@inproceedings{HeimFriedrichGuttmannetal., author = {Heim, S. and Friedrich, Daniel and Guttmann, P. and Rehbein, S. and Chumakov, Dmytro and Ritz, Y. and Schneider, G. and Schmeißer, Dieter and Zschech, Ehrenfried}, title = {Dynamical X-ray Microscopy Study of Stress-Induced Voiding in Cu Interconnects}, language = {en} }