic Metamaterials on MEMS}, series = {MikroSystemTechnik Kongress 2021 : Mikroelektronik/Mikrosystemtechnik und ihre Anwendungen Innovative Produkte f{\"u}r zukunftsf{\"a}hige M{\"a}rkte 08. - 10. November 2021, Stuttgart-Ludwigsburg}, journal = {MikroSystemTechnik Kongress 2021 : Mikroelektronik/Mikrosystemtechnik und ihre Anwendungen Innovative Produkte f{\"u}r zukunftsf{\"a}hige M{\"a}rkte 08. - 10. November 2021, Stuttgart-Ludwigsburg}, publisher = {VDE-Verlag}, address = {Berlin ; Offenbach}, isbn = {978-3-8007-5656-8}, pages = {365 -- 368}, abstract = {Acoustic impedance matching structures can be used on capacitive micromachined ultrasonic transducers (CMUT) to increase acoustic energy transmission into the load medium. Our contribution contains a systematic study of the viability of the two-photon-polymerization lithography process for the fabrication of acoustic impedance matching metamaterials. For this purpose, acoustic simulations were conducted to find optimized dimensions of the matching structure. Based on the proposed dimensions, parameter sweeps were manufactured on substitute substrates, resulting in a viable parameter space for the direct fabrication on CMUT devices.}, language = {en} } @misc{SchenkStolzLangaetal., author = {Schenk, Harald and Stolz, Michael and Langa, Sergiu and Kaiser, Bert}, title = {Reliability Aspects of in-plane NED Bending Actuators in Silicon-based MEMS}, series = {MikroSystemTechnik Kongress 2021 : Mikroelektronik / Mikrosystemtechnik und ihre Anwendungen Innovative Produkte f{\"u}r zukunftsf{\"a}hige M{\"a}rkte 08. - 10. November 2021, Stuttgart-Ludwigsburg}, journal = {MikroSystemTechnik Kongress 2021 : Mikroelektronik / Mikrosystemtechnik und ihre Anwendungen Innovative Produkte f{\"u}r zukunftsf{\"a}hige M{\"a}rkte 08. - 10. November 2021, Stuttgart-Ludwigsburg}, publisher = {VDE-Verlag}, isbn = {978-3-8007-5656-8}, pages = {4}, abstract = {For several years, Fraunhofer IPMS has been developing a new type of an electrostatic MEMS actuator, called nanoscopic electrostatic drive - NED. Since the first publication in 2015, the project group at IPMS has succeeded in providing lateral actuators, which serve as innovative drives in applications such as micro-positioners or micro-speakers. These applications require a high long-term stability of the drive in order to ensure that the system operates as desired. For this purpose, the reliability of such novel lateral electrostatic actuators was evaluated. Long-term studies of NED actuators have shown that different degradation phenomena can occur during operation. The experiments indicate that high electric fields in the range of several MV/m are one of the most important triggers of the degradations observed. On the one hand, they lead to anodic oxidation occurring at the boundary layers between the NED electrodes and neighbored insulators, which results in corrosion of the silicon electrodes. On the other hand, geometry-based field enhancement far from the insulator interfaces lead to permanent field emission, which causes dark discharges in the electrode gap. This in turn leads to cold plasma oxidation and the growth of oxide b ulges on the electrode surfaces. In the course of the experiments, it was shown that corrosion does not take place in a vacuum and can be avoided with the help of passivation layers. Non silicon oxides, e.g. Al2O3, are well suited as passivation layers. Although they bring additional flexural rigidity to the overall structure, which changes the mechanical behavior of the actuators, they increase the effective relative permittivity in the electrode gap, which in turn makes the actuators more effective. Thanks to the passivation coating,the lifespan of the NED actuators was increased and they can become even more effective by choosing a layer with suitable properties.}, language = {en} } @misc{SchenkNarimaniSchollesetal., author = {Schenk, Harald and Narimani, Keyvan and Scholles, Michael and Shashank, Shashank and Langa, Sergiu and Pineda Gomez, Roberto and Ruffert, Christine}, title = {Highly Modular Microsystem Inchworm Motor Based on a Nanoscopic Electrostatic Drive}, series = {MikroSystemTechnik Kongress 2021 : Mikroelektronik / Mikrosystemtechnik und ihre Anwendungen Innovative Produkte f{\"u}r zukunftsf{\"a}hige M{\"a}rkte 08. - 10. November 2021, Stuttgart-Ludwigsburg}, journal = {MikroSystemTechnik Kongress 2021 : Mikroelektronik / Mikrosystemtechnik und ihre Anwendungen Innovative Produkte f{\"u}r zukunftsf{\"a}hige M{\"a}rkte 08. - 10. November 2021, Stuttgart-Ludwigsburg}, publisher = {VDE e.V.}, isbn = {978-3-8007-5656-8}, pages = {4}, abstract = {We present results for a microsystem inchworm motor based on Nanoscopic Electrostatic Drive (NED) actuators, fabricated by single crystalline silicon bulk micro-machining on a silicon-on-insulator (SOI) wafer. Actuator elements can easily be added to or removed from the inchworm drive allowing a high adaptability of force and contact area with the movable surface as well as an efficient use of the system's footprint. In principle, travel ranges of several mm can be easily obtained due to very modular design of the system. The presented inchworm drive is capable of controllable motion up to 1 mm and can generate a force of 1.4 mN at 130V corresponding to a force density of 0.8 mN/mm2 with an average maximum DC power consumption of 11.8 muW in each cycle. Furthermore, the voltage-displacement characteristics of the actuator element was validated by finite element method (FEM).}, language = {en} } @misc{SchenkVillasmuntaSteglichetal., author = {Schenk, Harald and Villasmunta, Francesco and Steglich, Patrick and Schrader, Sigurd and Mai, Andreas}, title = {Numerical Simulation of Optical Through-Silicon Waveguide for 3D Photonic Interconnections}, series = {2021 International Conference on Numerical Simulation of Optoelectronic Devices (NUSOD)}, journal = {2021 International Conference on Numerical Simulation of Optoelectronic Devices (NUSOD)}, publisher = {IEEE}, isbn = {978-1-6654-1276-6}, issn = {2158-3242}, doi = {10.1109/NUSOD52207.2021.9541464}, pages = {2}, abstract = {Optical interconnections are a promising step for-ward to overcome the intrinsic limitations of electrical inter-connections in integrated circuits. In this work, we present a finite element method (FEM) simulation study of a dielectric waveguide etched through the full thickness of a silicon substrate. In particular, it is investigated the effect of the bridge-to-core size ratio on the first two supported modes. Then, the influence of the waveguide sidewalls tapering angle on the three-dimensional beam propagation is studied. Such optical through-silicon waveguide (OTSW), if nonadiabatically tapered can provide effective mode size conversion and favour the coupling of external light sources to photonic integrated circuits.}, language = {en} } @misc{SchenkSchweigerKoch, author = {Schenk, Harald and Schweiger, Severin and Koch, Sandro G.}, title = {Two-Photon-Lithography Substrate Reflection and Absorption Compensation for Additive Manufacturing of Metamaterials on MEMS}, series = {2021 44th International Spring Seminar on Electronics Technology (ISSE)}, journal = {2021 44th International Spring Seminar on Electronics Technology (ISSE)}, isbn = {978-1-6654-1477-7}, issn = {2161-2536}, doi = {10.1109/ISSE51996.2021.9467575}, pages = {7}, abstract = {Structuring polymers on micro-electro-mechanical-systems (MEMS) for the manufacturing of acoustical and optical metamaterials using the two-photon polymerization process depends on reliable and controllable regulation of the intensity. Reflecting surfaces, diffracting elements and structures with poor heat dissipation can be problematic obstacles for the incident focused and pulsed laser beam. Thermal and optical simulations were performed and compared to test structures. A compensated fabrication approach was successfully applied to create optimized conditions in the polymerized volume.}, language = {en} } @misc{SchweigerSchulzeSchlipfetal., author = {Schweiger, Severin and Schulze, Tim F. and Schlipf, Simon and Reinig, Peter and Schenk, Harald}, title = {Characterization of two-photon-polymerization lithography structures via Raman spectroscopy and nanoindentation}, series = {Journal of Optical Microsystems}, volume = {Vol. 2}, journal = {Journal of Optical Microsystems}, number = {3}, issn = {2708-5260}, doi = {10.1117/1.jom.2.3.033501}, abstract = {Additive manufacturing using two-photon polymerization (TPP) lithography is increasingly used in industry and research. Parameter sweeps of cuboid structures fabricated using TPP lithography were investigated across the parameters of the laser power and scan speed to find dependent mechanical material properties. The employed photoresists were examined using Raman spectroscopy to find the degree of conversion (DC) of monomer to polymer, and subsequently, micro- or nanoindentation was used to find Young's modulus (E). For the photoresist IP-Dip, the attained DC and E ranged from 20\% to 45\% and 1 to 2.1 GPa, respectively. The results were compared with reports found in the literature. For IP-Q, the attained DC and E ranged from 53\% to 80\% and 0.5 to 1.3 GPa, respectively. The characterized properties of IP-Q manifest as the current state of knowledge of the material.}, language = {en} } @misc{KurthKunathSchenk, author = {Kurth, Eberhard and Kunath, Christian and Schenk, Harald}, title = {Ion-sensitive structure and method for producing the same}, language = {en} } @misc{ConradGaudetSchenketal., author = {Conrad, Holger and Gaudet, Matthieu and Schenk, Harald and Uhlig, Sebastian}, title = {Micromechanical devices with mechanical actuators}, language = {en} } @misc{SchenkConrad, author = {Schenk, Harald and Conrad, Holger}, title = {MEMS transducer for interacting with a volume flow of a fluid, and method for producing the same}, language = {en} } @misc{MonsalveGuaracaoKaiserSchenk, author = {Monsalve Guaracao, Jorge Mario and Kaiser, Bert and Schenk, Harald}, title = {Design of Micromachined Ultrasonic Transducers for Variability with the Sample-Average Approximation Method}, series = {Tagungsband MikroSystemTechnik Kongress 2023, Dresden, 23. - 25. Oktober 2023}, journal = {Tagungsband MikroSystemTechnik Kongress 2023, Dresden, 23. - 25. Oktober 2023}, publisher = {VDE Verlag}, address = {Berlin}, isbn = {978-3-8007-6204-0}, pages = {S. 639}, language = {en} } @misc{VillasmuntaSteglichHeinrichetal., author = {Villasmunta, Francesco and Steglich, Patrick and Heinrich, Friedhelm and Villringer, Claus and Mai, Andreas and Schrader, Sigurd and Schenk, Harald}, title = {Optical Through-Silicon Waveguides for 3D-Chip-Interconnections}, abstract = {Integrated optical interconnections in silicon chips have the potential to replace electrical interconnects between integrated circuits thanks to their high bandwidth and low energy communication promises. A silicon dielectric waveguide can be etched through the full thickness of a silicon substrate providing a monolithically integrated solution for 2.5D and 3D photonic architectures. The optical through-silicon waveguide design presented here is based on Finite Difference Time Domain simulations, while the fabrication takes advantage of the innovative plasma cryo-etching process that provides smooth sidewalls and tapering angle tunability. Such structures can provide effective mode size conversion, therefore favoring the coupling of external light sources to photonic integrated circuits and the stacking of multiple optically interconnected dies.}, language = {en} } @misc{UhligGaudetLangaetal., author = {Uhlig, Sebastian and Gaudet, Matthieu and Langa, Sergiu and Ruffert, Christine and Jongmanns, Marcel and Schenk, Harald}, title = {Highly integrable silicon micropumps using lateral electrostatic bending actuators}, series = {Microsystem Technologies}, volume = {30}, journal = {Microsystem Technologies}, number = {8}, publisher = {Springer Science and Business Media LLC}, issn = {0946-7076}, doi = {10.1007/s00542-024-05635-w}, pages = {949 -- 960}, abstract = {We present the design, fabrication, and characterization of an innovative silicon-based micropump with high potential for portable lab-on-chip (LoC) as well as point-of-care (PoC) applications. The actuators of the pump are electrostatic driven in-plane bending devices, which were presented earlier (Borcia et al. in Phys Rev Fluids 3(8): 084202, 2018. 10.1103/PhysRevFluids.3.084202; Uhlig et al. in Micromachines, 9(4), 2018. 10.3390/mi9040190). This paper presents the characterization results achieved with the micropump. The dielectric non-polar liquid Novec7100™ was used as a test liquid due to its adequate physical properties. When applying a periodic voltage of 130 V, a flow rate of up to 80 µL/min was detected. The counter pressure amounts up to 30 kPa and the correspondent fluidic power (volumetric flow rate times the counter pressure) was calculated to 10 µW. The pump contains passive flap valves at the inlet and outlet, which are based on a bending cantilever design. Depending on the application requirements, the micropump can be designed modularly to adjust the specific parameters by an adequate arrangement of pump base units. In this paper, the proof of principle is shown using a single base unit with different number of stacked NED-actuator beams, as well as the serial arrangement of base units. Both modular concepts target the increase of backpressure of the NED-micropump in an inherently different way compared to conventional membrane micropumps.}, language = {en} } @misc{Schenk, author = {Schenk, Harald}, title = {Silicon integrated electrostatic drives}, series = {International Conference and Exhibition on New Actuator Systems and Applications 2024}, journal = {International Conference and Exhibition on New Actuator Systems and Applications 2024}, doi = {10.24406/publica-3964}, pages = {36}, abstract = {Presentation held at ACTUATOR 2024, International Conference and Exhibition on New Actuator Systems and Applications, June 13 - 14, 2024, Wiesbaden, Germany}, language = {en} }